86 packaging designer jobs at 46 companies in Aromas, CA

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Senior Packaging Engineer
Palo Alto, California, United States
$211k-$224k/yr OnsiteFull Time
Wing
WingNASDAQ: GOOGL: Autonomous drone delivery service for small packages and logistics
5+ YOERequires 5+ years in packaging, mechanical design, or industrial design; advanced packaging and structural mechanics knowledge; CAD and palletization software expertise; testing, documentation, collaboration, and travel ability.
ArtiosCAD, Esko, SolidWorks, CATIA, CAPE, TOPS, CAD
2mo
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Advanced Packaging Engineer
Mountain View, California, United States
$200k-$350k/yr OnsiteFull Time
DensityAI
DensityAI: Designing custom AI hardware accelerators for large language models.
10+ YOE10+ years in advanced multi-die packaging (SiP, CoWoS, EMIB, interposers); expertise in design layout, SI/PI, thermo-mechanical tradeoffs; hands-on with packaging flows for 2.5D/3D; ability to collaborate with architects; DFT/RTL/PD optional.
2mo
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Sr Packaging Engineer
Santa Clara, California, United States
$134k-$184k/yr OnsiteFull Time
Applied Materials
Applied MaterialsNASDAQ: AMAT: Produces equipment and services for chip and display manufacturing.
Packaging engineering experience with supplier management, test plan development, Design For Transportability (DFT), standards development, continuous improvement, and ability to train others; travel ~10%.
3mo
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Packaging Design Engineer I
San Jose or Hayward or Texas
OnsiteFull Time
TransPak: Packaging solutions provider
2+ YOEBachelor’s in mechanical/manufacturing/industrial/packaging engineering; 2-3 years mechanical/structural design experience; CAD (SolidWorks/AutoCAD); GD&T knowledge; packaging design and testing experience; strong communication.
SolidWorks, AutoCAD, NX, BOM, 3D modeling, 2D drawings, GD&T
2mo
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Principal Packaging Engineer
Palo Alto or United States or Canada
$180k-$240k/yr HybridFull Time
Delos Data
Delos Data: Building specialized interconnects and infrastructure optimized for AI inference.
B.S./M.S. in EE or related, expertise in multi-die package design and UCIe, substrate and SI/PI knowledge, experience with TSMC/OSAT and managing subcontractors; HFSS/Sigrity familiarity a plus.
HFSS, Sigrity, UCIe
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Senior, Packaging Design Engineer
Sunnyvale, California, United States
$163k-$199k/yr OnsiteFull Time
Intuitive
IntuitiveNASDAQ: ISRG: Robotic-assisted systems for minimally invasive surgery.
8+ YOE8+ years in medical device packaging design; BS in Packaging/Mechanical/Industrial Engineering; experience with thermoforming, pouch sealing, ISO11607, CFR 820; CAD (SolidWorks); travel; strong communication.
SolidWorks, FEA, Packaging testing tools, MS Office
2w
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Packaging Design Engineer
San Jose or San Diego
HybridFull Time
AMD
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Experienced package engineer with CAD/simulation tool proficiency, package/PCB layout and power integrity expertise, scripting ability, and engineering degree.
Cadence, SKILL, Ansys, AutoCAD
3w
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Principal Packaging Engineer, Optical Interfaces
Santa Clara, California, United States
$145k-$255k/yr OnsiteFull Time
nEye Systems
nEye Systems: Develops MEMS-based silicon photonics optical circuit switches for data centers.
10+ YOE10+ years packaging design experience for optical/photonic components, experience with PIC edge coupling, reliability engineering, CAD and FEA usage, and working with contract manufacturers.
CAD, FEA
1mo
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Staff Semi Packaging Engineer
San Jose, California, United States
$130k-$188k/yr OnsiteFull Time
Analog Devices
Analog DevicesNASDAQ: ADI: Designs and manufactures semiconductors for signal processing and power management.
3+ YOEMaster's in a relevant engineering field + ≥3 years industrial IC/package experience; expertise in analog IC package/module design, reliability and BOM selection, CAD modeling, and process development (FMEA, SPC, DOE); OSAT collaboration experience.
CAD
3mo
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Photonic Packaging Engineer, Principal
San Jose, California, United States
OnsiteFull Time
Astera Labs
Astera LabsNASDAQ: ALAB: Designs connectivity solutions for cloud and AI infrastructure.
10+ YOEPh.D. or M.S. in EE, Physics, Materials Science, Mechanical Engineering, or related field; 10+ years in photonic packaging or related areas; strong expertise in high-speed packaging, thermal management, and optomechanical design.
