5 xrd jobs at 3 companies in Phoenix, AZ
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Process and Technology Engineer - (E3)
Tempe, Arizona, United States
$108k-$149k/yr OnsiteFull Time
Master's or PhD in Materials Science/Engineering, familiarity with failure analysis (SEM/EDS/XRD), strong problem-solving and documentation skills, ability to work independently in production, willingness to work night shift and provide limited global technical support.
JMP, Microsoft Excel, Minitab, Python, SEM, EDS, XRD, CVD, PVD, ALD, PECVD, SPC, Six Sigma, Lean Manufacturing
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Package Failure Analysis Engineer
Phoenix or Chandler
$85k-$140k/yr OnsiteFull Time
Bachelor's degree in engineering or related field, US citizenship, ability to obtain TS/SCI with polygraph, hands-on electrical fault isolation or defect characterization experience, strong analytical and communication skills.
SEM, TEM, x-ray, optical microscopy, multimeter, TDR, EOTPR, EBAC, RIDR, ELITE, EDX, AFM, FTIR, Raman, XRD, EBSD, CAD, JMP
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Process and Technology Engineer - (E3)
Tempe, Arizona, United States
$108k-$149k/yr OnsiteFull Time
Master’s or PhD in Materials Science and Engineering or related field; strong material properties knowledge; failure analysis experience; excellent problem-solving and communication; able to work independently and in team; willing to work night shift.
SEM, EDS, XRD, JMP, Excel, Minitab, Python, PVD, CVD, ALD, SPC, Lean Manufacturing
2mo
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Snr Process Engineer - Early Career (Fall 2026)
Phoenix, Arizona, United States
OnsiteFull Time
0+ YOEMaster's or PhD in engineering/physics, 0–2 years professional experience (early career), experience with thin film deposition and materials characterization, DOE/RSM skills, hands-on troubleshooting, strong verbal/written communication.
ALD, PEALD, Epitaxy, PECVD, CVD, XPS, SIMS, RBS, AFM, XRR, XRD, TEM, HRTEM, SEM, FESEM, ellipsometry, Auger, Raman, DOE, RSM, Ishikawa diagrams, CFD
1mo
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Package Failure Analysis Engineer
Phoenix or Chandler
$85k-$140k/yr OnsiteFull Time
Bachelor's in relevant engineering or physical science, US citizenship, ability to obtain TS/SCI with polygraph, hands-on electrical fault isolation/defect characterization experience, lab and analytical skills.
SEM, TEM, x-ray, optical microscopy, multimeter, TDR, EOTPR, EBAC, RIDR, ELITE, EDX, AFM, FTIR, Raman, XRD, EBSD, CAD, JMP