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60 packaging developer jobs at 34 companies in Chandler, AZ

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Packaging Process Engineer – Microdisplay
Chandler, Arizona, United States
$142k-$214k/yr OnsiteFull Time
Snap
SnapNYSE: SNAP: Develops social media applications and augmented reality technology.
7+ YOEBS in Electrical, Materials, or Mechanical Engineering; 7+ years in process or packaging engineering; experience with automated packaging equipment and semiconductor/display production; travel up to ~10%
Automated packaging equipment, DOE, SPC, ISO 5 cleanroom
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Packaging Process Engineer – Microdisplay
Chandler, Arizona, United States
$135k-$203k/yr OnsiteFull Time
Snap
SnapNYSE: SNAP: Provides visual messaging software and augmented reality wearable devices.
7+ YOEBS in engineering; 7+ years in process/packaging in microfabrication; experience with automated packaging equipment; ISO 5 cleanroom experience; travel up to 10%; proficiency with DOE/SPC.
Automated packaging equipment, DOE, SPC, ISO 5 cleanroom, Six Sigma
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Packaging Module Development Engineer
Phoenix, Arizona, United States
$115k-$220k/yr OnsiteFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
3+ YOEMaster's degree in Mechanical, Materials, Electrical Engineering, Physics/Applied Physics or related; 3+ years experience or PhD; programming (Python, MATLAB); AI/ML; semiconductor packaging experience; onsite presence.
Python, MATLAB, Artificial Intelligence, Machine Learning
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1w
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Advanced Packaging Design Engineer
Santa Clara or Chandler
$192k-$287k/yr OnsiteFull Time
Marvell
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
5+ YOEBS/MS/PhD in engineering,5-10 years advanced packaging design experience, expertise with Cadence APD, high-speed interfaces, substrate and assembly processes, and cross-functional collaboration.
Cadence APD, AutoCAD
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3w
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Sr. Package Layout Engineer, Annapurna Labs - AI Silicon Packaging
Tempe or Austin or Cupertino
$159k-$248k/yr OnsiteFull Time
Amazon
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
10+ YOEBachelor's in EE or related, 10+ years IC package layout and physical design experience, expertise with advanced packaging (2.5D/3D, WLP, RDL, TSV), package DRC/DFM, and collaboration with SI/PI and manufacturing teams.
Cadence APD/SiP, Synopsys IC Packaging, Mentor Xpedition, Python, TCL, Skill, Ravel
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Principal Engineer, Electrical Engineering – Advanced Packaging
Phoenix, Arizona, United States
OnsiteFull Time
ASM
ASMEuronext Amsterdam: ASM: Designs and manufactures advanced semiconductor wafer processing equipment.
10+ YOEBachelor's degree in Electrical Engineering, 10+ years in semiconductor capital equipment, expertise in RF/motion/power/safety systems, knowledge of SEMI/CE/UL/EMC, experience with requirements management and FMEA, proven technical leadership.
PLC, DFMEA, FMEA
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Advanced Packaging Principal Integration Technologist
Tempe or United States
$179k-$288k/yr OnsiteFull Time
Merck
MerckXETRA: MRK: A science and technology providing healthcare, life science, and electronics solutions.
10+ YOEMSc or higher in engineering, 10+ years 300mm process/equipment R&D experience in advanced packaging, 7+ years external business development experience, consortium engagement preferred, strong equipment/process/integration knowledge and ecosystem network. US work authorization required.
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Package Development/NPI Engineer
San Jose or Chandler
$180k-$301k/yr OnsiteFull Time
MediaTek
MediaTekTaiwan Stock Exchange: 2454: Designs and develops system-on-chip solutions for electronic devices.
8+ YOE8+ years in package development and NPI for semiconductors; expertise in advanced packaging (EMIB, 2.5D/3D/3.5D, FCBGA, HBM); qualification, reliability, failure analysis, yield improvement, and cross-functional project management.
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Sr Staff Package Design Engineer
Tempe, Arizona, United States
OnsiteFull Time
Renesas Electronics
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
10+ YOE10+ years experience in package development for power SiP/module, wafer-level and flip-chip LGA packaging; strong analytical, communication, and process integration skills.
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ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)
San Jose or Research Triangle Park or Acton or Dallas or Tempe or Cary or Carlsbad or Colorado Springs
$184k-$264k/yr RemoteFull Time
Cisco
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
3+ YOEBachelor's/MS/PhD in Electrical Engineering with 3+ to 8+ years SI/PI experience; expertise in high-speed design, SI/PI simulation, layout review, SPICE; mentoring and leadership experience.
Cadence Sigrity, Ansys HFSS, Keysight ADS, Cadence APD, Ansys EM, SPICE, Vector Network Analysis, IBIS
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Senior Design Lead (122083)
Chandler or Hillsboro
OnsiteContract
HCLTech
HCLTechNational Stock Exchange of India: HCLTECH: Global provider of information technology services and software consulting.
