274 semiconductor engineer jobs at 50 companies in Clackamas, OR
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Semiconductor Device Modeling Engineer
Santa Clara or Phoenix or Hillsboro
$150k-$285k/yr HybridFull Time
3+ YOEMaster's with 3+ years (or PhD with industry/research experience) in electrical engineering or related; hands-on Python/C/Shell; semiconductor device physics, process, layout, and circuit simulation experience.
Python, C, Shell, BSIM, ICCAP, MBP, HSPICE, SPECTRE, Cadence, Virtuoso
1w
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Semiconductor Design Engineer (Compute Test, Oregon)
Tualatin, Oregon, United States
$155k-$248k/yr OnsiteFull Time
10+ YOEBachelor's degree in electrical engineering or related field, 10+ years hardware development, digital logic and FPGA design expertise, Verilog and scripting skills, and experience with high-speed systems and cross-functional teams.
Verilog, Python, TCL, PERL, Xilinx, Intel FPGAs, SystemVerilog, UVM, VHDL, C, C++, Windows, Linux, Cadence Xcelium, Synopsys SpyGlass CDC/LINT, Xilinx Vivado, Intel Quartus, ClearCase, Git, SVN, JIRA, PCIe, AXI, DDRx, SERDES, USB, I2C, SPI, 10/100GE, PLL, HBM, DLL, ADC, DAC, MIPI, DisplayPort, PRBS
3mo
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Semiconductor Market Sector Sales Engineer
Fremont or Livermore or Tualatin
$83k-$130k/yr OnsiteFull Time
5+ YOEFive to seven years in designing, specifying, quoting, selling, and consulting in the semiconductor market; BS in mechanical or electrical engineering; travel up to 50%.
CRM, Engineering drawing reading
2mo
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Senior Electrical Engineer - Semiconductor Facilities
Hillsboro, Oregon, United States
$120k-$160k/yr OnsiteFull Time
10+ YOEBachelor's in Electrical Engineering, active PE license, 10+ years electrical engineering experience (semiconductor/high-tech preferred), proficiency with SKM/ETAP/EasyPower and Revit/BIM, strong code knowledge and leadership experience.
SKM PowerTools, ETAP, EasyPower, Revit, AutoCAD, Navisworks, Bluebeam
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Applications & Technical Support Engineer I (Semiconductor) (32367)
Hillsboro, Oregon, United States
OnsiteFull Time
1+ YOEBachelor's in engineering (chemical/physics preferred) or equivalent, 1–4 years' experience (semiconductor preferred), ability to lift 35 lbs, MS Office proficiency, presentation and communication skills, program management and field service support.
Microsoft Excel, Microsoft Word, Microsoft Outlook, Microsoft PowerPoint
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Field Service Engineer I (Semiconductor)
Hillsboro, Oregon, United States
OnsiteFull Time
4+ YOEBachelor's or 4+ years in electronics/engineering with hands-on experience installing and repairing complex tools; strong English communication; valid passport and driver’s license.
SEM, TEM, FIB, MS DOS, Windows
1mo
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Integration Engineer
Beaverton, Oregon, United States
$75k-$103k/yr OnsiteFull Time
0+ YOEBS/MS in Electrical Engineering or related, semiconductor device background, 0–3 years cleanroom experience, understanding of CMOS/BJT devices, strong communication, knowledge of common semiconductor processes.
SEM, TEM, EDX, Photolithography, Plasma etch, Plasma Enhanced Chemical Vapor Deposition (PECVD), Epitaxial growth, Furnace oxidation, Low Pressure Chemical Vapor Deposition (LPCVD), Implant, Chemical Mechanical Polish (CMP), Wet chemical etch, Physical Vapor Deposition (PVD), Rapid Thermal Anneal (RTA), Statistical Process Control (SPC)
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Senior Systems Engineer
Hillsboro, Oregon, United States
$102k-$154k/yr OnsiteFull Time
5+ YOEPh.D. in engineering or science with optical physics focus, 5+ years in semiconductor capital equipment engineering, spectroscopic ellipsometry, optomechanics, data analysis, troubleshooting, and prototype laboratory experience.
Python, MATLAB
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Principal Product Engineer
Austin or Redmond or Hillsboro or Mountain View or United States
$143k-$275k/yr HybridFull Time
3+ YOEDoctorate with 3+ years, master's with 6+ years, bachelor's with 8+ years, or equivalent experience in engineering, computer science, or a related field; semiconductor product and test engineering expertise required.
