Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
4+ YOE4+ years package CAD/layout or substrate design experience (6+ preferred); strong background in FCBGA, SiP, WLCSP, power modules; proficiency with Cadence Allegro Package Designer or Siemens Xpedition; BS/MS in EE, microelectronics, materials, or related field.
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
5+ YOEBS in CS/EE or equivalent,5+ years developing package design flows/methodologies,proficiency in Python and/or C++,knowledge of VLSI package electrical fundamentals,experience applying AI/ML or LLMs in engineering workflows.
FedExNYSE: FDX: Global provider of courier, logistics, and transportation services.
Physical, fast-paced warehouse work including loading, unloading, and sorting packages; must be at least 18 and pass background check; flexible to work early morning shifts and variable shift lengths.
Sr. Package Layout Engineer, Annapurna Labs - AI Silicon Packaging
Tempe or Austin or Cupertino
$159k-$248k/yrOnsiteFull Time
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
10+ YOEBachelor's in EE or related, 10+ years IC package layout and physical design experience, expertise with advanced packaging (2.5D/3D, WLP, RDL, TSV), package DRC/DFM, and collaboration with SI/PI and manufacturing teams.
OnTrac: Provides last-mile delivery services for e-commerce retailers.
Ability to stand for shifts, lift regularly up to 50 lbs (occasionally 75 lbs), basic English proficiency, and follow safety and operational instructions.
NXP SemiconductorsNASDAQ: NXPI: Designs and manufactures semiconductors for automotive and IoT applications.
Master's or PhD in Mechanical Engineering, experience with finite element modelling (preferably Ansys or Marc Mentat), understanding of semiconductor packaging, fluent English, onsite presence ≥3 days/week.
Santa Clara or Austin or Toronto or New Taipei City
$100k-$500k/yrHybridFull Time
Tenstorrent: Designs and manufactures AI processors and RISC-V CPU solutions.
3+ YOE3+ years experience with Cadence Allegro PCB Designer, PCB routing and BGA design, signal and power integrity knowledge, strong communication and cross-discipline collaboration skills.
Sr. IC Package Design Engineer (Silicon Engineering)
Austin or Irvine
OnsiteFull Time
SpaceX: Designs and launches advanced rockets and satellite internet constellations.
5+ YOEBachelor's degree in electrical/computer engineering or physics; 5+ years IC package design experience; strong SI/PI, RF, and CAD tool proficiency.
Matheson: Supplying industrial, medical, and specialty gases and equipment.
1+ YOEValid commercial Class B license, Hazmat and Air Brake endorsements, medical card; high school diploma; commercial driving experience; Tanker endorsements preferred.
MathesonTokyo Stock Exchange: 4091: Supplying industrial, medical, and specialty gases and handling equipment.
1+ YOEValid commercial CDL Class B, Hazmat, Air Brake endorsements and medical card required; Class A and Tanker preferred. High school diploma, commercial driving experience (1+ year preferred), ability to lift 200+ lb cylinders, and clean driving record.
Austin or Hartford or Indianapolis or Raleigh or Richardson or Tempe or United States
OnsiteFull Time
InfosysNYSE: INFY: Provides IT consulting, software development, and business outsourcing services.
Hands-on Boomi AtomSphere integration design/development, REST/SOAP/XML/JSON and flat file experience, ability to design solution architecture and lead large data migrations; bachelor\u0002s degree or equivalent experience; must be authorized to work in the US without employer sponsorship.
Boomi AtomSphere, Boomi, REST, SOAP, XML, JSON, CSV, iPaaS, Cloud Integration and API Management, TIBCO, Vitria, webMethods, IBM WBI, SAP NetWeaver
Nutrabolt: Produces performance sports nutrition products and energy drinks.
2+ YOEBachelor’s degree in SCM/Packaging/Engineering; 2+ years packaging/supply chain experience; knowledge of packaging materials; proficient in MS Office; travel up to 25%; fast-paced CPG experience preferred.
Dell TechnologiesNYSE: DELL: Provides information technology hardware, software, and services.
3+ YOE3+ years professional design experience in packaging/visual design, strong packaging portfolio, proficiency with Adobe tools and 3D rendering software, and experience using AI-assisted creative tools.
Adobe Illustrator, Adobe Photoshop, Adobe InDesign, Adobe After Effects, Adobe Premiere, KeyShot, Blender, Cinema 4D, Maya, Electronic Medical Records (EMR)