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106 packaging design engineer jobs at 54 companies in Texas

3mo
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Packaging Design Engineer I
San Jose or Hayward or Texas
OnsiteFull Time
TransPak
TransPak: Packaging, crating, and logistics serving technology, aerospace, defense, and medical customers with high-value, hard-to-ship goods.
2+ YOEBachelor’s in mechanical/manufacturing/industrial/packaging engineering; 2-3 years mechanical/structural design experience; CAD (SolidWorks/AutoCAD); GD&T knowledge; packaging design and testing experience; strong communication.
SolidWorks, AutoCAD, NX, BOM, 3D modeling, 2D drawings, GD&T
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3d
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Packaging Engineer
Grand Prairie, Texas, United States
$71k-$131k/yr OnsiteFull Time
Lockheed Martin
Lockheed MartinNYSE: LMT: Designs and manufactures advanced aerospace, defense, and security systems.
1+ YOERequires 1–2 years of packaging or transportation engineering experience, an associate degree or technical training, mechanical design knowledge, MCAD experience, Microsoft Office proficiency, and familiarity with hazardous-material regulations.
Microsoft Office, Microsoft Word, Microsoft Excel, Microsoft PowerPoint, Microsoft Outlook, CREO, PTC Pro/E, Contractor Integrated Technical Information Service (CITIS), RFID, Product Data Management (PDM)
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1w
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Packaging Engineer Aurora
New Braunfels, Texas, United States
OnsiteFull Time
Aumovio
AumovioFrankfurt Stock Exchange: AMV0: Manufactures electronics and software for autonomous and connected vehicles.
Bachelor's degree in a technical field required. Requires packaging design or engineering knowledge, problem-solving and communication skills; 2 years packaging experience and CAD experience are preferred.
SAP, SupplyOn, CAD
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1w
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Entry Level Packaging Systems Design Engineer I (Start Summer 2027)
Austin, Texas, United States
$78k-$82k/yr FieldFull Time
Dennis Group
Dennis Group: A design-build engineering firm and general contractor that plans, designs, engineers, and builds food and beverage processing facilities.
0+ YOEBachelor's degree in mechanical, packaging, industrial, or manufacturing engineering; 0–3 years of relevant work or schooling; MS Office, MS Project, and AutoCAD familiarity; strong communication and problem-solving skills.
Microsoft Office, Microsoft Project, AutoCAD
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Advanced Packaging Engineer
North America or California or Austin or Boston
$250k-$400k/yr HybridFull Time
Volantis Semiconductor
Volantis Semiconductor: Private semiconductor startup building photonically integrated computers and photonic interconnects for AI inference and data-center systems.
Experience designing or developing processes for complex packages; first-principles problem solving. Preferred: heterogeneous materials, high-TDP packages, compound semiconductors, optics, interposers, flip-chip integration, or large substrates.
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2w
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Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging
Tempe or Austin or Cupertino
$136k-$213k/yr OnsiteFull Time
Amazon
AmazonNASDAQ: AMZN: Multinational technology focused on e-commerce and cloud computing.
5+ YOEBachelor's degree in electrical engineering or related field and 5+ years of IC package layout and physical design experience. Requires package layout tools, advanced packaging, DFM, and physical verification expertise.
Cadence APD/SiP, Synopsys IC Packaging, Mentor Xpedition, Python, Perl, ARM, TCL, Skill, Ravel, DRC
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1mo
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AI Automation Design Packaging Lead
Austin, Texas, United States
$163k-$244k/yr HybridFull Time
AMD
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Technical leader to develop and deploy AI-driven packaging design automation. Requires bachelor's or master's in EE/CE/CS, experience with EDA tools, scripting (Python/Tcl/SKILL/C++), AI/ML frameworks, and cross-functional leadership.
Cadence APD/SIP, Siemens Xpedition, Synopsys 3DIC/Compiler, Python, Tcl, SKILL, C++, PyTorch, TensorFlow
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Materials Engineer, Packaging Product Design
Austin, Texas, United States
OnsiteFull Time
Apple
AppleNASDAQ: AAPL: Designing and manufacturing consumer electronics, software, and digital services.
Collaborates on structural packaging design and execution, balancing customer experience, product protection, sustainability, and cross-functional design requirements.
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1w
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Senior Packaging Technical Engineer - Hardware
Santa Clara or Texas or United States
$168k-$322k/yr HybridFull Time
NVIDIA
NVIDIANASDAQ: NVDA: Computing platform for AI and accelerated graphics.
8+ YOEBSEE or equivalent experience and 8+ years in board or system design. Package design preferred; knowledge of transmission lines, power delivery, signal integrity, and programming or scripting skills desired.
Perl, Python, Tcl, Cadence Skill, Microsoft Excel
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Package Design Methodology Engineer
Santa Clara or Austin or California
$136k-$265k/yr HybridFull Time
NVIDIA
NVIDIANASDAQ: NVDA: Computing platform for AI and accelerated graphics.
5+ YOEBS or equivalent and 5+ years developing package design flows; strong Python/C++ skills; experience applying AI/ML and LLMs in engineering workflows; solid VLSI package design fundamentals.
