43 failure analysis engineer jobs at 23 companies in Newman, CA
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Staff Engineer, Failure Analysis Engineering
San Jose, California, United States
$130k-$188k/yrOnsiteFull Time
Analog DevicesNASDAQ: ADI: Designs and manufactures semiconductors for signal processing and power management.
5+ YOEDegree in engineering/physics/science with semiconductor emphasis, 5–7+ years experience in failure analysis or related engineering, knowledge of device physics, FA tools, and strong troubleshooting and communication skills.
Optical microscopy, X-ray, EMMI, OBIRCH, ELITE, Microprobing, Curve tracer, Voltage Sources, Current loads, Oscilloscope, Source meter, Function generator, FIB
Power IntegrationsNASDAQ: POWI: Produces high-voltage integrated circuits for efficient power conversion.
2+ YOEMinimum 2 years of relevant experience; strong understanding of analog/digital circuits and IC fabrication; proficient in fault isolation and defect characterization methods.
Foxconn AssemblyTaiwan Stock Exchange: 2317: Assembles electronics and computer hardware for global technology brands.
3+ YOEBachelor's in electrical/computer engineering or computer science, ~3 years system-level test experience in manufacturing, strong analytical and communication skills, able to lift 50 lbs, familiarity with Linux/Unix/Python preferred.
Western DigitalNASDAQ: WDC: Design and manufacture data storage devices and systems.
Bachelors in a science/engineering field, US work authorization, hands-on lab and clean-room experience, strong organization, problem-solving, communication, and documentation skills.
Principal Characterization-Failure Analysis Engineer
Milpitas, California, United States
$165k-$200k/yrOnsiteFull Time
PsiQuantum: Builds fault-tolerant quantum computers using silicon photonics technology.
10+ YOEMaster’s degree or higher in engineering; 10+ years in opto-mechanical failure analysis; strong communication and leadership; experience with data tools.
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
8+ YOEBachelor's in electrical/computer engineering with 8+ years experience; high-speed network interface and board design expertise; familiarity with Cadence Allegro; experience with SERDES, signal integrity, and design validation.
KLANASDAQ: KLAC: Provides process control and yield management for semiconductor manufacturing.
0+ YOEDegree in materials science, chemistry, or chemical engineering; hands-on failure analysis and materials characterization (SEM/FIB, TEM, EDS, SIMS, XPS, FTIR, Raman, UV‑Vis, optical microscopy, GC/LC); root-cause methodologies and willingness to travel.
SandiskNasdaq: SNDK: Designs and manufactures flash memory and data storage products.
6+ YOEBachelor's degree in engineering/CS, 6+ years engineering experience in test infrastructure or reliability, hands-on with environmental chambers, failure analysis, vendor management, and global lab alignment.
Rivet Industries: Building integrated task systems for frontline industrial and defense operators.
5+ YOEBachelor's in engineering (or equivalent), 5+ years reliability engineering experience, hands-on reliability test and failure analysis experience, familiarity with ASTM/MIL/JEDEC/IEC standards, strong statistical and communication skills.
BroadcomNASDAQ: AVGO: Designs and sells semiconductors and infrastructure software to enterprises.
8+ YOEBachelor's in Electrical/Electronic Engineering, 8+ years semiconductor experience (analog/mixed-signal CMOS), reliability and package qualification, failure analysis, statistical data analysis, project leadership, and customer support.
Altera: Manufacturer of field-programmable gate arrays and programmable logic devices.
8+ YOEMaster's in engineering or related plus 8+ years in semiconductor package thermal/thermomechanical analysis; experience with Ansys/Abaqus/COMSOL and Python; reliability statistics and failure analysis skills.
SK hynixKRX: 000660: Manufacturer of memory chips, flash storage, and image sensors.
5+ YOEBachelor's in Computer or Electrical Engineering, 5+ years semiconductor experience, knowledge of HBM/DRAM development and qualification, failure analysis, strong communication, and willingness to travel.
FlexNASDAQ: FLEX: Contract electronics manufacturing and supply chain management services.
6+ YOEBachelor’s in Mechanical Engineering; 6+ years hardware NPI experience; hands-on build, validation, and failure analysis; vendor/CM collaboration; strong GD&T and tolerance analysis; proficient with MS Office and project tools.
Microsoft PowerPoint, Smartsheet, Microsoft Project
FormFactorNASDAQ: FORM: Manufacturer of semiconductor test and measurement equipment.
5+ YOEExperienced engineer for assembly and test process development for probe card architectures; strong DOE/SPC skills, failure analysis, metrology, and cross-functional collaboration. Advanced degree or equivalent experience required.
ATE Testing, DOE, SPC, Precision Metrology, Electrical Testing, Failure Analysis, Statistical Data Analysis
LumentumNASDAQ: LITE: Manufacturer of optical and photonic components for global networks.
0+ YOEMS or PhD in EE, materials science, or applied physics; deep semiconductor process knowledge; strong statistical analysis (JMP or Minitab); 0-3 years device/process experience; foundry and failure analysis familiarity.
MediaTekTaiwan Stock Exchange: 2454: Designs and develops system-on-chip solutions for electronic devices.
8+ YOELead memory packaging development for 2.5D/3D and HBM/IPM solutions; supply chain and partner management; failure analysis and product integration to mass production.
Senior Mechanical Engineer, Battery HV Distribution - (SJ2026KM)
San Jose, California, United States
$185k-$194k/yrOnsiteFull Time
ArcherNYSE: ACHR: Develops electric vertical takeoff and landing aircraft for urban mobility.
2+ YOEBachelor's in Mechanical or Electrical Engineering required; 2+ years mechanical design experience with HV systems, CAD/GD&T, tolerance stack, FEA, and part development for aerospace/energy/automotive; prototype testing and failure analysis experience.
MACOMNASDAQ: MTSI: Designs and manufactures semiconductor products for communications infrastructure.
8+ YOEBS/MS in engineering preferred; 8+ years in package/assembly process development (die attach, SMT, lid attach); hands-on die bond experience (Datacon EVO); experience with FMEA, SPC, DoE, GR-468 qualification and failure analysis.
Lumilens: Designs photonic interconnects for AI supercomputing infrastructure.
8+ YOE8+ years in FR4/PCB development with mSAP/Any-Layer HDI experience, supplier qualification, PCB DFM/DFT, failure analysis, PCB test methods, and strong cross-functional communication.