18 packaging design engineer jobs at 14 companies in Warwick, RI
1mo
Save
Mark Applied
Hide
1mo
IC Packaging Design & Layout Engineer
Cambridge, Massachusetts, United States
$82k-$220k/yrOnsiteFull Time
Draper: Independent research and development organization focused on national challenges.
5+ YOE5+ years in electrical engineering or related field; expertise in IC package architecture, high-speed layout, SI/PI analysis; proficiency with Siemens Xpedition and industry SI tools; BS in EE required (MS preferred).
Volantis Semiconductor: Private semiconductor startup building photonically integrated computers and photonic interconnects for AI inference and data-center systems.
Experience designing or developing processes for complex packages; first-principles problem solving. Preferred: heterogeneous materials, high-TDP packages, compound semiconductors, optics, interposers, flip-chip integration, or large substrates.
Volantis Semiconductor: Private semiconductor startup building photonically integrated computers and photonic interconnects for AI inference and data-center systems.
Experience designing, validating, and bringing up high-power-density, high-layer-count, large-format PCBs, with knowledge of chip-package interactions and design for manufacturing.
WHOOP: Wearable technology developing health and fitness tracking devices.
5+ YOEBS or MS in mechanical or industrial design engineering; 5+ years developing packaging at scale; SolidWorks CAD and Adobe Illustrator proficiency; experience with suppliers, manufacturing, prototyping, drawings, BOMs, and ECOs.
Galaxy Integrated Technologies: Privately owned commercial security and low-voltage systems integrator serving businesses, government, schools, and healthcare organizations.
Experienced in designing access control, CCTV/IP, intrusion detection systems; performing site surveys; developing design packages and construction documentation; coordinating with architects/MEP/IT; familiarity with applicable codes and standards.
CSL Behring: Global biotherapeutics leader driven by our promise to save lives.
5+ YOEBachelor's degree in engineering, life sciences, or related field; 5+ years in medical device, combination product, packaging, quality, or manufacturing; 2+ years in medical device R&D quality and design controls.
21 CFR Part 4, 21 CFR 820, ISO 13485, ISO 14971, FMEA, Design Controls
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
3+ YOEBS/MS in electrical or computer engineering with 3+ years experience; experience with SI/PI simulation, circuit extraction, scripting for automation; familiarity with semiconductor packaging and PCB design; strong communication skills; export-control eligibility.
CSL SeqirusASX: CSL: Global biotechnology developing biotherapies and vaccines.
5+ YOEBachelor’s degree in engineering or life sciences; 5+ years in medical devices, combination products, packaging, quality, or manufacturing; 2+ years in medical device R&D quality and design controls; knowledge of FDA, EU MDR, ISO 13485, and ISO 14971.
21 CFR Part 4, 21 CFR 820, ISO 13485, ISO 14971, EU MDR, FMEA
Centessa PharmaceuticalsNASDAQ: CNTA: Lilly-owned clinical-stage biopharmaceutical developing orexin receptor 2 agonists for patients with sleep-wake disorders.
8+ YOEBachelor’s degree in a related scientific or engineering field and 8–10 years of sponsor-side pharmaceutical packaging experience, including late-stage or commercial programs, technical leadership, technology transfer, and cGMP expertise.
AmazonNASDAQ: AMZN: Multinational technology focused on e-commerce and cloud computing.
4+ YOE4+ years mechanical engineering; packaging machinery development; 3D design and simulation; BS in Mechanical, Electrical, or Mechatronics; strong motion control experience.
IPG MedicalNasdaq Global Select Market: IPGP: The Global Leader in Fiber Laser Technology
10+ YOEBSME/MSME preferred; 10+ years in mechanical design for laser/optical/medical devices; strong PM/leadership; SOLIDWORKS with PDM; packaging, opto-mechanical, electronics interface; MS Office;
SOLIDWORKS, SOLIDWORKS PDM, MS Office, Visio, Project
Volantis Semiconductor: Private semiconductor startup building photonically integrated computers and photonic interconnects for AI inference and data-center systems.
Experience analyzing and designing power delivery networks for large-die, high-TDP chips and advanced nodes, with collaboration across package, ASIC, and microarchitecture teams.
Miami or Boston or Greensboro or Charlotte or Wilmington or Atlanta or Houston or Washington or San Francisco
$80k-$133k/yrHybridFull Time
ArcadisEuronext Amsterdam: ARCAD: Global design, engineering, and management consultancy for natural and built assets.
BS in mechanical or fire protection engineering; US Fire Protection PE licensure; experience in IFC design packages for federal facilities; knowledge of NFPA, NEC, NESC, UL; fire alarm and suppression systems expertise; strong communication skills.
Revit, BIM, Autodesk Construction Cloud, AutoCAD, HydraCAD, Navisworks
CSL SeqirusASX: CSL: Global biotechnology developing biotherapies and vaccines.
5+ YOEBachelor’s degree in engineering or life sciences; 5+ years in quality, packaging, engineering, or manufacturing for medical devices or combination products; expertise in design controls, risk management, validation, and global regulations.
Director, Project Development – Process & Packaging Systems
Alpharetta or Atlanta or Philadelphia or Fort Worth or Boston or St. Louis or Raleigh or Chicago
OnsiteFull Time
BW Design Group: Global supplier of manufacturing technology, engineering, and consulting services.
15+ YOE15+ years leading development and design of process and packaging systems for manufacturing; bachelor's in engineering/science/manufacturing required; ability to lead GMP facility design, manage project budgets, lead pursuit teams, and travel for client engagements.