ArmNASDAQ: ARM: Designs and licenses processor architectures and semiconductor intellectual property.
10+ YOEArchitect scalable SoCs across market segments; deep expertise in compute, power, interconnect, caching, memory, packaging, and performance/power modeling; Bachelor's or Master's in EE/CE and 10 years senior semiconductor experience.
MediaTekTaiwan Stock Exchange: 2454: Designs and develops system-on-chip solutions for electronic devices.
10+ YOE10+ years SoC/compute architecture experience, 3+ years in datacenter/server SoCs; Bachelor’s degree in EE/CE/CS; expertise in CPU/memory/Interconnect, PCIe/CXL, and performance modeling.
QualcommNASDAQ: QCOM: Designs and manufactures semiconductors and wireless telecommunications products.
6+ YOEBachelor's in EE/CS (Master's/PhD highly desired) with relevant systems engineering experience (6+ years minimum depending on degree); deep SoC/IP or micro-architecture experience; strong modeling and programming skills (C++, Python).
AmbiqNYSE: AMBQ: Develops energy-efficient semiconductors for edge AI devices.
8+ YOEBachelors in EE/CE (or higher),8+ years ASIC/SoC RTL design,strong Verilog/SystemVerilog skills,ARM/AMBA experience,front-end ASIC flow knowledge,experience with tapeout/silicon bring-up,and US work authorization.
AppleNASDAQ: AAPL: Designs and sells consumer electronics, software, and online services.
Experience with SoC architecture, on-chip interconnects and memory Quality-of-Service; working with hardware and software engineering teams to define platform architecture.
Staff Mixed-Signal SOC Engineer – Infrastructure Power
Austin, Texas, United States
HybridFull Time
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
7+ YOEMSEE or equivalent, 7+ years mixed-signal SoC experience with tapeout-to-production history; deep expertise in analog, digital, verification or system architecture; automated test and silicon validation experience; mentoring ability.
Samsung ElectronicsKorea Exchange: 005930: Develops and manufactures consumer electronics, semiconductors, and mobile devices.
6+ YOE6+ years in computer engineering/memory subsystems; strong knowledge of memory hierarchies, interfaces (DDR/LPDDR/HBM), controllers, caches; experience with PPA optimization; collaboration with software/hardware teams.
NVIDIANASDAQ: NVDA: Designs graphics processing units and artificial intelligence hardware.
5+ YOEB.S./M.S. in CE/EE or equivalent,5+ years ASIC verification experience with cache coherency and memory subsystems,SystemVerilog/UVM expertise,AMBA protocols (AXI/ACE/CHI),scripting (Python,Perl,TCL),C/C++ proficiency.
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
6+ YOE6+ years ASIC verification experience with fabric/interconnect/NoC, strong SystemVerilog and UVM skills, knowledge of interconnect protocols (AMBA AXI, CHI), scripting (Python, Perl, TCL), and degree in computer/electrical engineering or equivalent experience.
EricssonNasdaq: ERIC: Manufactures telecommunications equipment and provides networking services.
Experience in SoC/IP/SubSystem verification, SystemC/TLM and RTL environments, hardware emulation, knowledge of high-speed interfaces, strong problem-solving and communication;BS required, MS preferred.
Efficient Computer: Developing ultra-low-power general-purpose processors for edge AI computing.
8+ YOEEnd-to-end SOC top ownership including full-chip integration, timing closure, power/PDN analysis, physical verification, SI, clock/reset, DFT, package co-design, and tapeout readiness; advanced degree in EE and extensive PD experience.
SOC Top Level Physical Design Engineer, Annapurna Labs
Cupertino or Austin
$159k-$248k/yrOnsiteFull Time
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
10+ YOEBS + 10 years or MS + 7 years in EE/CS; 5+ years physical verification; experience with backend physical design flows and industry-standard tools.
Silicon LabsNASDAQ: SLAB: Designs and manufactures semiconductors and wireless connectivity solutions.
10+ YOEBS/MS in Electrical Engineering, 10+ years digital CMOS IC design experience, expertise in Verilog/System Verilog, UPF/CPF, AXI/AHB/APB, RTL design, synthesis, timing, power analysis, simulation, scripting (Python/Perl/Tcl), and leading small teams.
Silicon LabsNASDAQ: SLAB: Designs and manufactures wireless semiconductors and software for IoT.
10+ YOEBS/MS in EE, 10+ years digital CMOS IC design experience, Verilog/System Verilog expertise, low-power (UPF/CPF) and clocking/CDC/RDC knowledge, AXI/AHB/APB experience, scripting (Python/Perl/Tcl), and leadership of small design teams.
MetaNASDAQ: META: Develops social networking platforms and virtual reality technologies.
6+ YOEBachelor's degree or equivalent,6+ years hardware design experience for production silicon,expertise in microarchitecture,RTL and SoC integration,strong communication and collaboration skills.
Graphcore: Produces specialized processors for artificial intelligence workloads.
Senior-level experience in system validation and debug for server/rack platforms, strong knowledge of Arm or x86, PCIe and CXL, OS/firmware/device driver/BIOS interactions, SoC and memory subsystems, and ability to lead cross-functional debug efforts.