TetraMem: Designing in-memory computing chips for edge AI applications.
8+ YOEU.S. citizen with bachelor's in EE/CE/CS, typically 8+ years in applications/embedded/edge AI, strong C/C++, Linux, Python, hardware bring-up, debugging, customer integrations, and technical communication.
ArcherNYSE: ACHR: Develops electric vertical takeoff and landing aircraft for urban mobility.
10+ YOE10+ years Teamcenter PLM architecture and customization experience, hands-on BMIDE/ITK/configuration, API and integration experience, bachelor’s in engineering/CS, strong analytical and communication skills.
Siemens Teamcenter, Bitbucket, Git, Jira, TeamCity, BMIDE, ITK, Workflow Manager, SOAP, REST, Active Workspace, Java, C#, Python, NX, Amazon Web Service
Credo SemiconductorNASDAQ: CRDO: Designing high-speed semiconductor connectivity solutions for data infrastructure.
Proven expertise in high-speed SerDes DSP, communications theory, or related fields; strong Python data analysis; Linux, Git, Docker; signal integrity; PCB reading.
Astera LabsNASDAQ: ALAB: Designs connectivity solutions for cloud and AI infrastructure.
8+ YOEBachelor's in EE/Photonics/Physics,8+ years in high-speed connectivity/optics,deep SerDes and physical-layer expertise,experience with PCIe/UALink/Ethernet,optical integration and customer-facing system bring-up.
COSMOS, CXL, NVLink, PCIe Gen 5, PCIe Gen 6, PCIe Gen 7, UALink
NVIDIANASDAQ: NVDA: Designs graphics processing units and artificial intelligence hardware.
5+ YOEBS/MS in engineering or equivalent experience, 5+ years in system design/datacenter deployment/ODM integration, familiarity with server/rack/GPU/networking/storage/power/firmware/BMC/Linux, strong communication and problem-solving skills.
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
5+ YOE5+ years in system design, datacenter deployment, manufacturing support, or ODM/partner integration; BS/MS in engineering (or equivalent); strong communication, analytical, and project coordination skills; familiarity with server, rack, GPU, networking, firmware, BMC, and Linux debug workflows.
C/C++, Python, Embedded Linux Systems, Linux, BMC, ARM, NVIDIA GPU
TeknovaNASDAQ: TKNO: Provides custom reagents and media for life science research.
5+ YOE5+ years in enterprise application development; NetSuite, Salesforce, Magento, MasterControl; API integration; Power BI; on-call support; mentoring.
Senior Systems Engineer – Laser Integration & Applications (Advanced Substrates)
Austin or Santa Clara
$120k-$165k/yrOnsiteFull Time
Applied MaterialsNASDAQ: AMAT: Produces equipment and services for chip and display manufacturing.
7+ YOEBachelor's in a relevant technical field, 7+ years experience in laser applications and system integration for automated precision manufacturing, hands-on integration of commercial laser systems, laser–material interaction expertise, troubleshooting and system optimization skills.
Senior Systems Engineer – Laser Integration & Applications (Advanced Substrates)
Austin or Santa Clara
$120k-$165k/yrOnsiteFull Time
Applied MaterialsNASDAQ: AMAT: Manufacturers of equipment for semiconductor and display production.
7+ YOEBachelor's in a relevant technical field, 7+ years experience in laser applications and system integration with automated precision manufacturing equipment, strong troubleshooting and laser–material interaction knowledge.
Signal and Power Integrity Senior Application Engineer
San Jose, California, United States
$84k-$156k/yrOnsiteFull Time
Cadence Design SystemsNASDAQ: CDNS: Develops computational software and hardware for electronic system design.
1+ YOEBachelor's or Master's in Electrical/Electronics Engineering, 1+ years related experience, strong background in signal, power, and electromagnetics for package and PCB design, excellent communication and presentation skills.
Micron TechnologyNASDAQ: MU: Manufacturer of semiconductor memory and data storage products.
5+ YOEBachelor's in EE/CE/CS or related plus 5 years applications-engineering experience; experience with memory/storage (HDD/SSD), datacenter systems, system integration, DRAM exposure, lab testing, troubleshooting, and customer-facing support.
AmphenolNYSE: APH: Designs and manufactures electrical connectors and interconnect systems.
5+ YOEBachelor's degree in EE/CE or related, 5+ years application/validation/field engineering experience with high-speed interconnects, hands-on lab and customer debug experience, knowledge of signal integrity, retimer/redriver architectures, and system-level qualification.
AppleNASDAQ: AAPL: Designs and sells consumer electronics, software, and online services.
Strong electrical background; develop and scale electrical simulation tools and workflows; validate and support simulation applications; experience with AI/ML applied to signal integrity, power integrity, EMI/EMC, magnetics, or electromagnetic simulation.
Micron TechnologyNASDAQ: MU: Designs and manufactures semiconductor memory and data storage solutions.
2+ YOEBachelor's degree in electrical engineering (or related), 2+ years storage/HDD/SSD experience, datacenter systems and troubleshooting, hands-on storage integration (SATA, NVMe, CXL) and Linux experience, strong communication.
Hewlett Packard EnterpriseNYSE: HPE: Provides global edge-to-cloud technology solutions and IT infrastructure services.
5+ YOE5+ years Java/Python backend development, 5+ years designing REST APIs/microservices, 2+ years building or integrating AI/LLM applications, experience with SQL/NoSQL and cloud platforms, familiarity with JavaScript/React/Node.js, BS in a technical discipline.
Hewlett Packard EnterpriseNYSE: HPE: Provides edge-to-cloud IT infrastructure and platform services.
5+ YOE5+ years backend development with Java and/or Python, 5+ years designing REST APIs and microservices, 2+ years building or integrating AI/LLM applications, experience with SQL/NoSQL and cloud platforms, Bachelor’s required.