MycronicNasdaq Stockholm: MYCR: Develops and manufactures high-precision electronics production equipment.
3+ YOEAssociate's degree or 3+ years related experience; field service/applications engineering experience preferred; strong optics/laser, electrical and computer competency; valid passport and driver's license required.
NextSilicon: Develops software-defined hardware accelerators for high-performance computing.
8+ YOEBSc in CS/math/engineering required (MS/PhD preferred), 8+ years experience (4+ commercial), experience with multiple architectures and application areas, strong MPI/OpenMP and C/C++/Fortran skills, Linux and customer-facing communication skills, US citizenship required.
NVIDIANASDAQ: NVDA: Designs graphics processing units and artificial intelligence hardware.
2+ YOEBachelor's degree in engineering or computer science, or equivalent experience, plus 2+ years of relevant experience. Requires networking protocols, OEM server hardware, firmware validation, and system-level troubleshooting expertise.
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
2+ YOEBachelor's degree in engineering or computer science, 2+ years of experience, networking protocols, switch configuration, hardware interfaces, OEM servers, firmware validation, and system-level troubleshooting.
United States or Austin or California or North America
RemoteFull Time
PQShield: Develops post-quantum cryptographic solutions for hardware and software systems.
5+ YOERequires 5–10 years of FAE or sales engineering experience, technical solution integration, enterprise sales support, hardware IP or security technology experience, strong communication, and Jira, GitHub, and HubSpot proficiency.
onsemi: Designs and manufactures semiconductor solutions for power and sensing.
5+ YOEBachelor's in Electrical Engineering, 5+ years relevant experience, strong sales/customer-service background, excellent presentation and communication skills, self-starter, and ability to collaborate with FAE team.
InspireSemiOTCPK: INSSF: Designs high-performance RISC-V processors for AI and datacenters.
3+ YOE3+ years developing HPC-AI applications, bachelor's in EE/CE or related, strong C/C++ skills, Linux and parallel programming (OpenMP/MPI), ability to profile and optimize software, travel as needed.
Field Applications Engineer, Server Datacenter - Dell
Austin, Texas, United States
$133k-$199k/yrOnsiteFull Time
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Bachelor's degree in electrical engineering, computer engineering, computer science, or similar field; expertise in server architecture, hardware, software, customer solutions, technical relationships, and complex problem-solving.
AmphenolNYSE: APH: Designs and manufactures electrical connectors and interconnect systems.
5+ YOEBachelor's in Mechanical, Electrical, or Computer Engineering; 5+ years supporting product marketing and sales technical activities; experience with modeling tools and Microsoft Office; strong communication and presentation skills.
AmphenolNYSE: APH: Manufactures electronic and fiber optic connectors and interconnect systems.
5+ YOEBachelor's in Engineering, 5+ years providing product marketing/sales technical support, experience with Pro E or Solidworks and Microsoft Office, strong communication and presentation skills; some travel required.
NXP SemiconductorsNASDAQ: NXPI: Designs and manufactures semiconductors for automotive and IoT applications.
5+ YOEBachelor's/Master's in EE/CE, 5+ years FAE or development engineering experience in semiconductors; experience with C/C++, embedded Linux, SoC interfaces (Ethernet, PCIe, MIPI, LP DDR5, USB2.0/3.0), ARM Cortex, RTOS; travel up to 30%.
C, C++, embedded Linux, u-boot, RTOS, Tensorflow Lite, ONNX, Ethernet, PCIe, MIPI, LP DDR5, USB2.0/3.0, ARM Cortex A, ARM Cortex M
ArterisNASDAQ: AIP: Develops semiconductor interconnect intellectual property and integration software.
5+ YOE5+ years SoC design and verification experience with Verilog/VHDL/SystemVerilog, RTL simulation/emulation tools, strong presentation skills, willingness to travel, US citizenship required.
United States or Austin or Dallas or Houston or Fort Worth or Beaverton or Portland
$67k-$125k/yrFieldFull Time
Ralliant CorporationNYSE: RAL: Global provider of precision instruments, sensors, and monitoring solutions.
Bachelor's in EE/Physics/Computer Engineering or equivalent; experience with oscilloscopes, signal generators, source meters, DMMs, spectrum analyzers; programming (Python, C#, VB, LabVIEW); strong communication. 6-12 month Technical Support Center training in Beaverton, OR.
Python, C#, VB, LabVIEW, Microsoft Office, Oscilloscopes, Signal Generators, Source Meters, DMMs, Spectrum Analyzers
MycronicNasdaq Stockholm: MYCR: Supplies precision production equipment for the global electronics industry.
3+ YOEAssociate's degree or 3+ years related experience; strong optics/laser, electrical and computer competency; training in Microsoft Windows, Linux, Matlab preferred; valid passport and driver's license required.
ASMLNASDAQ: ASML: Manufactures lithography systems used to print patterns on wafers.
8+ YOEBachelor's degree in a technical field, minimum 8 years in IC manufacturing/lithography/metrology or process technology, NPI/ramp/HVM experience, strong data analysis and coding skills, stakeholder communication and independent execution.
Baya Systems: Designs semiconductor fabric IP and chiplet design software.
10+ YOE5+ MgmtBachelor's in EE/CE/STEM required; 10+ years in semiconductor/silicon IP/networking and 5+ years managing customer-facing engineering teams; deep NoC/AMBA/PCIe/CXL knowledge and EDA tool familiarity.
KLANASDAQ: KLAC: Provides process control and yield management for semiconductor manufacturing.
3+ years semiconductor/process or capital equipment experience; Master's+3yrs or Bachelor's+5yrs in technical field; strong semiconductor process knowledge; customer-facing, travel up to 40%.
SandiskNasdaq: SNDK: Designs and manufactures flash memory and data storage products.
Bachelor's degree in EE/CE/CS, extensive field application engineering experience in storage (SSD/HDD/Flash), strong NVMe/PCIe and 3D NAND knowledge, joint qualification lifecycle experience, and ability to lead cross-functional technical integration.
PCIe, NVMe, U.2, U.3, EDSFF (E3), 3D NAND, Flash Translation Layer (FTL), RAID, Joint Development Management (JDM), TCG Opal, FIPS