10+ YOEBachelor's or Master's in Electrical/Electronics Engineering; ~10+ years IC packaging/package design for senior level (4–6+ years mid); hands-on experience with Siemens (Mentor) Xpedition or Cadence Allegro/APD, physical/substrate design, SI/PI-aware design, DFM and design rule compliance.
Siemens (Mentor) Xpedition (XPD), Cadence Allegro, Advanced Package Designer (APD / SiP)
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Senior Electrical Engineer - United States
Bedminster or Houston or Katy or Scottsdale
$120k-$150k/yr OnsiteFull Time
Koch Inc.
Koch Inc.: Operates global manufacturing, refining, and industrial technology businesses.
Applied knowledge of electrical codes and standards, power infrastructure design experience, ability to develop electrical drawing packages for PV and BESS projects, mentor team members, and perform cost/benefit analyses. PE licensure or path to licensure preferred.
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5d
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Process Engineer II
Tempe, Arizona, United States
$84k-$126k/yr OnsiteFull Time
Medtronic
MedtronicNYSE: MDT: Developing and manufacturing medical technologies and therapies globally.
2+ YOEBachelor's with 2+ years (or Master's with 0+ years). Experience in microelectronics packaging, DOE/SPC, statistical analysis, process validation, equipment qualification, and strong problem-solving skills.
DRM, DFSS, Minitab, JMP
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Process Engineer II
Tempe, Arizona, United States
$84k-$126k/yr HybridFull Time
Medtronic
MedtronicNew York Stock Exchange: MDT: Develops and manufactures medical devices and digital health solutions.
2+ YOEBachelors (2+ yrs) or Masters (0+ yrs). Experience in microelectronics packaging, DOE/SPC, process validation, and equipment troubleshooting. Familiarity with statistical analysis and high-volume manufacturing.
Minitab, JMP, DRM, DFSS, Lean Sigma
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Facilities Engineer II
Scottsdale, Arizona, United States
$61k-$123k/yr OnsiteFull Time
Abbott
AbbottNYSE: ABT: Manufactures medical devices, diagnostics, and nutritional health products.
1+ YOEAssociates degree, 1+ years facilities experience (3+ preferred), AutoCAD proficiency, ability to plan/design layouts, estimate costs, prepare bid packages, and lead small-to-mid facility projects.
AutoCAD
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3w
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Senior Mechanical Engineer
Goodyear, Arizona, United States
$100k-$130k/yr OnsiteFull Time
fairlife
fairlifeNYSE: KO: Produces nutrient-dense and ultra-filtered dairy products and shakes.
Bachelor's in Mechanical Engineering, experience in high-speed manufacturing/dairy processing and packaging, familiarity with CI/Lean/GMP/5S, ability to lift 50 lbs, lead capital projects, perform BDA/RCA, and maintain machine documentation.
D365
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Principal Electrical Engineer
Phoenix, Arizona, United States
$87k-$216k/yr OnsiteFull Time
Mercury Systems
Mercury SystemsNASDAQ: MRCY: Provides secure processing solutions for aerospace and defense missions.
6+ YOEBachelor's in EE/CE, typically 6+ years microelectronics packaging experience, expertise in high-speed digital and signal integrity, substrate/SiP design, ability to obtain U.S. government security clearance, and experience leading cross-functional teams.
Cadence Allegro APD, Intel (Altera), AMD (Xilinx), JAMA, JIRA, Confluence
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3d
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Infrastructure Engineer - Elasticsearch (ELK) Team
Pittsburgh or Phoenix or Lakewood or Birmingham or Strongsville or Farmers Branch
$86k-$173k/yr OnsiteFull Time
PNC Financial Services
PNC Financial ServicesNYSE: PNC: Provides banking, lending, and investment services to customers.
3+ YOEExperience with Elasticsearch, Linux administration, Ansible, Git, shell or Python scripting, package management, monitoring/logging, and production support; typically 3+ years industry experience; bachelor's degree preferred.
Elasticsearch, Linux, Ansible, GIT, Python, Shell Scripting
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Mechanical Permit Engineer (TSMC Project)
Phoenix, Arizona, United States
HybridFull Time
Marketech International
Marketech InternationalTaiwan Stock Exchange: 6196: Provides turnkey facility integration and engineering for semiconductor plants.
2+ YOE2+ years in mechanical engineering, permitting, construction coordination or related field; experience with mechanical drawings, permit packages, AHJ coordination, and familiarity with building/mechanical codes; strong organization and communication.
AutoCAD, Bluebeam, Revit
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Senior Electrical Engineer 2 - Nuclear
Phoenix, Arizona, United States
$100k-$153k/yr HybridFull Time
Sargent & Lundy
Sargent & Lundy: Engineering and consulting services for the power industry.
8+ YOEABET-accredited BS in Electrical Engineering; minimum 8 years electrical design experience (nuclear power plant experience preferred); experience with LV/MV systems, design change packages, calculations, vendor interfacing; ability to be badged for unescorted nuclear access; PE and MS preferred.
Python, MATLAB, Microsoft Excel
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