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87 packaging designer jobs at 50 companies in Tracy, CA

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Sr. Industrial Designer (Packaging)
Milpitas or Irvine
$121k-$172k/yr HybridFull Time
Sandisk
SandiskNasdaq: SNDK: Designs and manufactures flash memory and data storage products.
5+ YOE5-7+ years packaging design for high-volume consumer products; bachelor’s in industrial design; strong 3D CAD (SolidWorks), rendering (Keyshot); knowledge of packaging materials, sustainability, and manufacturability.
SolidWorks, Keyshot, Adobe Creative Cloud
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Sr Packaging Engineer
Santa Clara, California, United States
$134k-$184k/yr OnsiteFull Time
Applied Materials
Applied MaterialsNASDAQ: AMAT: Manufacturers of equipment for semiconductor and display production.
Experience in packaging engineering including supplier management, test plan development and lab testing, Design for Transportability (DFT), packaging standards, continuous improvement, and ability to lead projects.
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Advanced Packaging Engineer
Mountain View, California, United States
$200k-$350k/yr OnsiteFull Time
DensityAI
DensityAI: Designing custom AI hardware accelerators for large language models.
10+ YOE10+ years in advanced multi-die packaging (SiP, CoWoS, EMIB, interposers); expertise in design layout, SI/PI, thermo-mechanical tradeoffs; hands-on with packaging flows for 2.5D/3D; ability to collaborate with architects; DFT/RTL/PD optional.
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Category Graphic Designer - Contractor
Atlanta or Walnut Creek
HybridContract
Central Garden & Pet
Central Garden & PetNASDAQ: CENT: Manufacturer and distributor of lawn, garden, and pet products.
3+ YOE3+ years packaging/graphic design experience in CPG or retail, strong stakeholder partnership and project management, proficiency in Adobe Creative Suite and Wrike, bachelor's degree or equivalent, portfolio required.
Adobe Creative Suite, Wrike
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Sr Packaging Engineer
Santa Clara, California, United States
$134k-$184k/yr OnsiteFull Time
Applied Materials
Applied MaterialsNASDAQ: AMAT: Produces equipment and services for chip and display manufacturing.
Packaging engineering experience with supplier management, test plan development, Design For Transportability (DFT), standards development, continuous improvement, and ability to train others; travel ~10%.
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2mo
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Packaging Design Engineer I
San Jose or Hayward or Texas
OnsiteFull Time
TransPak: Packaging solutions provider
2+ YOEBachelor’s in mechanical/manufacturing/industrial/packaging engineering; 2-3 years mechanical/structural design experience; CAD (SolidWorks/AutoCAD); GD&T knowledge; packaging design and testing experience; strong communication.
SolidWorks, AutoCAD, NX, BOM, 3D modeling, 2D drawings, GD&T
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Lead Packaging Engineer
Palo Alto or Los Angeles or Boston or Chicago or Sydney
$200k-$260k/yr OnsiteFull Time
Diraq
Diraq: Builds scalable quantum processors using silicon CMOS technology.
Bachelor's in engineering or materials science, significant semiconductor packaging experience, expertise in PCB/substrate and mechanical design, failure analysis, thermal management, and delivering scalable hardware from concept to manufacturing.
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Principal Packaging Engineer
Palo Alto or United States or Canada
$180k-$240k/yr HybridFull Time
Delos Data
Delos Data: Building specialized interconnects and infrastructure optimized for AI inference.
B.S./M.S. in EE or related, expertise in multi-die package design and UCIe, substrate and SI/PI knowledge, experience with TSMC/OSAT and managing subcontractors; HFSS/Sigrity familiarity a plus.
HFSS, Sigrity, UCIe
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Senior, Packaging Design Engineer
Sunnyvale, California, United States
$163k-$199k/yr OnsiteFull Time
Intuitive
IntuitiveNASDAQ: ISRG: Robotic-assisted systems for minimally invasive surgery.
8+ YOE8+ years in medical device packaging design; BS in Packaging/Mechanical/Industrial Engineering; experience with thermoforming, pouch sealing, ISO11607, CFR 820; CAD (SolidWorks); travel; strong communication.
SolidWorks, FEA, Packaging testing tools, MS Office
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Memory Packaging Engineer
Santa Clara or United States
OnsiteFull Time
Apple
AppleNASDAQ: AAPL: Designs and sells consumer electronics, software, and online services.
10+ YOEBS and 10+ years of relevant industry experience; MS/PhD preferred with 10+ years in memory packaging design and assembly.
