WingNASDAQ: GOOGL: Autonomous drone delivery service for small packages and logistics
5+ YOERequires 5+ years in packaging, mechanical design, or industrial design; advanced packaging and structural mechanics knowledge; CAD and palletization software expertise; testing, documentation, collaboration, and travel ability.
Amperesand: Manufactures solid-state transformers for AI data centers and grids.
3+ YOEBachelor's degree in mechanical engineering or related field, or equivalent experience; 3+ years designing component packaging from concept to production; expertise in CAD, CAE simulation, GD&T, tolerance analysis, and DFM/DFA.
CATIA, Solidworks, Ansys, Jira, Scrum, 3D EXPERIENCE, FEA
Delos Data: Building specialized interconnects and infrastructure optimized for AI inference.
B.S./M.S. in EE or related, expertise in multi-die package design and UCIe, substrate and SI/PI knowledge, experience with TSMC/OSAT and managing subcontractors; HFSS/Sigrity familiarity a plus.
Koch Inc.: Operates global manufacturing, refining, and industrial technology businesses.
10+ YOEPhD in a related field, 10+ years R&D experience in optoelectronic package design transferred to manufacturing, submicron optical alignment, FEA/thermal design, GR-468 qualification, NPI, and strong supplier/customer communication.
Cspeed IO: A stealth startup developing next-generation optical semiconductor solutions for AI infrastructure.
6+ YOE6+ years IC package physical design experience, BS/MS in electrical engineering, expertise in package layout tools, multi-die packaging, substrate stack-ups, DFM/DF A closure, and English fluency.
Gilead SciencesNASDAQ: GILD: Develops and sells medicines for life-threatening infectious diseases.
10+ YOEBachelor's degree in packaging or engineering plus 10 years of relevant industry experience and cGMP experience. Requires packaging engineering leadership, combination products, design controls, risk management, and regulatory knowledge.
ISO 11607, ISO 14971, FDA, EU MDR, 21 CFR, ASTM, ISTA, Workday
Form Energy: Developing multi-day batteries for grid-scale energy storage.
4+ YOESenior mechanical design engineer with 4+ years experience in high-volume electromechanical systems; strong CAD, thermal/structural analysis, and packaging expertise.
AmazonNASDAQ: AMZN: Multinational technology focused on e-commerce and cloud computing.
9+ YOE9+ years design or packaging program experience; end-to-end packaging development, BOM and POD labeling knowledge; strong cross-functional program management and travel availability.
Bill of Material (BOM), Print On Demand (POD), scrum
American Turbines: Building compact modular gas turbines for distributed power generation.
Experience designing packaged machinery and mechanical systems for field-deployable gensets/engines; design for manufacture, packaging to released drawings, and focus on footprint, cost, and serviceability.
OpenAI: Develops artificial intelligence models and generative AI software services.
5+ YOERequires 5+ years in signal integrity, power integrity, high-speed interconnects, PDN, and package electrical design, plus SI/PI simulation, package layout, and automated optimization experience.
Astro Mechanica: Building turboelectric jet engines for supersonic aircraft.
5+ YOE5+ years in turbomachinery design with rotordynamic analysis and mechanical packaging ownership on real hardware. Proficient in rotordynamic modelling tools and CAD.
Staff Software Engineer, Pricing and Packaging Engineering
San Francisco or Denver or New York City or San Jose
$197k-$247k/yrHybridFull Time
Gusto: Cloud-based payroll and HR software for small businesses.
8+ YOE8+ years building large-scale backend platform systems (commerce/billing/subscriptions preferred); strong distributed systems, API design, SLO, and mentorship experience; proven delivery of multi-quarter projects.
Candid Intelligence: AI software for pre-construction engineering and infrastructure planning.
7+ YOE7+ years at an EPC/PMC/owner-operator with strong FEED and early mechanical design experience; experience with equipment datasheets, vendor packages, ASME-driven equipment practices, and cross-discipline coordination.
Miami or Boston or Greensboro or Charlotte or Wilmington or Atlanta or Houston or Washington or San Francisco
$80k-$133k/yrHybridFull Time
ArcadisEuronext Amsterdam: ARCAD: Designing and engineering sustainable solutions for natural and built environments
BS in mechanical or fire protection engineering; US Fire Protection PE licensure; experience in IFC design packages for federal facilities; knowledge of NFPA, NEC, NESC, UL; fire alarm and suppression systems expertise; strong communication skills.
Revit, BIM, Autodesk Construction Cloud, AutoCAD, HydraCAD, Navisworks
AeroVect: Develops autonomous driving software for airport logistics vehicles.
4+ YOE4+ years mechanical design experience, proficiency with CAD and SolidWorks, DFM/DFA knowledge, prototyping and testing experience, understanding of structural/thermal/packaging for vehicle systems, strong problem-solving and collaboration.
Computational Electromagnetics Engineer – Signal Integrity
Palo Alto, California, United States
$180k-$210k/yrHybridFull Time
Vinci: AI software for rapid hardware design and physics simulation.
4+ YOERequires 4–8 years in computational electromagnetics for semiconductor packaging, PCB design, or high-speed electronics; C++ and/or Python; FDTD, FDFD, quasi-static methods; and production solver validation experience.
Austin or Boulder or Fremont or San Diego or Santa Clara or Wilsonville
$125k-$251k/yrHybridFull Time
SiemensXETRA: SIE: Manufactures industrial automation, infrastructure, and energy technology systems.
4+ YOEMSEE/BSEE and 4+ years of design experience with advanced IC package or interposer layout. Requires package design tools, scripting, Windows/Linux, and strong presentation and customer skills.
Innovator 3D IC Layout, Innovator3D IC Integrator, Xpedition, Calibre, HyperLynx, Cadence APD/SiP, Siemens XSI/i3DI, Cadence OrbitIO/ISP, Synopsys 3DIC Compiler, Microsoft Excel, TSMC InFO, CoWoS, Intel EMIB, Foveros, ASE FoCUS, Amkor SWIFT, Samsung I/H/X-Cube, Verilog, LEF/DEF, GDS, OASIS, Sigrity, SIWave, ADS, Microsoft Word, Microsoft PowerPoint, VBS, Python, Tcl, Perl, Windows, Linux