23 process integration engineer jobs at 13 companies in Fountain Hills, AZ

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Intel Process Integration Engineer - (FE)
Hillsboro or Phoenix
$104k-$199k/yr OnsiteFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
0.5+ YOEPhD in a listed engineering, physics, optics, materials science, or related field plus 6+ months in semiconductor fabrication, device characterization, or cleanroom process development.
JMP, MATLAB, Python, JSL, TCL, SQL, C, C++, SPC, DOE, FMEA, Cpk, Ppk, Control charts, Capability analysis, SOPs, ALD, PE CVD
1d
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Principal Process Engineer / Customer Technologist
Santa Clara or Phoenix or Austin
$172k-$237k/yr OnsiteFull Time
Applied Materials
Applied MaterialsNASDAQ: AMAT: Produces equipment and services for chip and display manufacturing.
8+ YOERequires a BS or equivalent experience and 8–15+ years in semiconductor process engineering or technology development, with customer-facing wafer fabrication, process integration, yield improvement, and technology transfer experience.
Design of Experiments (DOE), JMP, Minitab, SPC, Root Cause Analysis, 8D, FMEA, Fishbone
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Principal Process Engineer / Customer Technologist
Santa Clara or Austin or Phoenix
$172k-$237k/yr OnsiteFull Time
Applied Materials
Applied MaterialsNASDAQ: AMAT: Manufacturers of equipment for semiconductor and display production.
8+ YOE8–15+ years in semiconductor process engineering or technology development, customer-facing wafer fabrication support, process integration, yield improvement, technology transfer, and NPI experience. BS required; MS or PhD preferred.
Design of Experiments (DOE), JMP, Minitab, SPC, Root Cause Analysis, 8D, FMEA, Fishbone
2mo
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Advanced Process Chemical SCADA Engineer (TSMC Project)
Phoenix, Arizona, United States
FieldFull Time
Marketech International
Marketech InternationalTaiwan Stock Exchange: 6196: Provides turnkey facility integration and engineering for semiconductor plants.
Hands-on SCADA/DCS experience (Emerson DeltaV preferred), PLC integration and Ladder Logic/Function Block knowledge, Modbus/OPC communication, P&ID interpretation, commissioning, historian/INSQL, HMI design, and troubleshooting in industrial/chemical/semiconductor environments.
Emerson DeltaV, PLC, Ladder Logic, Function Block, Modbus, OPC, INSQL, EIOC
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Advanced Packaging Principal Integration Technologist
Tempe, Arizona, United States
$179k-$288k/yr OnsiteFull Time
Merck KGaA, Darmstadt, Germany
Merck KGaA, Darmstadt, GermanyFrankfurt Stock Exchange: MRK: A science and technology in healthcare, life sciences, and electronics.
10+ YOEMSc or higher in engineering, 10+ years of 300mm process/equipment R&D, and 7+ years of collaborative external business development involving SOW, POC, and DOE work.
High Performance Packaging, Advanced Packaging, Wafer Level Packaging, Hybrid Bonding, Fusion bonding, 300mm, Thin Films, CMP, SOW, POC, DOE
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Analyst, Resource Planning & Grid Integration
San Francisco or Princeton or San Diego or Scottsdale or Denver or Houston or Phoenix
$90k-$100k/yr HybridFull Time
Clearway Energy
Clearway EnergyNYSE: CWEN: Develops and operates utility-scale renewable energy power plants.
2+ YOEBachelor's in Electrical Engineering, minimum 2 years power systems modeling/transmission planning/grid integration experience, proficiency with PSS®E, TARA, PSLF, Power World, and knowledge of FERC and ISO/RTO interconnection processes.
PSS®E, TARA, PSLF, Power World
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Advanced Packaging Principal Integration Technologist
Tempe or United States
$179k-$288k/yr OnsiteFull Time
Merck
MerckXETRA: MRK: A science and technology providing healthcare, life science, and electronics solutions.
