41 packaging designer jobs at 26 companies in Chandler, AZ
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Package Designer
Phoenix or United States
HybridFull Time
PetSmart: Retailer of pet supplies, food, and grooming services.
2+ YOEBachelor’s in Graphic Design; 2+ years package design; strong typography, color, layout; production and printing knowledge; proficient in Adobe CC.
Adobe Creative Cloud, Illustrator, Photoshop, InDesign, DAM systems, FTP
StrykerNYSE: SYK: Manufactures medical devices and equipment for healthcare providers.
2+ YOEDesign and test sterile packaging for medical devices; packaging validation; cross-functional collaboration; 2+ years in regulated packaging environment.
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
5+ YOEBS/MS/PhD in engineering,5-10 years advanced packaging design experience, expertise with Cadence APD, high-speed interfaces, substrate and assembly processes, and cross-functional collaboration.
Arizona Public ServiceNYSE: PNW: Provides electric utility services to customers throughout Arizona.
2+ YOEPrepare and modify plant design change packages, gather and develop engineering data, support design documents and walk‑downs; requires CADD coursework and design experience.
Maverick Power: Designing and manufacturing modular, mission-critical power distribution systems.
2+ YOE2+ years creating electrical drawing packages for power distribution and switchgear; experience with CAD, PDM/PLM/ERP, BOM development, and manufacturing documentation.
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
10+ YOEMaster's in EE/ME, 10+ years PCB layout with Cadence Allegro and Cadence Constraint Manager, 5+ years hardware development (schematic, SI, power delivery), PCB manufacturability and DRC expertise, strong analytical and collaboration skills.
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
5+ YOEBachelor's degree in electrical engineering or related field and 5+ years of IC package layout and physical design experience. Requires package layout tools, advanced packaging, DFM, and physical verification expertise.
HCLTechNational Stock Exchange of India: HCLTECH: Global provider of information technology services and software consulting.
10+ YOEBachelor's or Master's in Electrical/Electronics Engineering; ~10+ years IC packaging/package design for senior level (4–6+ years mid); hands-on experience with Siemens (Mentor) Xpedition or Cadence Allegro/APD, physical/substrate design, SI/PI-aware design, DFM and design rule compliance.
ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)
San Jose or Research Triangle Park or Acton or Dallas or Tempe or Cary or Carlsbad or Colorado Springs
$184k-$264k/yrRemoteFull Time
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
3+ YOEBachelor's/MS/PhD in Electrical Engineering with 3+ to 8+ years SI/PI experience; expertise in high-speed design, SI/PI simulation, layout review, SPICE; mentoring and leadership experience.
Phoenix or Arizona or Illinois or New Jersey or New York
RemoteMultiple Commitments Available
OGeez! Brands: Produces and distributes cannabis-infused gummies and confectionery products.
8+ YOE8+ years in branding, packaging, and creative direction for consumer goods; portfolio required; Adobe Creative Suite proficiency; experience with packaging, dielines, production, vendor management, and creative strategy.
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
4+ YOE4+ years package CAD/layout or substrate design experience (6+ preferred); strong background in FCBGA, SiP, WLCSP, power modules; proficiency with Cadence Allegro Package Designer or Siemens Xpedition; BS/MS in EE, microelectronics, materials, or related field.
HDR: Global firm providing architecture, engineering, and environmental services.
Bachelor's degree; EIT preferred; experience in bridge/structural design; familiarity with engineering software packages listed; proficient in MS Office and AutoCAD.
Advanced Process Chemical Design & Permit Engineer (TSMC Project)
Phoenix, Arizona, United States
HybridFull Time
Marketech InternationalTaiwan Stock Exchange: 6196: Provides turnkey facility integration and engineering for semiconductor plants.
2+ YOE2+ years in design/permitting/project engineering for chemical/utility/MEP systems; experience preparing construction drawings, permit packages, AHJ coordination; proficiency with AutoCAD, Bluebeam, Revit; strong organization and communication.
Propelis: Global agency for brand packaging, creative, and production solutions.
Requires Adobe Illustrator with Esko plug-ins, packaging artwork and print-process knowledge, brand-guideline compliance, attention to detail, and deadline management; graphic design graduates considered.
Sargent & Lundy: Engineering and consulting services for the power industry.
8+ YOEABET-accredited BS in Electrical Engineering; minimum 8 years electrical design experience (nuclear power plant experience preferred); experience with LV/MV systems, design change packages, calculations, vendor interfacing; ability to be badged for unescorted nuclear access; PE and MS preferred.
AdvantestTokyo Stock Exchange: 6857: Manufacturer of automated test systems for the semiconductor industry.
15+ YOE15+ years leadership in semiconductor/interconnect/advanced packaging; deep SI/PI and socket/interconnect design expertise; proven R&D-to-HVM scaling; executive global engineering leadership; DFA and factory automation experience.
CommonSpirit Health: Large non-profit healthcare system providing hospital and medical services.
Doctor of Medicine (MD) or Ph.D. required; experience with statistical packages (R or Stata); proven research design, execution, manuscript and grant contribution; preferred 5 years post-degree research/data analysis and epidemiology background.