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100 materials engineer jobs at 6 companies in Meridian, ID

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Staff/ Principal Engineer, OCT MTE Material Engineering
Boise, Idaho, United States
OnsiteFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Designs and manufactures semiconductor memory and data storage solutions.
8+ YOE8+ years in semiconductor manufacturing or materials engineering; global, multi-functional collaboration; travel; Bachelor's or Master's in Science/Engineering.
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3mo
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Staff/ Principal Engineer, OCT MTE Material Engineering
Boise or Manassas
OnsiteFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Manufacturer of semiconductor memory and data storage products.
5+ YOEBachelor’s degree in science/engineering (or equivalent experience), 5+ years in semiconductor or materials engineering, global collaboration experience, strong written/verbal communication, structured problem solving, and willingness to travel.
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2mo
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Process Support Engineer III
Boise, Idaho, United States
$108k-$149k/yr OnsiteFull Time
Applied Materials
Applied MaterialsNASDAQ: AMAT: Produces equipment and services for chip and display manufacturing.
4+ YOEBachelor's in chemistry/physics/materials/electrical engineering; 4–7 years semiconductor fab or equipment experience; strong English communication.
Design of Experiments, Statistical Analysis, Root Cause Analysis
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2w
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Senior Engineer, Field Process (Boise, ID)
Boise, Idaho, United States
FieldFull Time
ASM
ASMEuronext Amsterdam: ASM: Designs and manufactures advanced semiconductor wafer processing equipment.
PhD or MS in materials science/chemical engineering/physics with hands-on thin-film (ALD, PEALD, PECVD, Epitaxy) experience, troubleshooting and DOE skills, ability to travel and support extended hours, strong communication.
ALD, PEALD, PECVD, Epitaxy
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2mo
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R&D Engineer III - Advanced Memory
Boise, Idaho, United States
OnsiteFull Time
Photronics
PhotronicsNASDAQ: PLAB: Manufactures high-precision photomasks for semiconductors and flat-panel displays.
6+ YOE6+ years experience in semiconductor/photomask manufacturing or process development; BS/MS in Engineering, Physics, Chemistry, Materials Science or related; expertise in lithography, metrology, OPC, process troubleshooting, and cross-functional project leadership.
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1mo
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Principal/ Staff Engineer, Advanced Packaging Process Integration
Singapore or Taiwan or Boise or Korea or Santa Clara or Israel or Kirchheim bei München
OnsiteFull Time
Applied Materials
Applied MaterialsNASDAQ: AMAT: Manufacturers of equipment for semiconductor and display production.
Bachelor's in engineering/materials/physics required (advanced degree preferred). Extensive semiconductor process integration and advanced packaging experience, project management and technical leadership, data analysis and problem solving, knowledge of industry standards.
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Thermal Spray Development Engineer
Boise, Idaho, United States
OnsiteFull Time
Technetics Group
Technetics GroupNYSE: NPO: Designs and manufactures high-performance industrial seals and components.
PhD/Master/Bachelor in Materials Science or Engineering; experience with thermal spray, ceramics, suspension plasma spray; DOE; coating characterization; semiconductor equipment background preferred.
thermal spray equipment, ceramics, suspension plasma spray, micrograph analysis, DOE
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Packaging & Material Handling System Designer
Meridian or Plover or Madison or Minneapolis
$24-$35/hr OnsiteFull Time
WSP
WSPToronto Stock Exchange: WSP: Provides engineering, design, and environmental consultancy services globally.
3+ YOEHigh school diploma, 3+ years packaging/material handling or industrial facilities design experience, AutoCAD and Inventor experience, ability to work with scan/point cloud data, strong communication, willingness to travel 10–30%.
AutoCAD, Inventor
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