Power IntegrationsNASDAQ: POWI: Produces high-voltage integrated circuits for efficient power conversion.
15+ YOE15+ years IC design experience with proven global leadership; deep expertise in high-voltage/power IC, mixed-signal integration, semiconductor processes (BCD, HV, GaN preferred); track record delivering silicon on schedule and improving design productivity.
BroadcomNASDAQ: AVGO: Designs and sells semiconductors and infrastructure software to enterprises.
5+ YOEBachelor's in Engineering/Computer Science with 5+ years (or Masters+3+ or PhD+0) of related IC design experience; strong judgment, verification, simulation, and documentation skills.
AppleNASDAQ: AAPL: Designs and sells consumer electronics, software, and online services.
Experienced analog IC designer for power management (DC-DC converters, LDOs, charge pumps) with knowledge of mixed-signal and related circuits and ability to collaborate with system engineers.
NXP SemiconductorsNASDAQ: NXPI: Designs and manufactures semiconductors for automotive and IoT applications.
15+ YOELead system IC architecture for PoL/SiP; 15+ years in power semiconductors, packaging, and system integration; AI compute and automotive power experience valued.
Keysight TechnologiesNYSE: KEYS: Provides electronic design, test, and simulation software and hardware.
5+ YOEBS/MS/PhD in electrical engineering, 5+ years IC/mm-wave test experience, RF characterization, wafer probe calibration, test automation and C/C#/C++/.NET programming experience.
C#, C++, .NET, C, Microsoft Visual Studio, ADS, network analyzer, signal source, spectrum analyzer
Keysight TechnologiesNew York Stock Exchange: KEYS: Manufactures hardware and software for electronic test and measurement.
5+ YOEBS/MS/PhD in Electrical Engineering,5+ years RF/mm-wave IC test experience,proficiency with C#,C++/.NET,C,Visual Studio,network analyzer,spectrum analyzer,wafer probe calibration,EM/ADS familiarity.
Axiado: Creates AI-driven security processors for data center infrastructure.
10+ YOESenior IC Packaging Engineer with 10+ years in IC packaging, expertise in FC BGA, SiP, RDL, and chiplet architectures, and leadership in packaging programs.
QualcommNASDAQ: QCOM: Designs and manufactures semiconductors and wireless telecommunications products.
2+ YOEBachelor's in engineering plus 4+ years (or MS+3 or PhD+2) in system/package design or technology engineering; expertise in advanced IC packaging (FCCSP, FCBGA, SiP, RDL, 2.5D/3D), NPI, reliability testing, FMEA/SPC, and cross-functional collaboration.
NVIDIANASDAQ: NVDA: Designs graphics processing units and artificial intelligence hardware.
8+ YOEPhD in electrical engineering, physics, applied physics, or related field, or equivalent experience; 8+ years in photonics IC design; Cadence expertise, production tapeout experience, and technical leadership.
Vishay IntertechnologyNYSE: VSH: Manufacturer of discrete semiconductors and passive electronic components.
7+ YOEBS in Electrical Engineering,7+ years IC product engineering experience, MOSFET and semiconductor packaging knowledge, familiarity with quality systems and statistical tools, hands-on lab and failure analysis experience.
ETS364/88/800 Eagle Tester, ASL1K, JMP, PAT, SPC, GRR
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
8+ YOEPhD in electrical engineering, physics, applied physics, or related field, or equivalent experience; 8+ years in photonics IC design; Cadence expertise, production tapeout experience, photonic device physics, and technical leadership.
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Bachelor's or Master's in Computer/Electrical Engineering, strong experience with Cadence Virtuoso, LEF and Calibre flows, proficiency in Cadence SKILL and Perl, AI agent integration experience preferred, strong communication and problem-solving skills.
BS (or higher) in a technical field, strong Python proficiency, experience with IC layout formats (GDSII) and EDA tools (KLayout, gdspy, Cadence), familiarity with semiconductor fabrication and lithography, and experience owning production software.
CalpineNASDAQ: CEG: Generates electricity from natural gas and geothermal energy resources.
5+ YOE5+ years in instrument/electrical and control systems, HS or technical/vocational education, DCS programming/configuration, equipment calibration and troubleshooting, knowledge of NEC/NFPA, valid state driver’s license.
Distributed Control System (DCS), Computerized Maintenance Management System (CMMS)
Sr. IC Package Design Engineer (Silicon Engineering)
Austin or Irvine
OnsiteFull Time
SpaceX: Designs and launches advanced rockets and satellite internet constellations.
5+ YOEBachelor's degree in electrical/computer engineering or physics; 5+ years IC package design experience; strong SI/PI, RF, and CAD tool proficiency.
Principal Analog IC Design Engineer, High Speed SerDes
San Jose, California, United States
$137k-$254k/yrOnsiteFull Time
Cadence Design SystemsNASDAQ: CDNS: Develops computational software and hardware for electronic system design.
7+ YOEMinimum 7 years in CMOS SerDes or high-speed I/O IC design; MS or PhD in electrical engineering; analog/mixed-signal design, verification, CAD tools, and circuit simulation experience required.
Blue Origin: Develops reusable rockets and systems for human spaceflight.
7+ YOEB.S. in Electrical Engineering, 7+ years designing fractional-N PLLs/DLLs in advanced FinFET CMOS, proficiency with Spectre, AMS, MATLAB, SystemVerilog, PLL silicon characterization, and ability to work as a U.S. person.