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2w
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Senior IC Packaging Engineer
Hillsboro or Redmond or Mountain View or Raleigh or Austin
$120k-$235k/yr HybridFull Time
Microsoft
MicrosoftNASDAQ: MSFT: Develops software, services, devices, and cloud computing solutions.
1+ YOEAdvanced IC packaging expertise with experience in 2.5D/3D packaging, substrate/interposer design, supplier management, reliability assessment, and EDA/PCB layout tools; advanced degree or equivalent experience required.
Cadence Allegro
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Principal Packaging Engineer, Optical Interfaces
Santa Clara, California, United States
$145k-$255k/yr OnsiteFull Time
nEye Systems
nEye Systems: Develops MEMS-based silicon photonics optical circuit switches for data centers.
10+ YOE10+ years packaging design experience for optical/photonic components, experience with PIC edge coupling, reliability engineering, CAD and FEA usage, and working with contract manufacturers.
CAD, FEA
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Staff Semi Packaging Engineer
San Jose, California, United States
$130k-$188k/yr OnsiteFull Time
Analog Devices
Analog DevicesNASDAQ: ADI: Designs and manufactures semiconductors for signal processing and power management.
3+ YOEMaster's in a relevant engineering field + ≥3 years industrial IC/package experience; expertise in analog IC package/module design, reliability and BOM selection, CAD modeling, and process development (FMEA, SPC, DOE); OSAT collaboration experience.
CAD
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2mo
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Photonic Packaging Engineer, Principal
San Jose, California, United States
OnsiteFull Time
Astera Labs
Astera LabsNASDAQ: ALAB: Designs connectivity solutions for cloud and AI infrastructure.
10+ YOEPh.D. or M.S. in EE, Physics, Materials Science, Mechanical Engineering, or related field; 10+ years in photonic packaging or related areas; strong expertise in high-speed packaging, thermal management, and optomechanical design.
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1w
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Advanced Packaging Design Engineer
Santa Clara or Chandler
$192k-$287k/yr OnsiteFull Time
Marvell
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
5+ YOEBS/MS/PhD in engineering,5-10 years advanced packaging design experience, expertise with Cadence APD, high-speed interfaces, substrate and assembly processes, and cross-functional collaboration.
Cadence APD, AutoCAD
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3mo
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Advanced Optical Packaging Design Tech Lead
San Jose, California, United States
$211k-$356k/yr OnsiteFull Time
MediaTek
MediaTekTaiwan Stock Exchange: 2454: Designs and develops system-on-chip solutions for electronic devices.
7+ YOEMaster's/PhD in engineering or related field with 7+ years in semiconductor/optoelectronic packaging, expertise in substrate design, hybrid bonding, warpage analysis, signal integrity, and cross-functional production enablement.
Cadence APD/Allegro, ANSYS, HFSS, CST, KLayout, COMSOL
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Senior Engineering Program Manager – Device Packaging, Devices & Services Experience Design
Sunnyvale or San Francisco
$156k-$212k/yr OnsiteFull Time
Amazon
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
9+ YOE9+ years design or packaging program experience; end-to-end packaging development, BOM and POD labeling knowledge; strong cross-functional program management and travel availability.
Bill of Material (BOM), Print On Demand (POD), scrum
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2mo
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Associate Creative Director, Packaging & Print
Oakland, California, United States
$107k-$252k/yr HybridFull Time
Clorox
CloroxNew York Stock Exchange: CLX: Manufactures and markets consumer cleaning and wellness products.
8+ YOE8+ years hands-on creative, art direction and design strategy for top consumer brands; strong portfolio across omni-channel; proactive leadership in packaging concepts.
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2w
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Senior Fiber Optic Module Packaging Engineer
Sunnyvale, California, United States
$92k-$150k/yr OnsiteFull Time
Coherent
CoherentNYSE: COHR: Manufactures lasers, engineered materials, and optical networking components.
2+ YOEBS/MS in telecom/optomechanical engineering, physics or related; minimum 2 years' related experience; SolidWorks and MS Office proficiency; experience with telecom fibers, materials selection, packaging design, testing, and manufacturing transfer.
SolidWorks, Word, Excel, Outlook, PowerPoint
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3mo
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Package Architect – Advanced Packaging & System Exploration
Boise or San Jose
$177k-$387k/yr OnsiteFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Manufacturer of semiconductor memory and data storage products.
10+ YOEBachelor's in EE/ME/Materials or equivalent, 10+ years in package design or package-level simulation, strong package SI modeling and analysis experience, ability to build models and derive architecture guidance.
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