IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
Bachelor's in relevant engineering or physical science, US citizenship, ability to obtain TS/SCI with polygraph, hands-on electrical fault isolation/defect characterization experience, lab and analytical skills.
SEM, TEM, x-ray, optical microscopy, multimeter, TDR, EOTPR, EBAC, RIDR, ELITE, EDX, AFM, FTIR, Raman, XRD, EBSD, CAD, JMP
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
Bachelor's degree in engineering or related field, US citizenship, ability to obtain TS/SCI with polygraph, hands-on electrical fault isolation or defect characterization experience, strong analytical and communication skills.
SEM, TEM, x-ray, optical microscopy, multimeter, TDR, EOTPR, EBAC, RIDR, ELITE, EDX, AFM, FTIR, Raman, XRD, EBSD, CAD, JMP
Failure Analysis Technician F21 (Phoenix, AZ, US, 85083)
Phoenix, Arizona, United States
OnsiteFull Time
TSMCNew York Stock Exchange: TSM: Manufactures advanced semiconductor integrated circuits for global technology companies.
Associate or Bachelor in science/engineering; TEM sample prep and semiconductor analysis experience preferred; safety PPE; on-call nights/weekends; basic PC skills.
Northrop GrummanNYSE: NOC: Designs and manufactures advanced aerospace and defense systems.
5+ YOEBS in Electrical Engineering and 5+ years experience (or MS with 3+ years), U.S. citizenship, current Secret clearance, BLS not required; experience with design, test, integration, failure analysis, and mentoring.
RalliantNew York Stock Exchange: RAL: Sells precision instruments and sensors for diverse industrial sectors.
6+ YOEBachelor's in mechanical engineering, 6+ years mechanical product development, DOE and FEA experience, ability to interpret customer specs, GD&T/DFMEA/DFMA knowledge, qualification testing and failure analysis experience; U.S. citizenship required.
PowerLattice: Develops power delivery chiplets for high-performance AI processors.
8+ YOEMS/PhD preferred in EE/Materials/Mechanical, 8+ years semiconductor packaging experience (2.5D/3D, chiplets, substrate integration), DoE and statistical analysis experience, failure analysis and solder/interconnect expertise.
Applied MaterialsNASDAQ: AMAT: Produces equipment and services for chip and display manufacturing.
Master’s or PhD in Materials Science and Engineering or related field; strong material properties knowledge; failure analysis experience; excellent problem-solving and communication; able to work independently and in team; willing to work night shift.
Applied MaterialsNASDAQ: AMAT: Manufacturers of equipment for semiconductor and display production.
Master's or PhD in Materials Science/Engineering, familiarity with failure analysis (SEM/EDS/XRD), strong problem-solving and documentation skills, ability to work independently in production, willingness to work night shift and provide limited global technical support.
JMP, Microsoft Excel, Minitab, Python, SEM, EDS, XRD, CVD, PVD, ALD, PECVD, SPC, Six Sigma, Lean Manufacturing
Aligned Data Centers: Provides scalable data center infrastructure and colocation services.
10+ YOE10+ years mechanical experience (or advanced degree + 6+ years) in hyperscale data center infrastructure; expert knowledge of cooling systems, chiller plants, thermodynamics, strong failure analysis and leadership skills.
MediaTekTaiwan Stock Exchange: 2454: Designs and develops system-on-chip solutions for electronic devices.
8+ YOE8+ years in package development and NPI for semiconductors; expertise in advanced packaging (EMIB, 2.5D/3D/3.5D, FCBGA, HBM); qualification, reliability, failure analysis, yield improvement, and cross-functional project management.
8+ YOE8+ years evaluating aerospace materials (composites/plastics), experience with ASTM/ISO test methods, test plan/report authoring, failure analysis, CAD (Catia), and supervisory/mentorship experience.
Catia, Jira, Confluence, FTIR, SEM, Mass Spectrometer, DSC
VAST Data: Enterprise AI infrastructure and unified data platform.
7+ YOEBachelor's in engineering, 7+ years quality engineering experience in enterprise hardware/manufacturing/storage, supplier/manufacturing/field quality expertise, experience with failure analysis and RCCA/SCAR, strong analytics, documentation, and reporting skills.
onsemi: Designs and manufactures semiconductor solutions for power and sensing.
PhD or MS with 3-5 years experience; strong physics of failure; chip-package interactions; reliability testing; power semiconductors; data analysis and reporting.
Power BI, Python, Oracle, SQL, JMP, Minitab, MS Office, FMEA, 8D
Parker HannifinNYSE: PH: Manufacturer of motion and control technologies and systems.
2+ YOEGED/HS diploma, 2 years related experience, blueprint reading and CMM familiarization, inspection and machining experience, use of hand inspection tools, failure analysis support, Level 1 Inspector/Repairman preferred.
Central Repair Center Non-Technical Project/Program Management III - (B3)
Chandler, Arizona, United States
$88k-$121k/yrOnsiteFull Time
Applied MaterialsNASDAQ: AMAT: Manufacturers of equipment for semiconductor and display production.
4+ YOEBachelor's in engineering, 4+ years engineering/manufacturing/repair experience, project management, process development, failure analysis, data-driven improvements, documentation, and cross-functional communication.
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
1+ YOEAssociate or Bachelor's in engineering-related field, 1+ years hands-on scientific project/lab experience, familiarity with failure analysis and lab instruments, strong verbal and technical writing skills.
mechanical polisher, optical microscope, electron microscopy