685 package jobs at 242 companies in San Francisco, CA
1mo
Save
Mark Applied
Hide
1mo
Package Screener
Fremont, California, United States
$25/hrOnsitePart Time
Andy Frain Services: Provides professional security and event crowd management services.
Valid CA Guard Card and reliable transportation required; perform package screening using X-ray and trace detection, maintain logs and equipment; late afternoon/evening availability.
GLS USLondon Stock Exchange: IDS: Provider of regional parcel and freight delivery services.
Must be at least 18, able to lift up to 75 lbs, stand for prolonged periods, work in varying weather, follow instructions, and perform package sorting and loading tasks safely.
OnTrac: Provides last-mile delivery services for e-commerce retailers.
Must be able to stand for long periods, lift/move packages averaging 50 lbs (up to 75 lbs occasionally), work in varied warehouse temperatures, be at least 18 years old, and have basic English for safety and instructions.
DensityAI: Designing custom AI hardware accelerators for large language models.
8+ YOERequires 8+ years of advanced package layout experience, including multi-die 2.5D/3D packages, substrate and interposer routing, package DRC/LVS, and collaboration with physical design, SI/PI, thermo-mechanical, and OSAT teams.
Align Real Estate Management: Manages and develops high-end luxury residential communities
Organized, customer-focused individual with strong communication and interpersonal skills; ability to handle packages, work independently or on a team, and use basic technology.
BroadcomNASDAQ: AVGO: Designs and sells semiconductors and infrastructure software to enterprises.
6+ YOEBSEE with 8+ years or MSEE with 6+ years in flip-chip BGA package design; knowledge of package signal and power integrity; Cadence APD and Cadence SKILL experience preferred; project management and collaboration skills.
Benefit Cosmetics: Sells high-end makeup products and provides professional eyebrow styling.
6+ YOE6+ years design experience (packaging a plus), strong concepting and print production knowledge, advanced industry-standard software skills, project management proficiency, sustainability experience, and ability to collaborate cross-functionally.
LVMHEuronext Paris: MC: A diversified luxury conglomerate managing fashion, spirits, and beauty brands.
1+ YOEB.S. in Packaging Engineering or related, 1+ year packaging/manufacturing experience, knowledge of secondary components, printing/color matching, package testing, technical drawings and project timeline management.
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
5+ YOEMSc/PhD in engineering, 5+ years semiconductor packaging experience, expertise in advanced packaging architectures, reliability testing, thermal/mechanical/electrical analysis, OSAT collaboration, and project leadership.
Lightmatter: Develops photonic processors and interconnects for AI data centers
MS or PhD in mechanical engineering, materials science, or related engineering; experience developing wafer-scale packaging assembly processes, 2D/3D packaging, test vehicles, fiber attachment, and thermal, mechanical, and reliability solutions.
QualcommNASDAQ: QCOM: Designs and manufactures semiconductors and wireless telecommunications products.
5+ YOEExperience in IC package/SIP physical design, Cadence APD/Allegro proficiency, familiarity with SI/PI tools (HFSS, PowerSI, Q3D), package verification and CAD tool development; master\u0002s preferred with 5+ years.
Cspeed IO: A stealth startup developing next-generation optical semiconductor solutions for AI infrastructure.
6+ YOE6+ years IC package physical design experience, BS/MS in electrical engineering, expertise in package layout tools, multi-die packaging, substrate stack-ups, DFM/DF A closure, and English fluency.
8+ YOEBachelor's in engineering or equivalent, 8 years experience in chip package substrate design using Cadence APD or Mentor Expedition, EM/DFM/taping experience, design automation and scripting, B.S./M.S./PhD preferred.
MediaTekTaiwan Stock Exchange: 2454: Designs and develops system-on-chip solutions for electronic devices.
8+ YOE8+ years in package development and NPI for semiconductors; expertise in advanced packaging (EMIB, 2.5D/3D/3.5D, FCBGA, HBM); qualification, reliability, failure analysis, yield improvement, and cross-functional project management.
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
5+ YOEBS in CS/EE or equivalent,5+ years developing package design flows/methodologies,proficiency in Python and/or C++,knowledge of VLSI package electrical fundamentals,experience applying AI/ML or LLMs in engineering workflows.
Altera: Manufacturer of field-programmable gate arrays and programmable logic devices.
8+ YOEMaster's in engineering or related plus 8+ years in semiconductor package thermal/thermomechanical analysis; experience with Ansys/Abaqus/COMSOL and Python; reliability statistics and failure analysis skills.
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
3+ YOEBachelor's (5+ years) or Master’s (3+ years) in Electrical Engineering or related field; experience in package/PCB/high-speed design, power delivery, and EDA tools; scripting (Python, Perl, TCL, shell) and strong collaboration skills.
Sr. Package Layout Engineer, Annapurna Labs - AI Silicon Packaging
Tempe or Austin or Cupertino
$159k-$248k/yrOnsiteFull Time
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
10+ YOEBachelor's in EE or related, 10+ years IC package layout and physical design experience, expertise with advanced packaging (2.5D/3D, WLP, RDL, TSV), package DRC/DFM, and collaboration with SI/PI and manufacturing teams.