43 packaging design engineer jobs at 23 companies in Massachusetts
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Senior Packaging Systems Design Engineer
Springfield, Massachusetts, United States
$115k-$135k/yrFieldFull Time
Dennis Group: A design-build engineering and general contracting firm that plans, designs, engineers, and builds food and beverage processing facilities.
8+ YOEBachelor's in engineering, 8+ years packaging/food & beverage experience, led packaging system installations, proficiency with AutoCAD, Microsoft Office and Microsoft Project, strong communication and project management skills, 50%-70% travel.
Draper: Designs and develops advanced guidance and navigation technologies.
5+ YOE5+ years in electrical engineering or related field; expertise in IC package architecture, high-speed layout, SI/PI analysis; proficiency with Siemens Xpedition and industry SI tools; BS in EE required (MS preferred).
Sr. Packaging Engineer (TERADYNE, North Reading, MA)
North Reading, Massachusetts, United States
$175k-$281k/yrOnsiteFull Time
TeradyneNASDAQ: TER: Designs and manufactures automated test equipment and advanced robotics systems.
Master’s degree in electrical, packaging, or related engineering, or equivalent experience; extensive semiconductor package design and SI/PI experience; electromagnetic modeling, validation, supplier collaboration, and technical communication skills.
Morgan Hill or Melbourne or Lowell or North America or Europe or Asia
$82k-$131k/yrOnsiteFull Time
MACOMNASDAQ: MTSI: Designs and manufactures semiconductor products for communications infrastructure.
5+ YOEMechanical engineering degree with 5+ years in electronics packaging/assembly, proficiency in SolidWorks/AutoCAD and thermal analysis (Icepak preferred), GD&T, machining, tolerance/material selection, vendor coordination, BOM and DFM experience.
WHOOP: Wearable technology for personalized health and performance tracking.
5+ YOEBS or MS in mechanical or industrial design engineering; 5+ years developing packaging at scale; SolidWorks CAD and Adobe Illustrator proficiency; experience with suppliers, manufacturing, prototyping, drawings, BOMs, and ECOs.
Experienced in designing access control, CCTV/IP, intrusion detection systems; performing site surveys; developing design packages and construction documentation; coordinating with architects/MEP/IT; familiarity with applicable codes and standards.
CSL Behring: Global biotherapeutics leader driven by our promise to save lives.
5+ YOEBachelor's degree in engineering, life sciences, or related field; 5+ years in medical device, combination product, packaging, quality, or manufacturing; 2+ years in medical device R&D quality and design controls.
21 CFR Part 4, 21 CFR 820, ISO 13485, ISO 14971, FMEA, Design Controls
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
3+ YOEBS/MS in electrical or computer engineering with 3+ years experience; experience with SI/PI simulation, circuit extraction, scripting for automation; familiarity with semiconductor packaging and PCB design; strong communication skills; export-control eligibility.
Santa Clara or Austin or Fort Collins or Boxborough
$175k-$300k/yrHybridFull Time
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Requires a bachelor's or master's degree in computer or electrical engineering, strong physical design and EDA experience, SoC/IP design knowledge, package modeling familiarity, and scripting and flow automation expertise.
CSLASX: CSL: Develops and manufactures biopharmaceutical products and vaccines.
5+ YOEBachelor’s degree in engineering or life sciences; 5+ years in medical devices, combination products, packaging, quality, or manufacturing; 2+ years in medical device R&D quality and design controls; knowledge of FDA, EU MDR, ISO 13485, and ISO 14971.
21 CFR Part 4, 21 CFR 820, ISO 13485, ISO 14971, EU MDR, FMEA
ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)
San Jose or Research Triangle Park or Acton or Dallas or Tempe or Cary or Carlsbad or Colorado Springs
$184k-$264k/yrRemoteFull Time
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
3+ YOEBachelor's/MS/PhD in Electrical Engineering with 3+ to 8+ years SI/PI experience; expertise in high-speed design, SI/PI simulation, layout review, SPICE; mentoring and leadership experience.
AmazonNASDAQ: AMZN: Multinational technology focused on e-commerce and cloud computing.
5+ YOE5+ years in industrial engineering with Lean/Toyota Production System; Bachelor's in Engineering; experience with MHE/packaging lines; operating system/framework development; cross-functional collaboration.
Lean Manufacturing, Industrial IoT, Manufacturing Execution Systems (MES), Digital Lean Tools
Centessa PharmaceuticalsNasdaq: CNTA: Develops therapeutic candidates using an asset-centric research model.
8+ YOEBachelor’s degree in a related scientific or engineering field and 8–10 years of sponsor-side pharmaceutical packaging experience, including late-stage or commercial programs, technical leadership, technology transfer, and cGMP expertise.
IPG MedicalNasdaq Global Select Market: IPGP: The Global Leader in Fiber Laser Technology
10+ YOEBSME/MSME preferred; 10+ years in mechanical design for laser/optical/medical devices; strong PM/leadership; SOLIDWORKS with PDM; packaging, opto-mechanical, electronics interface; MS Office;
SOLIDWORKS, SOLIDWORKS PDM, MS Office, Visio, Project