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42 packaging designer jobs at 26 companies in Phoenix, AZ

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Package Designer
Phoenix or United States
HybridFull Time
PetSmart
PetSmart: Retailer of pet supplies, food, and grooming services.
2+ YOEBachelor’s in Graphic Design; 2+ years package design; strong typography, color, layout; production and printing knowledge; proficient in Adobe CC.
Adobe Creative Cloud, Illustrator, Photoshop, InDesign, DAM systems, FTP
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Senior Medical Packaging Engineer
Tempe, Arizona, United States
$78k-$130k/yr HybridFull Time
Stryker
StrykerNYSE: SYK: Manufactures medical devices and equipment for healthcare providers.
2+ YOEDesign and test sterile packaging for medical devices; packaging validation; cross-functional collaboration; 2+ years in regulated packaging environment.
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Package Designer
Phoenix, Arizona, United States
HybridFull Time
PetSmart
PetSmart: Retailer of pet food, supplies, and professional pet services.
2+ YOE2+ years in package design; bachelor’s in graphic design or related field; strong typography and layout skills; proficient with Adobe CC.
Microsoft Office, Adobe Illustrator, Adobe Photoshop, Adobe InDesign, DAM, FTP, Server file management
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3w
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Advanced Packaging Design Engineer
Santa Clara or Chandler
$192k-$287k/yr OnsiteFull Time
Marvell
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
5+ YOEBS/MS/PhD in engineering,5-10 years advanced packaging design experience, expertise with Cadence APD, high-speed interfaces, substrate and assembly processes, and cross-functional collaboration.
Cadence APD, AutoCAD
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2w
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Designer I/II
Casa Grande, Arizona, United States
OnsiteFull Time
Arizona Public Service
Arizona Public ServiceNYSE: PNW: Provides electric utility services to customers throughout Arizona.
2+ YOEPrepare and modify plant design change packages, gather and develop engineering data, support design documents and walk‑downs; requires CADD coursework and design experience.
CADD, Windows
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Electrical Designer
Phoenix, Arizona, United States
OnsiteFull Time
Maverick Power
Maverick Power: Designing and manufacturing modular, mission-critical power distribution systems.
2+ YOE2+ years creating electrical drawing packages for power distribution and switchgear; experience with CAD, PDM/PLM/ERP, BOM development, and manufacturing documentation.
SolidWorks Electrical Schematic, SolidWorks Electrical 3D, SOLIDWORKS PDM, AutoCAD Electrical, EPLAN, Autodesk Inventor Cable and Harness, Inventor Electrical, PDM, PLM, ERP
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Packaging Module Development Engineer
Phoenix or Chandler
$115k-$220k/yr HybridFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
1+ YOEPhD or Master's in engineering/physics/materials,1+ year experience in mechanical design/equipment development,strong experimental and prototype background,publication record for PhD candidates.
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Pipe Designer (Phoenix, AZ) - Austin Industrial
Phoenix, Arizona, United States
OnsiteFull Time
Austin Industries
Austin Industries: Provides civil, commercial, and industrial construction and maintenance services.
3+ YOE3+ years piping design experience in industrial construction; proficiency with PDMS, E3D, AutoCAD Plant 3D, SmartPlant 3D or CADWorx; ability to interpret P&IDs, produce isometrics, BOMs and fabrication packages.
PDMS, E3D, AutoCAD Plant 3D, CADWorx, SmartPlant 3D
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Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging
Tempe or Austin or Cupertino
$136k-$213k/yr OnsiteFull Time
Amazon
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
5+ YOEBachelor's degree in electrical engineering or related field and 5+ years of IC package layout and physical design experience. Requires package layout tools, advanced packaging, DFM, and physical verification expertise.
Cadence APD/SiP, Synopsys IC Packaging, Mentor Xpedition, Python, Perl, ARM, TCL, Skill, Ravel, DRC
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Senior Design Lead (122083)
Chandler or Hillsboro
OnsiteContract
HCLTech
HCLTechNational Stock Exchange of India: HCLTECH: Global provider of information technology services and software consulting.
10+ YOEBachelor's or Master's in Electrical/Electronics Engineering; ~10+ years IC packaging/package design for senior level (4–6+ years mid); hands-on experience with Siemens (Mentor) Xpedition or Cadence Allegro/APD, physical/substrate design, SI/PI-aware design, DFM and design rule compliance.
Siemens (Mentor) Xpedition (XPD), Cadence Allegro, Advanced Package Designer (APD / SiP)
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ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)
San Jose or Research Triangle Park or Acton or Dallas or Tempe or Cary or Carlsbad or Colorado Springs
$184k-$264k/yr RemoteFull Time
Cisco
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
3+ YOEBachelor's/MS/PhD in Electrical Engineering with 3+ to 8+ years SI/PI experience; expertise in high-speed design, SI/PI simulation, layout review, SPICE; mentoring and leadership experience.
