23 process integration engineer jobs at 13 companies in Fountain Hills, AZ
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Intel Process Integration Engineer - (FE)
Hillsboro or Phoenix
$104k-$199k/yrOnsiteFull Time
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
0.5+ YOEPhD in a listed engineering, physics, optics, materials science, or related field plus 6+ months in semiconductor fabrication, device characterization, or cleanroom process development.
Principal Process Engineer / Customer Technologist
Santa Clara or Phoenix or Austin
$172k-$237k/yrOnsiteFull Time
Applied MaterialsNASDAQ: AMAT: Produces equipment and services for chip and display manufacturing.
8+ YOERequires a BS or equivalent experience and 8–15+ years in semiconductor process engineering or technology development, with customer-facing wafer fabrication, process integration, yield improvement, and technology transfer experience.
Design of Experiments (DOE), JMP, Minitab, SPC, Root Cause Analysis, 8D, FMEA, Fishbone
Principal Process Engineer / Customer Technologist
Santa Clara or Austin or Phoenix
$172k-$237k/yrOnsiteFull Time
Applied MaterialsNASDAQ: AMAT: Manufacturers of equipment for semiconductor and display production.
8+ YOE8–15+ years in semiconductor process engineering or technology development, customer-facing wafer fabrication support, process integration, yield improvement, technology transfer, and NPI experience. BS required; MS or PhD preferred.
Design of Experiments (DOE), JMP, Minitab, SPC, Root Cause Analysis, 8D, FMEA, Fishbone
Advanced Packaging Principal Integration Technologist
Tempe, Arizona, United States
$179k-$288k/yrOnsiteFull Time
Merck KGaA, Darmstadt, GermanyFrankfurt Stock Exchange: MRK: A science and technology in healthcare, life sciences, and electronics.
10+ YOEMSc or higher in engineering, 10+ years of 300mm process/equipment R&D, and 7+ years of collaborative external business development involving SOW, POC, and DOE work.
High Performance Packaging, Advanced Packaging, Wafer Level Packaging, Hybrid Bonding, Fusion bonding, 300mm, Thin Films, CMP, SOW, POC, DOE
San Francisco or Princeton or San Diego or Scottsdale or Denver or Houston or Phoenix
$90k-$100k/yrHybridFull Time
Clearway EnergyNYSE: CWEN: Develops and operates utility-scale renewable energy power plants.
2+ YOEBachelor's in Electrical Engineering, minimum 2 years power systems modeling/transmission planning/grid integration experience, proficiency with PSS®E, TARA, PSLF, Power World, and knowledge of FERC and ISO/RTO interconnection processes.
Advanced Packaging Principal Integration Technologist
Tempe or United States
$179k-$288k/yrOnsiteFull Time
MerckXETRA: MRK: A science and technology providing healthcare, life science, and electronics solutions.
10+ YOEMSc or higher in engineering, 10+ years 300mm process/equipment R&D experience in advanced packaging, 7+ years external business development experience, consortium engagement preferred, strong equipment/process/integration knowledge and ecosystem network. US work authorization required.
Northrop GrummanNYSE: NOC: Designs and manufactures advanced aerospace and defense systems.
2+ YOEUS citizen able to obtain Secret clearance, 2 years with a BS (or MS alternative), EGSE/ATE design-test-integration experience, electrical engineering proficiency, and secure-environment processes knowledge.
Honeywell InternationalNASDAQ: HON: Designs and manufactures technologies for aerospace, buildings, and industry.
7+ YOEBachelor's degree in aerospace, electrical, systems engineering, or related discipline; 7+ years in requirements-based development and verification; experience with aircraft systems integration and aerospace certification processes.
6+ YOEPhD in engineering or related field, 6+ years post-PhD semiconductor industry experience, expertise in epitaxy/thin film processes, semiconductor process integration, strong problem-solving and communication, fluent Korean and English, willingness to travel.
ViasatNASDAQ: VSAT: Provides global satellite broadband and secure networking communication services.
5+ YOEBachelor's in Electrical Engineering,5–8 years systems/integration & test experience,US citizenship,ability to travel up to 20%,experience with hardware test systems and verification processes.
LabVIEW, Python, MATLAB, InControl, Epic, COSMOS, vector network analyzer, spectrum analyzer, signal generator, power meter, noise figure measurement system
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
10+ YOE10+ years experience in package development for power SiP/module, wafer-level and flip-chip LGA packaging; strong analytical, communication, and process integration skills.
LotusWorks: Provides technical engineering and commissioning for global manufacturing facilities.
3+ YOE3+ years in mechanical commissioning, startup, or systems testing in semiconductor fabs, data centers, or industrial facilities; strong knowledge of process mechanical systems, HVAC, and system integration; ability to read P&IDs and control diagrams; good troubleshooting and documentation skills.
The AIRO GroupNASDAQ: AIRO: Designs and manufactures integrated avionics and aerospace systems.
8+ YOE5+ MgmtBachelor's in engineering required (Master's preferred), 8+ years avionics engineering experience, 5+ years people management, knowledge of avionics architectures, embedded systems, certification processes, systems integration, and verification.