OnTrac: Provides last-mile delivery services for e-commerce retailers.
Must be at least 18, communicate basic English, stand for extended periods, work in varying temperatures, and lift, push, pull, or move packages up to 75 pounds.
Andy Frain Services: Provides professional security and event crowd management services.
Valid CA Guard Card and reliable transportation required; perform package screening using X-ray and trace detection, maintain logs and equipment; late afternoon/evening availability.
GLS USLondon Stock Exchange: IDS: Provider of regional parcel and freight delivery services.
Must be at least 18, able to lift up to 75 lbs, stand for prolonged periods, work in varying weather, follow instructions, and perform package sorting and loading tasks safely.
DensityAI: Designing custom AI hardware accelerators for large language models.
8+ YOERequires 8+ years of advanced package layout experience, including multi-die 2.5D/3D packages, substrate and interposer routing, package DRC/LVS, and collaboration with physical design, SI/PI, thermo-mechanical, and OSAT teams.
Align Real Estate Management: Manages and develops high-end luxury residential communities
Organized, customer-focused individual with strong communication and interpersonal skills; ability to handle packages, work independently or on a team, and use basic technology.
BroadcomNASDAQ: AVGO: Designs and sells semiconductors and infrastructure software to enterprises.
6+ YOEBSEE with 8+ years or MSEE with 6+ years in flip-chip BGA package design; knowledge of package signal and power integrity; Cadence APD and Cadence SKILL experience preferred; project management and collaboration skills.
Benefit Cosmetics: Sells high-end makeup products and provides professional eyebrow styling.
6+ YOE6+ years design experience (packaging a plus), strong concepting and print production knowledge, advanced industry-standard software skills, project management proficiency, sustainability experience, and ability to collaborate cross-functionally.
LVMHEuronext Paris: MC: A diversified luxury conglomerate managing fashion, spirits, and beauty brands.
1+ YOEB.S. in Packaging Engineering or related, 1+ year packaging/manufacturing experience, knowledge of secondary components, printing/color matching, package testing, technical drawings and project timeline management.
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
5+ YOEMSc/PhD in engineering, 5+ years semiconductor packaging experience, expertise in advanced packaging architectures, reliability testing, thermal/mechanical/electrical analysis, OSAT collaboration, and project leadership.
Lightmatter: Develops photonic processors and interconnects for AI data centers
MS or PhD in mechanical engineering, materials science, or related engineering; experience developing wafer-scale packaging assembly processes, 2D/3D packaging, test vehicles, fiber attachment, and thermal, mechanical, and reliability solutions.
QualcommNASDAQ: QCOM: Designs and manufactures semiconductors and wireless telecommunications products.
5+ YOEExperience in IC package/SIP physical design, Cadence APD/Allegro proficiency, familiarity with SI/PI tools (HFSS, PowerSI, Q3D), package verification and CAD tool development; master\u0002s preferred with 5+ years.
Cspeed IO: A stealth startup developing next-generation optical semiconductor solutions for AI infrastructure.
6+ YOE6+ years IC package physical design experience, BS/MS in electrical engineering, expertise in package layout tools, multi-die packaging, substrate stack-ups, DFM/DF A closure, and English fluency.
8+ YOEBachelor's in engineering or equivalent, 8 years experience in chip package substrate design using Cadence APD or Mentor Expedition, EM/DFM/taping experience, design automation and scripting, B.S./M.S./PhD preferred.
Luxer One: Provider of smart package lockers and automated delivery solutions.
0+ YOEMust be 18+, 1–2 years customer-facing experience, reliable transportation, able to lift up to 60 lbs, comfortable with digital package software, Gmail/Google Suite, clear communication and strong organization.
Haus Labs: Creates high-performance, skincare-infused makeup and beauty products.
2+ YOEBachelor's degree in packaging technology, science, engineering, or related field; 2+ years in cosmetic or personal care packaging engineering; material science, sustainability, statistical software, and lab testing knowledge.
MediaTekTaiwan Stock Exchange: 2454: Designs and develops system-on-chip solutions for electronic devices.
8+ YOE8+ years in package development and NPI for semiconductors; expertise in advanced packaging (EMIB, 2.5D/3D/3.5D, FCBGA, HBM); qualification, reliability, failure analysis, yield improvement, and cross-functional project management.
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
5+ YOEBS in CS/EE or equivalent,5+ years developing package design flows/methodologies,proficiency in Python and/or C++,knowledge of VLSI package electrical fundamentals,experience applying AI/ML or LLMs in engineering workflows.
UPSNYSE: UPS: Global provider of package delivery and supply chain logistics.
Bachelor's degree preferred; knowledge of Dispatch Planning System and UDC; Microsoft Office experience; strong planning, organization, customer focus, and package flow technology familiarity.
Dispatch Planning System (DPS), UDC, Microsoft Office, mapping tools