25 process integration engineer jobs at 16 companies in Cave Creek, AZ
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Process Integration Engineer
Phoenix, Arizona, United States
OnsiteFull Time
TSMCNew York Stock Exchange: TSM: Manufactures semiconductor chips and integrated circuits for global customers.
Bachelor/Master/PhD in Electrical Engineering, Materials Science or Physics; experience in silicon process flow and cross-functional teams; strong communication; able to work on-site in Phoenix, AZ.
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
0.5+ YOEPhD in a listed engineering, physics, optics, materials science, or related field plus 6+ months in semiconductor fabrication, device characterization, or cleanroom process development.
Advanced Packaging Principal Integration Technologist
Tempe, Arizona, United States
$179k-$288k/yrOnsiteFull Time
Merck KGaA, Darmstadt, GermanyFrankfurt Stock Exchange: MRK: A science and technology in healthcare, life sciences, and electronics.
10+ YOEMSc or higher in engineering, 10+ years of 300mm process/equipment R&D, and 7+ years of collaborative external business development involving SOW, POC, and DOE work.
High Performance Packaging, Advanced Packaging, Wafer Level Packaging, Hybrid Bonding, Fusion bonding, 300mm, Thin Films, CMP, SOW, POC, DOE
Advanced Packaging Principal Integration Technologist
Tempe, Arizona, United States
$179k-$288k/yrOnsiteFull Time
Merck KGaAFrankfurt Stock Exchange: MRK: Develops pharmaceutical, life science, and electronics technologies.
10+ YOEMSc or higher in engineering; 10+ years of hands-on 300mm process/equipment R&D and advanced packaging experience; 7+ years of external business development involving SOW, POC, and DOE work.
San Francisco or Princeton or San Diego or Scottsdale or Denver or Houston or Phoenix
$90k-$100k/yrHybridFull Time
Clearway EnergyNYSE: CWEN: Develops and operates utility-scale renewable energy power plants.
2+ YOEBachelor's in Electrical Engineering, minimum 2 years power systems modeling/transmission planning/grid integration experience, proficiency with PSS®E, TARA, PSLF, Power World, and knowledge of FERC and ISO/RTO interconnection processes.
Senior Manager, Process Engineering - New Inflection Products
Tempe, Arizona, United States
$156k-$215k/yrOnsiteFull Time
Applied MaterialsNASDAQ: AMAT: Manufacturers of equipment for semiconductor and display production.
Expertise in ALD/CVD/plasma/thermal thin‑film processes, leadership of process engineering teams, cross‑functional integration, customer engagement; PhD or MS in related field; 10+ years experience preferred.
Advanced Packaging Principal Integration Technologist
Tempe or United States
$179k-$288k/yrOnsiteFull Time
MerckXETRA: MRK: A science and technology providing healthcare, life science, and electronics solutions.
10+ YOEMSc or higher in engineering, 10+ years 300mm process/equipment R&D experience in advanced packaging, 7+ years external business development experience, consortium engagement preferred, strong equipment/process/integration knowledge and ecosystem network. US work authorization required.
Northrop GrummanNYSE: NOC: Designs and manufactures advanced aerospace and defense systems.
2+ YOEUS citizen able to obtain Secret clearance, 2 years with a BS (or MS alternative), EGSE/ATE design-test-integration experience, electrical engineering proficiency, and secure-environment processes knowledge.
Honeywell InternationalNASDAQ: HON: Designs and manufactures technologies for aerospace, buildings, and industry.
7+ YOEBachelor's degree in aerospace, electrical, systems engineering, or related discipline; 7+ years in requirements-based development and verification; experience with aircraft systems integration and aerospace certification processes.
6+ YOEPhD in engineering or related field, 6+ years post-PhD semiconductor industry experience, expertise in epitaxy/thin film processes, semiconductor process integration, strong problem-solving and communication, fluent Korean and English, willingness to travel.
ViasatNASDAQ: VSAT: Provides global satellite broadband and secure networking communication services.
5+ YOEBachelor's in Electrical Engineering,5–8 years systems/integration & test experience,US citizenship,ability to travel up to 20%,experience with hardware test systems and verification processes.
LabVIEW, Python, MATLAB, InControl, Epic, COSMOS, vector network analyzer, spectrum analyzer, signal generator, power meter, noise figure measurement system
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
10+ YOE10+ years experience in package development for power SiP/module, wafer-level and flip-chip LGA packaging; strong analytical, communication, and process integration skills.
LotusWorks: Provides technical engineering and commissioning for global manufacturing facilities.
3+ YOE3+ years in mechanical commissioning, startup, or systems testing in semiconductor fabs, data centers, or industrial facilities; strong knowledge of process mechanical systems, HVAC, and system integration; ability to read P&IDs and control diagrams; good troubleshooting and documentation skills.
The AIRO GroupNASDAQ: AIRO: Designs and manufactures integrated avionics and aerospace systems.
8+ YOE5+ MgmtBachelor's in engineering required (Master's preferred), 8+ years avionics engineering experience, 5+ years people management, knowledge of avionics architectures, embedded systems, certification processes, systems integration, and verification.
Bechtel: Designs and constructs large-scale industrial and infrastructure projects.
10+ YOEImplement BIM processes, manage CDE/ACC and federated models, perform clash detection and model coordination, integrate 4D/5D and QTO workflows, train teams, and ensure ISO19650 compliance. Requires bachelor's degree and ~10+ years relevant experience.
ACC, Common Data Environment (CDE), BIM, CAD, GIS, 4D/5D, Quantity Take-off (QTO), BIM Execution Plan (BEP), ISO19650