34 packaging design engineer jobs at 24 companies in Brookline, MA
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IC Packaging Design & Layout Engineer
Cambridge, Massachusetts, United States
$82k-$220k/yrOnsiteFull Time
Draper: Designs and develops advanced guidance and navigation technologies.
5+ YOE5+ years in electrical engineering or related field; expertise in IC package architecture, high-speed layout, SI/PI analysis; proficiency with Siemens Xpedition and industry SI tools; BS in EE required (MS preferred).
Volantis Semiconductor: Private semiconductor startup building photonically integrated computers and photonic interconnects for AI inference and data-center systems.
Experience designing or developing processes for complex packages; first-principles problem solving. Preferred: heterogeneous materials, high-TDP packages, compound semiconductors, optics, interposers, flip-chip integration, or large substrates.
Sr. Packaging Engineer (TERADYNE, North Reading, MA)
North Reading, Massachusetts, United States
$175k-$281k/yrOnsiteFull Time
TeradyneNASDAQ: TER: Designs and manufactures automated test equipment and advanced robotics systems.
Master’s degree in electrical, packaging, or related engineering, or equivalent experience; extensive semiconductor package design and SI/PI experience; electromagnetic modeling, validation, supplier collaboration, and technical communication skills.
Morgan Hill or Melbourne or Lowell or North America or Europe or Asia
$82k-$131k/yrOnsiteFull Time
MACOMNASDAQ: MTSI: Designs and manufactures semiconductor products for communications infrastructure.
5+ YOEMechanical engineering degree with 5+ years in electronics packaging/assembly, proficiency in SolidWorks/AutoCAD and thermal analysis (Icepak preferred), GD&T, machining, tolerance/material selection, vendor coordination, BOM and DFM experience.
WHOOP: Wearable technology developing health and fitness tracking devices.
5+ YOEBS or MS in mechanical or industrial design engineering; 5+ years developing packaging at scale; SolidWorks CAD and Adobe Illustrator proficiency; experience with suppliers, manufacturing, prototyping, drawings, BOMs, and ECOs.
Experienced in designing access control, CCTV/IP, intrusion detection systems; performing site surveys; developing design packages and construction documentation; coordinating with architects/MEP/IT; familiarity with applicable codes and standards.
CSL Behring: Global biotherapeutics leader driven by our promise to save lives.
5+ YOEBachelor's degree in engineering, life sciences, or related field; 5+ years in medical device, combination product, packaging, quality, or manufacturing; 2+ years in medical device R&D quality and design controls.
21 CFR Part 4, 21 CFR 820, ISO 13485, ISO 14971, FMEA, Design Controls
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
3+ YOEBS/MS in electrical or computer engineering with 3+ years experience; experience with SI/PI simulation, circuit extraction, scripting for automation; familiarity with semiconductor packaging and PCB design; strong communication skills; export-control eligibility.
Santa Clara or Austin or Fort Collins or Boxborough
$175k-$300k/yrHybridFull Time
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Requires a bachelor's or master's degree in computer or electrical engineering, strong physical design and EDA experience, SoC/IP design knowledge, package modeling familiarity, and scripting and flow automation expertise.
CSLASX: CSL: Develops and manufactures biopharmaceutical products and vaccines.
5+ YOEBachelor’s degree in engineering or life sciences; 5+ years in medical devices, combination products, packaging, quality, or manufacturing; 2+ years in medical device R&D quality and design controls; knowledge of FDA, EU MDR, ISO 13485, and ISO 14971.
21 CFR Part 4, 21 CFR 820, ISO 13485, ISO 14971, EU MDR, FMEA
BAE SystemsLSE: BA.: Global defense, aerospace, and security technology.
Bachelor's degree in engineering, broad military electronics packaging design experience, organizational leadership, strong PCB design background, communication skills, and ability to obtain Secret clearance.
ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)
San Jose or Research Triangle Park or Acton or Dallas or Tempe or Cary or Carlsbad or Colorado Springs
$184k-$264k/yrRemoteFull Time
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
3+ YOEBachelor's/MS/PhD in Electrical Engineering with 3+ to 8+ years SI/PI experience; expertise in high-speed design, SI/PI simulation, layout review, SPICE; mentoring and leadership experience.
AmazonNASDAQ: AMZN: Multinational technology focused on e-commerce and cloud computing.
5+ YOE5+ years in industrial engineering with Lean/Toyota Production System; Bachelor's in Engineering; experience with MHE/packaging lines; operating system/framework development; cross-functional collaboration.
Lean Manufacturing, Industrial IoT, Manufacturing Execution Systems (MES), Digital Lean Tools
Centessa PharmaceuticalsNasdaq: CNTA: Develops therapeutic candidates using an asset-centric research model.
8+ YOEBachelor’s degree in a related scientific or engineering field and 8–10 years of sponsor-side pharmaceutical packaging experience, including late-stage or commercial programs, technical leadership, technology transfer, and cGMP expertise.