Python, C++, LLMs, EDA, AI/ML
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4w
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Package Design Engineer
San Jose or Austin or Fort Collins
$122k-$195k/yr OnsiteFull Time
Broadcom
BroadcomNASDAQ: AVGO: Designs and sells semiconductors and infrastructure software to enterprises.
6+ YOEBSEE with 8+ years or MSEE with 6+ years in flip-chip BGA package design; knowledge of package signal and power integrity; Cadence APD and Cadence SKILL experience preferred; project management and collaboration skills.
Cadence APD, Cadence SKILL
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1w
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ElectroMechanical Design Engineer Sr. (Harness Design)
Grand Prairie or Dallas
$85k-$158k/yr HybridFull Time
Lockheed Martin
Lockheed MartinNYSE: LMT: Global security and aerospace driving innovative defense solutions.
3+ YOEBachelor's degree with 3+ years of electromechanical engineering experience or 10+ years without a degree; CREO and Windchill, packaging design, technical data packages, GD&T, team management, US citizenship, and Secret clearance eligibility required.
Creo, Windchill, Microsoft Excel, Microsoft Word, Microsoft PowerPoint, AutoCAD, Zuken
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2mo
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Staff Package Design Engineer
Tempe or Austin
HybridFull Time
Renesas Electronics
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
4+ YOE4+ years package CAD/layout or substrate design experience, proficiency with Cadence Allegro Package Designer/SiP Layout or Siemens Xpedition, knowledge of DFM/DF A, SI/PI fundamentals, and collaboration with foundries/OSATs; Bachelor's in EE/microelectronics/materials preferred.
Cadence Allegro Package Designer / SiP Layout, Siemens Xpedition Substrate Integrator, Gerber
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1mo
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Package Design Methodology Engineer
Santa Clara or Austin or United States
$136k-$265k/yr HybridFull Time
NVIDIA
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
5+ YOEBS in CS/EE or equivalent,5+ years developing package design flows/methodologies,proficiency in Python and/or C++,knowledge of VLSI package electrical fundamentals,experience applying AI/ML or LLMs in engineering workflows.
Python, C++, LLMs, EDA
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1mo
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Principal Mechanical Design Engineer
Richardson or Dallas or Fort Worth
OnsiteFull Time
Qorvo
QorvoNASDAQ: QRVO: Designs and manufactures radio frequency and power semiconductor solutions.
12+ YOEBSME or MSME in mechanical engineering, 12+ years semiconductor packaging experience, expert ANSYS and SolidWorks, experience with microelectronic assembly and reliability methods, GD&T knowledge, strong communication and cross-functional skills; US Person required.
ANSYS, SolidWorks, FEA, CAD
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2mo
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Sr. Engineer, Package Design
Santa Clara or Austin or Toronto or New Taipei City
$100k-$500k/yr HybridFull Time
Tenstorrent
Tenstorrent: Designs and manufactures AI processors and RISC-V CPU solutions.
3+ YOE3+ years experience with Cadence Allegro PCB Designer, PCB routing and BGA design, signal and power integrity knowledge, strong communication and cross-discipline collaboration skills.
Cadence Allegro PCB Designer
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3mo
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Sr. IC Package Design Engineer (Silicon Engineering)
Austin or Irvine
OnsiteFull Time
SpaceX
SpaceX: Designs and launches advanced rockets and satellite internet constellations.
5+ YOEBachelor's degree in electrical/computer engineering or physics; 5+ years IC package design experience; strong SI/PI, RF, and CAD tool proficiency.
Cadence APD+/SIP, SIWave, HFSS, ADS, Package design tools
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4w
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Senior IC Package Design Engineer - TeraWave
San Diego or Austin or California
$230k-$323k/yr OnsiteFull Time
Blue Origin: Develops reusable rockets and systems for human spaceflight.
7+ YOEBachelor's in EE or related,7+ years industry experience delivering IC packaging,expertise with HFSS/EMX/Momentum,Cadence Allegro experience preferred,RF/mmWave and power/signal integrity expertise,U.S. work authorization required.
HFSS, EMX, Momentum, Cadence Allegro
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Design Specialist
Houston, Texas, United States
OnsiteFull Time
Air Liquide
Air LiquideEuronext Paris: AI: Supplies industrial gases, medical gases, and related technologies.
5+ YOEDeliver piping design and engineering packages for industrial and cryogenic systems; ensure code compliance (ASME, NFPA, CSA), prepare 3D/2D deliverables, BOMs, and construction support. Requires mechanical engineering education and piping design experience.
Intergraph Smart 3D, AutoCAD Plant 3D, AutoCAD, MicroStation, Navisworks
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3mo
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Design & Verification Engineer, Analog Power Management (7682) (Austin, TX, US)
Austin, Texas, United States
$120k-$170k/yr OnsiteFull Time
TSMC
TSMCNew York Stock Exchange: TSM: Manufactures advanced semiconductor integrated circuits for global technology companies.
7+ YOEMSEE with 7+ years in hands-on power management design/verification; SIMPLIS knowledge; PCB design/layout in PM; IC design/packaging familiarity; strong teamwork; power delivery modeling
SIMPLIS, PCB Design, Power Delivery Modeling
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