SupermicroNASDAQ: SMCI: Designs and manufactures high-performance server and storage solutions.
1+ YOEBachelor's in Aerospace/Thermal/Mechanical Engineering, 1+ year server/PC industry thermal/mechanical experience, knowledge of thermal management and rack/cluster liquid cooling, strong problem-solving and communication, able to travel for on-site deployments.
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Experience in thermal analysis, modeling, characterization, and validation of electronic systems; proficiency with CFD/thermal simulation tools and scripting for data analysis; strong heat transfer fundamentals; Master's or PhD in relevant engineering.
SpaceX: Designs and launches advanced rockets and satellite internet constellations.
5+ YOESenior thermal engineer with 5+ years in thermal/fluids analysis; Bachelor's in engineering; proficiency with MATLAB; preferred Master’s in engineering; experience with Thermal Desktop/ANSYS, Python.
8+ YOE8+ years in spacecraft or aerospace thermal engineering; expertise in thermal simulation and spacecraft thermal balance; TVAC and unit-level testing; thermal-mechanical interfaces; bachelor's degree or higher in mechanical, aerospace, physics, or related field.
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
4+ YOEPhD in Mechanical Engineering or equivalent experience with 4+ years in thermal/mechanical engineering; expertise with Cadence Celsius Thermal Solver, CFD (Ansys Fluent, Icepak), coupled electro-thermal simulation, ANSYS thermo-mechanical analysis, and Python or MATLAB.
DensityAI: Designing custom AI hardware accelerators for large language models.
5+ YOE5+ years designing thermal systems for advanced compute hardware, with Ansys Icepak or equivalent, 1D flow modeling, liquid cooling, TIM characterization, and thermal testing experience.
NVIDIANASDAQ: NVDA: Designs graphics processing units and artificial intelligence hardware.
4+ YOEPhD or equivalent experience with 4+ years in thermal/mechanical engineering, expertise in heat transfer, electro-thermal simulation, thermo-mechanical stress and reliability; proficiency with Cadence Celsius, Ansys Fluent/Icepak/ANSYS, and Python or MATLAB.
Eight Sleep: Develops smart mattresses and temperature-regulated sleep technology.
3+ YOE3+ years thermal systems engineering experience, BSME (MS/PhD preferred), expertise in thermal/fluid analysis, simulation (IcePak, Fluent), data analysis (Python, MATLAB), CAD (SolidWorks, NX, Creo), manufacturing support in Asia, and willingness to travel ~20% to China.
Lightmatter: Develops photonic processors and interconnects for AI data centers
5+ YOESenior thermal engineer with MS/PhD in engineering and 5+ years in package/system thermal analysis; expertise in conduction, convection, CFD; experience with advanced cooling tech; proficient in ANSYS tools; lab validation.
Samsung SemiconductorKorea Exchange: 005930: Designs and manufactures memory chips, processors, and sensors.
5+ YOEAdvanced degree in mechanical engineering or related physical science with 5–10+ years experience; deep heat transfer, fluid dynamics, and thermal simulation expertise; FloTHERM experience; strong technical communication skills.
Cspeed IO: A stealth startup developing next-generation optical semiconductor solutions for AI infrastructure to replace traditional copper interconnects.
6+ YOEMS or PhD in engineering/physics,6+ years thermal simulation for semiconductor or electronic packages,expertise with commercial thermal/CFD tools,heat-transfer fundamentals,simulation-to-hardware correlation.
Qnity ElectronicsNYSE: Q: Manufactures materials and solutions for the semiconductor industry.
2+ YOEM.S. in mechanical engineering (or related) with minimum 2 years thermal materials/thermal management experience, expertise in TIMs and thermal characterization, thermal modeling proficiency, customer engagement and project leadership, willingness to travel up to 20%.
Anysis, Comsol, SolidWorks, AutoCAD, LFA, DSC, TGA, IR thermotherapy, TIM testers, Phase 12, hot disk
5+ YOEMaster's degree in mechanical engineering required; Ph.D. preferred. Requires 5+ years of thermal design experience using Icepak, FloTHERM, SmartCFD, or similar tools, plus electronic cooling, CFD/FEA, and liquid cooling expertise.
Hyve SolutionsNYSE: SNX: Designs and manufactures custom hardware for hyperscale data centers.
10+ YOEBachelor's in mechanical/thermal engineering, 10+ years thermal design for servers/GPU systems, CFD and liquid/air cooling expertise, lab bring-up and debugging experience.
Etched: Designs specialized AI chips optimized for transformer architectures.
5+ YOEMinimum 5 years in thermal/mechanical engineering focused on direct-to-chip cold plate and water cooling systems; bachelor\u0002s in mechanical/thermal engineering; proficiency with CAD (NX/Creo/CATIA), GD&T, Fluent, thermal simulations, TIM selection, and mechanical design.
MetaNASDAQ: META: Develops social networking platforms and virtual reality technologies.
2+ YOEB.S. in Mechanical Engineering or equivalent; 2+ years thermal design experience; fundamentals in heat transfer; CFD/CAD modeling; empirical testing; programming with MATLAB, Python, or Julia.
AppleNASDAQ: AAPL: Designs and sells consumer electronics, software, and online services.
Thorough understanding of heat and fluid flow, ability to apply engineering principles to complex design problems, communicate technical material clearly, and work in a fast-paced environment.
PsiQuantum: Builds fault-tolerant quantum computers using silicon photonics technology.
5+ YOEM.Sc. or Ph.D. in engineering/physics, 5+ years semiconductor modeling and simulation experience, strong thermal and solid mechanics knowledge, proficiency with ANSYS/COMSOL and lab validation, and experience correlating FEA/CFD with test data.
Cadence Design SystemsNASDAQ: CDNS: Develops computational software and hardware for electronic system design.
BS/MS/PhD in mechanical engineering with 2–7+ years experience; expertise in thermal/mechanical design for data center equipment, CFD thermal analysis, air/liquid cooling, PCB layout, CAD, BOM/ECO processes.