10+ YOEMSc or higher in engineering, 10+ years 300mm process/equipment R&D experience in advanced packaging, 7+ years external business development experience, consortium engagement preferred, strong equipment/process/integration knowledge and ecosystem network. US work authorization required.
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Software Engineer - Avionics RF Design and Integration
Seattle or Deer Valley
$80k-$174k/yr HybridFull Time
Capgemini
CapgeminiEuronext Paris: CAP: Provides global IT consulting and digital transformation services.
Experience in safety-critical avionics software, DO-178C practices, embedded C/C++ development, RFIO and signal processing, DOORS, Python, JIRA/Bitbucket, and flight test/integration support.
C++, C, Python, DOORS, DO-178C, JIRA, Bitbucket
3w
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Electrical Engineer 2 – EGSE
Chandler, Arizona, United States
$79k-$119k/yr OnsiteFull Time
Northrop Grumman
Northrop GrummanNYSE: NOC: Designs and manufactures advanced aerospace and defense systems.
2+ YOEUS citizen able to obtain Secret clearance, 2 years with a BS (or MS alternative), EGSE/ATE design-test-integration experience, electrical engineering proficiency, and secure-environment processes knowledge.
LabVIEW, TestStand, NI hardware, Windows, RHEL, Linux, oscilloscopes, DMMs, electronic loads
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Lead Aircraft Systems Engineer
Phoenix, Arizona, United States
HybridFull Time
Honeywell International
Honeywell InternationalNASDAQ: HON: Designs and manufactures technologies for aerospace, buildings, and industry.
7+ YOEBachelor's degree in aerospace, electrical, systems engineering, or related discipline; 7+ years in requirements-based development and verification; experience with aircraft systems integration and aerospace certification processes.
ARP4754A, DO-178C
1mo
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Senior Engineer II, Key Account Technology
Phoenix or Hwaseong
OnsiteFull Time
ASM
ASMEuronext Amsterdam: ASM: Designs and manufactures advanced semiconductor wafer processing equipment.
6+ YOEPhD in engineering or related field, 6+ years post-PhD semiconductor industry experience, expertise in epitaxy/thin film processes, semiconductor process integration, strong problem-solving and communication, fluent Korean and English, willingness to travel.
3mo
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Systems AI&T - Satellite Payload STE Engineer
Tempe, Arizona, United States
$121k-$190k/yr OnsiteFull Time
Viasat
ViasatNASDAQ: VSAT: Provides global satellite broadband and secure networking communication services.
5+ YOEBachelor's in Electrical Engineering,5–8 years systems/integration & test experience,US citizenship,ability to travel up to 20%,experience with hardware test systems and verification processes.
LabVIEW, Python, MATLAB, InControl, Epic, COSMOS, vector network analyzer, spectrum analyzer, signal generator, power meter, noise figure measurement system
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Sr Staff Package Design Engineer
Tempe, Arizona, United States
OnsiteFull Time
Renesas Electronics
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
10+ YOE10+ years experience in package development for power SiP/module, wafer-level and flip-chip LGA packaging; strong analytical, communication, and process integration skills.
3mo
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Mechanical Commissioning Engineer
Chandler, Arizona, United States
OnsiteFull Time
LotusWorks
LotusWorks: Provides technical engineering and commissioning for global manufacturing facilities.
3+ YOE3+ years in mechanical commissioning, startup, or systems testing in semiconductor fabs, data centers, or industrial facilities; strong knowledge of process mechanical systems, HVAC, and system integration; ability to read P&IDs and control diagrams; good troubleshooting and documentation skills.
P&IDs, isometrics, control diagrams, BIM models
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Director of Engineering – Advanced Avionics
Phoenix, Arizona, United States
OnsiteFull Time
The AIRO Group
The AIRO GroupNASDAQ: AIRO: Designs and manufactures integrated avionics and aerospace systems.
8+ YOE5+ MgmtBachelor's in engineering required (Master's preferred), 8+ years avionics engineering experience, 5+ years people management, knowledge of avionics architectures, embedded systems, certification processes, systems integration, and verification.
DO-178C, DO-254, ARP4754A