Cadence Sigrity, Ansys HFSS, Keysight ADS, Cadence APD, Ansys EM, SPICE, Vector Network Analysis, IBIS
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​Fractional Creative Director
Phoenix or Arizona or Illinois or New Jersey or New York
RemoteMultiple Commitments Available
OGeez! Brands
OGeez! Brands: Produces and distributes cannabis-infused gummies and confectionery products.
8+ YOE8+ years in branding, packaging, and creative direction for consumer goods; portfolio required; Adobe Creative Suite proficiency; experience with packaging, dielines, production, vendor management, and creative strategy.
Adobe Creative Suite
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Staff Package Design Engineer
Plano or Austin or Tempe
HybridFull Time
Renesas Electronics
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
4+ YOE4+ years in package CAD layout, substrate design, or advanced packaging; package design tools; semiconductor packaging, design rules, manufacturing, SI/PI, routing, and cross-functional engineering experience.
Cadence Allegro Package Designer, SiP Layout, Siemens Xpedition Substrate Integrator, Gerber
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SOC Design Engineer
Chandler or Cambridge
$198k-$268k/yr HybridFull Time
Arm
ArmNASDAQ: ARM: Designs and licenses processor architectures and semiconductor intellectual property.
Experienced electronics engineer with PCB and silicon package co-design expertise, high-speed design, SI/PI analysis, PCB fabrication, EDA tools, and embedded compute systems knowledge.
PCIe, LPDDR, PTH, HDI, VIA, Cadence OrCAD, Cadence Allegro, ANSYS, Siemens EDA
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3mo
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Bridge Coordinator/EIT
Phoenix, Arizona, United States
OnsiteFull Time
HDR
HDR: Global firm providing architecture, engineering, and environmental services.
Bachelor's degree; EIT preferred; experience in bridge/structural design; familiarity with engineering software packages listed; proficient in MS Office and AutoCAD.
LEAP Bridge Enterprise, FB-MultiPier, LPile, AASHTOWare BrR, midas Civil, MDX, SAP2000, CSiBridge, ADINA, RM Bridge, spColumn, LUSAS, STLBridgeLRFD, STLBridge, Bluebeam Revu, AutoCAD, OpenBridge Modeler, InfraWorks, Civil3D
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Advanced Process Chemical Design & Permit Engineer (TSMC Project)
Phoenix, Arizona, United States
HybridFull Time
Marketech International
Marketech InternationalTaiwan Stock Exchange: 6196: Provides turnkey facility integration and engineering for semiconductor plants.
2+ YOE2+ years in design/permitting/project engineering for chemical/utility/MEP systems; experience preparing construction drawings, permit packages, AHJ coordination; proficiency with AutoCAD, Bluebeam, Revit; strong organization and communication.
AutoCAD, Bluebeam, Revit
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Package Project Lead 1
Hartford or Indianapolis or Phoenix or Raleigh or Richardson
$102k-$164k/yr OnsiteFull Time
Infosys
InfosysNYSE: INFY: Provides IT consulting, software development, and business outsourcing services.
Bachelor's degree or equivalent, experience with Oracle CX Cloud (Fusion Service Cloud, Engagement Cloud), BI Publisher, Groovy scripting, integrations and full project lifecycle; ability to design solutions, configure and deploy Oracle Cloud packages; US work authorization required.
Oracle CX Cloud, Fusion Service Cloud, Engagement Cloud, BI Publisher, Oracle Order Management Cloud, Subscription Management Cloud, Oracle Inventory Cloud, Oracle Maintenance Cloud, Oracle Service Logistics Cloud, Oracle Cloud, Application Composer, Page Composer, Groovy Scripting, Redwood UX, Visual Builder, Webservices
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Senior Electrical Engineer 2 - Nuclear
Phoenix, Arizona, United States
$100k-$153k/yr HybridFull Time
Sargent & Lundy
Sargent & Lundy: Engineering and consulting services for the power industry.
8+ YOEABET-accredited BS in Electrical Engineering; minimum 8 years electrical design experience (nuclear power plant experience preferred); experience with LV/MV systems, design change packages, calculations, vendor interfacing; ability to be badged for unescorted nuclear access; PE and MS preferred.
Python, MATLAB, Microsoft Excel
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Facilities Engineer II
Scottsdale, Arizona, United States
$61k-$123k/yr OnsiteFull Time
Abbott
AbbottNYSE: ABT: Manufactures medical devices, diagnostics, and nutritional health products.
1+ YOEAssociates degree, 1+ years facilities experience (3+ preferred), AutoCAD proficiency, ability to plan/design layouts, estimate costs, prepare bid packages, and lead small-to-mid facility projects.
AutoCAD
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2w
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Chief Technology Officer (CTO) – AIS
Chandler, Arizona, United States
$165k-$255k/yr OnsiteFull Time
Advantest
AdvantestTokyo Stock Exchange: 6857: Manufacturer of automated test systems for the semiconductor industry.
15+ YOE15+ years leadership in semiconductor/interconnect/advanced packaging; deep SI/PI and socket/interconnect design expertise; proven R&D-to-HVM scaling; executive global engineering leadership; DFA and factory automation experience.
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