195 failure analysis engineer jobs at 71 companies in Oakley, CA
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Failure Analysis Engineer
Fremont, California, United States
OnsiteFull Time
Hyve SolutionsNYSE: SNX: Designs and manufactures custom hardware for hyperscale data centers.
3+ YOEBachelor's in engineering, 3+ years in failure analysis/hardware validation, experience with enterprise servers and rack systems, board-level debugging, lab instruments, and RCA methodologies (8D, 5-Why, FMEA).
Oscilloscope, Digital Multimeter, Power Analyzer, Thermal Camera, Logic Analyzer, X-ray System, Optical Microscope, Environmental Test Equipment
PG&ENYSE: PCG: Provides natural gas and electric service in California.
3+ YOEB.S. in engineering, minimum 3 years related experience, experience with failure analysis/materials testing, strong investigative and communication skills; PE preferred.
Avicena: Develops microLED optical interconnects for high-speed chip-to-chip communication.
5+ YOEMS/PhD in EE, Materials, Physics or related (BS with experience acceptable). 5–8+ years failure analysis in semiconductor/optoelectronic devices. Skills in root-cause methods, device physics, Python or MATLAB, and technical communication.
EL/PL imaging, SIMS, EMMI, OBIRCH, FIB, SEM, TEM, EDX, CT/acoustic microscopy, curve tracing, Python, MATLAB
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
8+ YOE8+ years industry experience in semiconductor failure analysis; degree in EE, Materials Science, or Physics (or equivalent); expertise in IC sample preparation, microscopy, and system-level FA.
Analog DevicesNASDAQ: ADI: Designs and manufactures semiconductors for signal processing and power management.
5+ YOEDegree in engineering/physics/science with semiconductor emphasis, 5–7+ years experience in failure analysis or related engineering, knowledge of device physics, FA tools, and strong troubleshooting and communication skills.
Optical microscopy, X-ray, EMMI, OBIRCH, ELITE, Microprobing, Curve tracer, Voltage Sources, Current loads, Oscilloscope, Source meter, Function generator, FIB
NVIDIANASDAQ: NVDA: Designs graphics processing units and artificial intelligence hardware.
8+ YOE8+ years industry FA experience, BS/MS/PhD in EE/Materials/Physics or equivalent, expertise in IC sample preparation, FIB, SEM/TEM, microscopy, packaging, and system-level failure analysis.
Focused Ion Beam (FIB), Scanning Electron Microscope (SEM), Transmission Electron Microscope (TEM), Design of Experiments (DOE)
SynopsysNasdaq: SNPS: Provides software and IP for semiconductor design and manufacturing.
7+ YOEBS/MS in electrical/electronics engineering, 7+ years failure analysis or manufacturing test experience; hands-on PCBA/system troubleshooting, oscilloscope and Linux-based testing, scripting (Python, Perl, Bash), SEM/EDS and CSAM familiarity.
oscilloscope, Linux, Python, Perl, Bash, Shell, SEM/EDS, CSAM, Microsoft Word, Microsoft Excel, Salesforce, SAP, Jira, Microsoft BI, Tableau, Sisense, Crystal Reports
Solidigm: Develops and manufactures NAND flash memory and solid-state drives.
Architectural knowledge of NAND SSDs, PCIe/NVME/SATA/SAS, Linux and Windows system-level debug, telemetry/log analysis, electronics/PCB and test-equipment experience, scripting in Python or C, strong communication and mentoring skills.
Power IntegrationsNASDAQ: POWI: Produces high-voltage integrated circuits for efficient power conversion.
2+ YOEMinimum 2 years of relevant experience; strong understanding of analog/digital circuits and IC fabrication; proficient in fault isolation and defect characterization methods.
4+ YOEBachelor's degree or equivalent,4+ years analyzing hardware performance or failure data,EMR not relevant; experience with failure analysis,statistical methods,technical communication required.
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Hands-on hardware validation, system bring-up, failure analysis, root-cause debugging, and product sustainment; bachelor's in EE/CE required; experience with DC/DC, FPGA, PCIe, DDR4, signal integrity, and Python scripting preferred.
Foxconn AssemblyTaiwan Stock Exchange: 2317: Assembles electronics and computer hardware for global technology brands.
3+ YOEBachelor's in electrical/computer engineering or computer science, ~3 years system-level test experience in manufacturing, strong analytical and communication skills, able to lift 50 lbs, familiarity with Linux/Unix/Python preferred.
Western DigitalNASDAQ: WDC: Design and manufacture data storage devices and systems.
Bachelors in a science/engineering field, US work authorization, hands-on lab and clean-room experience, strong organization, problem-solving, communication, and documentation skills.
WiproNYSE: WIT: Global technology services and consulting for digital transformation.
3+ YOEPerform radiography/CT setup and image acquisition, collect and process CT data, handle consumer electronic parts and lab samples, communicate cross-functionally; availability for swing/overnight shifts and occasional weekends; VLSI board design skill; 3+ years experience.
Form Energy: Developing multi-day batteries for grid-scale energy storage.
7+ YOE7+ years technician experience in a technology field, ability to lift 30 lbs, experience with lab tools/instruments, comfort with chemicals/PPE, strong written and verbal communication.
Principal Characterization-Failure Analysis Engineer
Milpitas, California, United States
$165k-$200k/yrOnsiteFull Time
PsiQuantum: Builds fault-tolerant quantum computers using silicon photonics technology.
10+ YOEMaster’s degree or higher in engineering; 10+ years in opto-mechanical failure analysis; strong communication and leadership; experience with data tools.
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
8+ YOEBachelor's in electrical/computer engineering with 8+ years experience; high-speed network interface and board design expertise; familiarity with Cadence Allegro; experience with SERDES, signal integrity, and design validation.
KLANASDAQ: KLAC: Provides process control and yield management for semiconductor manufacturing.
0+ YOEDegree in materials science, chemistry, or chemical engineering; hands-on failure analysis and materials characterization (SEM/FIB, TEM, EDS, SIMS, XPS, FTIR, Raman, UV‑Vis, optical microscopy, GC/LC); root-cause methodologies and willingness to travel.
Master's in Mechanical Engineering (or Bachelor's considered); PE licensure preferred; experience in failure analysis/accident reconstruction, willingness to work in litigation and provide expert testimony, strong written and verbal communication, background in safety equipment helpful.