1mo
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Advanced Packaging Design Engineer
Santa Clara or Chandler
$192k-$287k/yr OnsiteFull Time
Marvell
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
5+ YOEBS/MS/PhD in engineering,5-10 years advanced packaging design experience, expertise with Cadence APD, high-speed interfaces, substrate and assembly processes, and cross-functional collaboration.
Cadence APD, AutoCAD
2mo
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Sr Principal Laser Packaging Engineer
Fremont, California, United States
$200k-$280k/yr OnsiteFull Time
Koch Inc.
Koch Inc.: Operates global manufacturing, refining, and industrial technology businesses.
10+ YOEPhD in a related field, 10+ years R&D experience in optoelectronic package design transferred to manufacturing, submicron optical alignment, FEA/thermal design, GR-468 qualification, NPI, and strong supplier/customer communication.
Finite Element Analysis (FEA), CFD
2d
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Packaging Design Engineer, Platforms Infrastructure Engineering
Sunnyvale, California, United States
$159k-$230k/yr OnsiteFull Time
Google
GoogleNASDAQ: GOOGL: Provides online search, advertising, cloud computing, and consumer electronics.
5+ YOEBachelor's degree or equivalent practical experience, 5+ years in hardware or consumer-goods packaging design, ISTA and ASTM D4169 experience, and CAD proficiency. CPP, master's degree, and 8 years' experience preferred.
ISTA, ASTM D4169, computer-aided design (CAD), Creo, NX, SolidWorks, TOPS, CAPE, FEA
1mo
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Senior Engineering Program Manager – Device Packaging, Devices & Services Experience Design
Sunnyvale or San Francisco
$156k-$212k/yr OnsiteFull Time
Amazon
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
9+ YOE9+ years design or packaging program experience; end-to-end packaging development, BOM and POD labeling knowledge; strong cross-functional program management and travel availability.
Bill of Material (BOM), Print On Demand (POD), scrum
1mo
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Senior Fiber Optic Module Packaging Engineer
Sunnyvale, California, United States
$92k-$150k/yr OnsiteFull Time
Coherent
CoherentNYSE: COHR: Manufactures lasers, engineered materials, and optical networking components.
2+ YOEBS/MS in telecom/optomechanical engineering, physics or related; minimum 2 years' related experience; SolidWorks and MS Office proficiency; experience with telecom fibers, materials selection, packaging design, testing, and manufacturing transfer.
SolidWorks, Word, Excel, Outlook, PowerPoint
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Materials Engineer, Packaging Product Design
Cupertino, California, United States
OnsiteFull Time
Apple
AppleNASDAQ: AAPL: Designs and sells consumer electronics, software, and online services.
Design and execute structural packaging for Apple products while protecting products during shipping and advancing sustainability goals; collaborate across design, marketing, environmental, and operations teams.
3mo
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Software Engineer 6 - Ads Pricing & Packaging
Los Gatos or New York
$499k-$900k/yr OnsiteFull Time
Netflix
NetflixNASDAQ: NFLX: Provider of global streaming entertainment and video content.
10+ YOE10+ years software development experience (5+ years on inventory management); expertise in yield optimization, dynamic pricing, auction mechanics, rate card and packaging systems; API and data model design; technical leadership and strong communication.
VAST, OpenRTB
2mo
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ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)
San Jose or Research Triangle Park or Acton or Dallas or Tempe or Cary or Carlsbad or Colorado Springs
$184k-$264k/yr RemoteFull Time
Cisco
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
3+ YOEBachelor's/MS/PhD in Electrical Engineering with 3+ to 8+ years SI/PI experience; expertise in high-speed design, SI/PI simulation, layout review, SPICE; mentoring and leadership experience.
Cadence Sigrity, Ansys HFSS, Keysight ADS, Cadence APD, Ansys EM, SPICE, Vector Network Analysis, IBIS
2mo
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Senior Signal Integrity Engineer – LPU Packaging
Santa Clara, California, United States
$168k-$311k/yr HybridFull Time
NVIDIA
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
8+ YOEBS/MS/PhD in EE or equivalent, 8+ years in signal integrity/high-speed interconnects, SerDes/channel design, electromagnetics, simulation-to-measurement correlation using VNA/TDR/scope, and experience with industry SI tools.
Ansys HFSS, SIwave, Cadence Sigrity, ADS, HSPICE, IBIS-AMI, S-parameters, VNA, TDR, oscilloscope
1mo
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Staff Software Engineer, Pricing and Packaging Engineering
San Francisco or Denver or New York City or San Jose
$197k-$247k/yr HybridFull Time
Gusto
Gusto: Cloud-based payroll and HR software for small businesses.
8+ YOE8+ years building large-scale backend platform systems (commerce/billing/subscriptions preferred); strong distributed systems, API design, SLO, and mentorship experience; proven delivery of multi-quarter projects.