SanminaNASDAQ: SANM: Designs and manufactures complex electronics and mechanical systems.
0+ YOEBS in Engineering; 0-2 years in technician/engineering; DOE, CTQ, process optimization; IPC knowledge; floor-level collaboration; software/tools familiarity.
Process engineering software, Process simulation tools, IPC standards
Lumilens: Designs photonic interconnects for AI supercomputing infrastructure.
Senior semiconductor process engineer with hands-on III-V etch/coating experience, DOE and statistical process optimization, metrology definition (SEM, profilometry, ellipsometry), tooling evaluation, and cross-functional collaboration.
Honeywell InternationalNASDAQ: HON: Designs and manufactures technologies for aerospace, buildings, and industry.
5+ YOEBS in engineering, 5+ years manufacturing experience, hands-on process improvement using DOE/statistics, ability to train operators and obtain security clearance.
Design of Experiments (DOE), pick and place machines, epoxy dispensers, wire bonding machines, PWB surface mount processes, automation equipment
Certified Group: Provides laboratory testing, regulatory consulting, and certification services.
3+ YOEBachelor's degree in a relevant science or engineering field, 3+ years' experience in thermal/process validation or food processing, knowledge of FDA regulations and process validation, strong analytical and communication skills.
Kraft HeinzNASDAQ: KHC: Manufacturer and global marketer of food and beverage products.
1+ YOELead process end-to-end in a food manufacturing plant, define KPIs, manage documentation, drive continuous improvement, support food safety, perform RCFA, and lift up to 50 lbs.
GraingerNYSE: GWW: Distributes maintenance, repair, and operating supplies to businesses.
5+ YOEBachelor's in operations/engineering or STEM required, 5+ years process engineering, Lean/Six Sigma experience, CAD/Visio/Smartsheet/Microsoft Office proficiency, SQL/Python/Java/Scala preferred, up to 75% travel, onsite 3 days/week.
CAD, Visio, Smartsheet, Microsoft Office Suite, SQL, Python, Java, Scala
R&D Process Engineer, Advanced Bonding Process Development
San Jose or California
$125k-$145k/yrOnsiteFull Time
Diamond Foundry: Produces sustainable diamond wafers for semiconductors and jewelry.
Bachelor's degree in materials science, electrical or chemical engineering (or advanced degree), experience in semiconductor packaging or process engineering preferred, familiarity with bonding, thin-film deposition, surface preparation, metrology, failure analysis, reliability testing, strong problem-solving and communication skills.
VeecoNasdaq: VECO: Manufactures precision processing systems for semiconductor and electronics production
3+ YOEDegree in physics/materials or related; 3+ years process development experience with vacuum thin film and thin film characterization techniques; ability to travel up to 25%.
XylemNYSE: XYL: Manufacturer of water transport, treatment, and testing technologies.
High school diploma/GED, English literacy, site-specific safety training, ability to operate and monitor chemical feed/recovery systems, perform QC, maintenance, and basic data entry; forklift and prior manufacturing experience preferred.
AnritsuTokyo Stock Exchange: 6754: Global provider of communications test and measurement solutions
Maintain, repair, and develop processes for assembly manufacturing equipment; strong mechanical aptitude, mill and lathe experience, able to lift 50 lbs, excellent communication and problem-solving skills.
Branson, bond pull tester, bobbin winder, mills, lathes, Thermo-Shock
USIShanghai Stock Exchange: 601231: Electronic design, manufacturing, and miniaturization services for global brands.
4+ YOEBachelor's in engineering (or equivalent), 4+ years related experience, PCBA/SMT/PTH process knowledge, NPI and equipment validation experience, familiarity with IPC-A-610, ERP/MES, SPC, and corrective action methods (8D/RCA/FMEA).
PayPalNASDAQ: PYPL: Global digital payments platform for consumers and merchants.
5+ YOE5+ years relevant experience and bachelor’s degree or equivalent; program/process/finance operations experience; strong analytical, problem-solving, and communication skills; cross-functional collaboration; familiarity with JIRA and Confluence.
Align TechnologyNASDAQ: ALGN: Designs and manufactures clear aligners and intraoral scanners.
2+ YOEHigh school diploma; 2-4 years SLA/ Resin 3D printing tech; chemical handling; post-processing; metrology; teamwork; lift up to 10 lbs; occasional overtime; travel up to 30%.
SLA printer, photopolymers, metrology instruments, micrometers, calipers, Microsoft Office
PsiQuantum: Builds fault-tolerant quantum computers using silicon photonics technology.
7+ YOE2+ MgmtBachelor's (or Master’s) in optical/physics/photonics/EE/ME/materials, 7+ years in optical manufacturing or process engineering, 2+ years people management, expertise in SPC/DOE/FMEA, Lean/Six Sigma, process validation, metrology, and engineering data analysis.
Commonwealth Fusion Systems: Designing and building commercial fusion energy power plants.
10+ YOE5+ MgmtMS in technical field or equivalent, 10+ years process engineering in thin film R&D/manufacturing, 5+ years managing engineers/technicians, expertise in vacuum processes and inorganic materials science, DOE experience, materials analysis, ability to lift 50 lbs.
laboratory information management systems, JMP, optical microscopy, electron microscopy, surface probe measurements, x-ray measurements, optical probes, NIR probes, transport measurements
Headway Technologies: Designs and manufactures magnetic recording heads for hard disk drives
2+ YOEAssociates degree in Electronics or Industrial Technology; 2 years semiconductor experience; knowledge of semiconductor processes; proficient in MS Office.
FIB, SPC, Microsoft Office, Focused Ion Beam Microscope
Foxconn AssemblyTaiwan Stock Exchange: 2317: Assembles electronics and computer hardware for global technology brands.
3+ YOEBachelor's degree in engineering; 3+ years SMT process engineering; hands-on SMT production support; knowledge of IPC standards; DOE; root-cause analysis.
Pick-and-place systems, Screen printers, Reflow ovens, AOI/SPI, DOE, PFMEA, IPC standards, Microsoft Excel, PowerPoint, Word, CAD/CAM, MES/SFC, X-ray