ATE, Advantest V93K, DFT, DFM, LDOs, Integrated VRs, GPUs, CPUs
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Structural Engineer
Scottsdale or Austin or Hillsboro
$80k-$110k/yr OnsiteFull Time
5+ YOEABET bachelor's in civil/structural engineering, active or soon-to-be PE in AZ, 5+ years structural experience for semiconductor/cleanroom projects, Revit and Autodesk Construction Cloud proficiency.
Revit, Autodesk Construction Cloud, vibe-coding platforms, AI Large Language Models
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Device Engineer
Vancouver or Camas
$85k-$130k/yr OnsiteFull Time
3+ YOERequires an MS and over 3 years of experience or a Ph.D. in engineering, plus semiconductor physics, diode laser design, wafer fabrication, data analysis, and cross-functional communication skills.
Python, SQL, MATLAB, C, SPC, DOE, Gauge R&R, MSA, BOMs
2w
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Process Engineer 5
Tualatin, Oregon, United States
OnsiteFull Time
8+ YOEMaster's degree in materials science, chemical engineering, chemistry, physics, or related field plus 8+ years' experience; or PhD plus 5+ years. Requires process engineering, semiconductor, statistical, and scientific computing expertise.
MATLAB, Python, JMP, Minitab, Statistical Process Control (SPC), Design of Experiments (DOE), Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD), Plasma Enhanced Chemical Vapor Deposition (PECVD), Physical Vapor Deposition (PVD), Plasma Physics, Reactive Ion Etching (RIE), Atomic Layer Etching (ALE), Inductively Coupled Plasma (ICP), Capacitively Coupled Plasma (CCP)
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Equipment Engineer-CMP
Camas, Washington, United States
$87k-$116k/yr OnsiteFull Time
8+ YOEBachelor’s degree in mechanical or electrical engineering or related technical discipline, or 8+ years of CMP semiconductor experience; strong troubleshooting, problem-solving, communication, and teamwork skills.
RTM, SPC, Parts Tracking System
2w
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Process Engineer 5
Tualatin, Oregon, United States
OnsiteFull Time
8+ YOEMaster's with 8+ years in materials science, chemical engineering, chemistry, physics, or related field; or PhD with 5+ years. Requires semiconductor process expertise and scientific computing skills.
MATLAB, Python, JMP, Minitab, Statistical Process Control (SPC), Design of Experiments (DOE), Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD), Plasma Enhanced Chemical Vapor Deposition (PECVD), Physical Vapor Deposition (PVD), Reactive Ion Etching (RIE), Atomic Layer Etching (ALE), Inductively Coupled Plasma (ICP), Capacitively Coupled Plasma (CCP)
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Process Support Engineer IV
Hillsboro, Oregon, United States
$128k-$176k/yr OnsiteFull Time
5+ YOEMinimum 5 years in semiconductor capital equipment or similar; Bachelor's degree in STEM; 3+ years in Applications or Process Engineering preferred.
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R&D Engineer III
Hillsboro or Carrollton
OnsiteFull Time
4+ YOEBachelor's in engineering or related field, 4+ years development/process engineering experience, DOE/SPC expertise, cleanroom and semiconductor process knowledge, strong technical writing and presentation skills.
1mo
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Field Service Engineer
Hillsboro, Oregon, United States
$70k-$94k/yr FieldFull Time
5+ YOEBachelor in engineering or related field, 5+ years field/technical service experience, semiconductor/cleanroom knowledge, customer-facing communication, system integration and debug skills.
Microsoft Word, Microsoft Excel, Microsoft Outlook, Microsoft PowerPoint
4d
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Process Integration Engineer
Hillsboro, Oregon, United States
$95k-$140k/yr OnsiteFull Time
3+ YOEMaster's or PhD in electrical or related engineering, 3+ years in development, and knowledge of semiconductor process technology, wafer fabrication, device physics, integration, DOE, failure analysis, and characterization.
MOSFET, IGBT, TVS, DOE, Process Control Document (PCD), NPI
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Principal Applications Engineer (SiPh)
Beaverton, Oregon, United States
$94k-$123k/yr OnsiteFull Time
5+ YOERecognized technical expert in silicon photonics and semiconductor test; 5+ years related experience (with bachelor) or equivalent advanced degree; customer-facing applications engineering and test validation experience.
2mo
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Senior Engineer, Field Process
Hillsboro or Austin
FieldFull Time
4+ YOERequires an MS and 4 years or PhD and no experience in materials science, chemical engineering, or physics, plus thin-film processing, DOE, troubleshooting, semiconductor, communication, and travel experience.
ALD, PEALD, PECVD, Epitaxy, LPCVD, vacuum technology, plasma systems, robotics, chemical delivery, sensors, control software, New Product Introduction (NPI), High-Volume Manufacturing (HVM), Design of Experiments (DOE), FMEA, Ishikawa, 7-step
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