3+ YOEB.S. in Packaging or related engineering, 3+ years pharmaceutical/regulatory engineering experience, knowledge of secondary/tertiary packaging design and qualification, ASTM/ISTA/IATA standards, ArtiosCAD, Solidworks, TOPS, cGMP change control, and project management skills.
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
3+ YOEBachelor's degree with 3+ years or Master's with 2+ years in Electrical/Computer Engineering or STEM; experience with custom layout/EDA tools; silicon physical layout and interconnects; strong collaboration.
Advanced Packaging Lithography Development Manager
Hillsboro, Oregon, United States
$156k-$298k/yrOnsiteFull Time
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
6+ YOEMaster's or PhD in engineering or related field, 5–6+ years relevant lithography/process development experience, equipment expertise (ASML, Canon, Nikon, track), project management and people leadership.
Advanced Packaging Dry Etch Module Development Engineer
Hillsboro, Oregon, United States
$134k-$255k/yrOnsiteFull Time
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
2+ YOEMaster's or PhD in engineering/physical science with process development experience in semiconductor manufacturing; experience with DOE, plasma etch equipment, and driving programs to production.
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
15+ YOEExpert in hybrid bonding and advanced packaging; lead module development, FOK equipment, and high-volume manufacturing readiness; strong communication and mentoring skills.
Hybrid bonding, Wafer bonding, Advanced packaging, Process development, Yield improvement, Reliability enhancement, FOK platform development
HCLTechNational Stock Exchange of India: HCLTECH: Global provider of information technology services and software consulting.
10+ YOEBachelor's or Master's in Electrical/Electronics Engineering; ~10+ years IC packaging/package design for senior level (4–6+ years mid); hands-on experience with Siemens (Mentor) Xpedition or Cadence Allegro/APD, physical/substrate design, SI/PI-aware design, DFM and design rule compliance.
HPNYSE: HPQ: Manufactures personal computers, printers, and 3D printing hardware.
8+ YOEBachelor's in engineering, 8+ years experience in circular economy, packaging or materials engineering, experience with global supply chains, cross-functional leadership, and expertise in recycled/renewable materials and packaging transformation.
HPNYSE: HPQ: Produces personal computers, printers, and related digital imaging products.
8+ YOEBachelor's in engineering, 8+ years experience in circular economy, packaging or materials engineering, expertise in recycled/renewable materials, global supply chain experience, strong cross-functional and problem-solving skills.
KLANASDAQ: KLAC: Provides process control and yield management for semiconductor manufacturing.
0+ YOEMaster's degree (0 years) or Bachelor's plus 2 years; experience with metrology, testing techniques (spectroscopy, HPLC), wet etch and packaging applications; strong problem solving, technical writing, project coordination, and training skills; ~30% travel.
Microsoft Outlook, Microsoft Word, Microsoft Excel, Microsoft PowerPoint, Microsoft Project, spectroscopy, HPLC
BIOTRONIK: Manufactures cardiovascular and endovascular medical devices for patient therapy.
8+ YOEB.Sc. or M.Sc. in EE/Physics/Materials,8+ years experience in chip scale packaging and high-reliability electronics, strong failure analysis and supplier qualification skills, leadership and technical writing ability.
Microsoft Excel, Microsoft Word, Microsoft PowerPoint
Raleigh or Austin or Hillsboro or Mountain View or Redmond
$143k-$275k/yrHybridFull Time
MicrosoftNASDAQ: MSFT: Develops software, services, devices, and cloud computing solutions.
3+ YOEDegree in EE/CE/CS (or equivalent) with required technical experience (PhD+3, MS+6, BS+8); experience in power integrity, silicon/package/system PI, advanced packaging, modeling, and strong communication skills.
Lake Oswego or Beaverton or Gresham or Hillsboro or Portland or McMinnville or Oregon
$90k-$120k/yrOnsiteFull Time
Hoffman Construction Company: General contractor specializing in large-scale and complex construction projects.
2+ YOEAnalyze MEP cost proposals, prepare cost estimates and authorization packages, maintain job cost reports and forecasts, perform on-screen material takeoffs; 2+ years construction estimating experience and bachelor's in engineering or construction management required.
Microsoft Windows, Microsoft Excel, Microsoft Word, Microsoft Outlook, Microsoft PowerPoint, Microsoft Teams, Prolog, Procore, E-Builder, Bluebeam, Microsoft Project, Primavera P6, AutoCAD, Revit, Navisworks
Principal Signal & Power Engineer (Die to Die and Chiplet Design)
Raleigh or Redmond or Mountain View or Austin or Hillsboro
$143k-$275k/yrHybridFull Time
MicrosoftNASDAQ: MSFT: Develops software, services, devices, and cloud computing solutions.
3+ YOEAdvanced degree in EE/CE/CS or equivalent experience with 3–8+ years technical experience; expertise in signal and power integrity, chiplet and package design; ability to pass Microsoft Cloud Background Check and export-control screening.
Greenberry Industrial: Industrial construction and metal fabrication services for heavy industry.
5+ YOE5+ years industrial construction estimating experience; proficiency in Microsoft Excel and estimating tools; ability to perform quantity takeoffs, develop labor/material pricing, evaluate subcontractor quotes, and assemble compliant bid packages.
Matheson: Supplying industrial, medical, and specialty gases and equipment.
Commercial driver responsible for delivering gas cylinders; requires valid commercial Class B license with Hazmat and air brake endorsements, medical card, ability to lift heavy cylinders, HS diploma or equivalent, and safe driving record.