250 packaging developer jobs at 102 companies in San Francisco, CA
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Packaging Engineer
San Ramon, California, United States
$84k-$105k/yrHybridFull Time
Rodan + Fields: Develops and sells dermatology-inspired skincare and haircare products.
3+ YOEBachelor's in package or related engineering, 3+ years package development experience, strong technical drawing review, project management, analytical, leadership, and communication skills.
Applied MaterialsNASDAQ: AMAT: Manufacturers of equipment for semiconductor and display production.
Experience in packaging engineering including supplier management, test plan development and lab testing, Design for Transportability (DFT), packaging standards, continuous improvement, and ability to lead projects.
Gilead SciencesNASDAQ: GILD: Develops and sells medicines for life-threatening infectious diseases.
2+ YOEBachelor's in engineering with 4+ years (or Master's with 2+ years), experience with packaging development, BOM/spec creation, technology transfer, packaging validation, cGMP and regulatory compliance; strong communication and organizational skills.
Applied MaterialsNASDAQ: AMAT: Produces equipment and services for chip and display manufacturing.
Packaging engineering experience with supplier management, test plan development, Design For Transportability (DFT), standards development, continuous improvement, and ability to train others; travel ~10%.
ASR Group: Global refiner and marketer of cane sugar products.
3+ YOE3+ years manufacturing experience, BS/BA in engineering, strong mechanical knowledge, understanding of control systems, ability to troubleshoot packaging equipment, Allen Bradley PLC/Wonderware experience a plus.
ExelixisNASDAQ: EXEL: Discovers and commercializes innovative medicines for cancer treatment.
1+ YOEBachelor's or equivalent plus packaging operations experience; experience supporting CMOs, serialization, review/approval of packaging records, MS Office proficiency, strong analytical and communication skills.
DensityAI: Designing custom AI hardware accelerators for large language models.
10+ YOE10+ years in advanced multi-die packaging (SiP, CoWoS, EMIB, interposers); expertise in design layout, SI/PI, thermo-mechanical tradeoffs; hands-on with packaging flows for 2.5D/3D; ability to collaborate with architects; DFT/RTL/PD optional.
San Diego or Vista or Santa Clara or Colorado Springs
$159k-$250k/yrOnsiteFull Time
Samtec: Manufactures electronic connectors, cables, and optical interconnect solutions.
15+ YOE15+ years in optical/optoelectronic or advanced microelectronics development; BS in engineering required (MS/PhD preferred); expertise in materials, packaging architectures, process development, technology maturation, and technical leadership.
San Diego or Vista or Santa Clara or Colorado Springs
$187k-$212k/yrOnsiteFull Time
Samtec: Manufacturer of high-speed electronic connectors and cable assemblies.
15+ YOESenior individual contributor with 15+ years in optical/optoelectronic or microelectronics development; BS in engineering required (MS/PhD preferred); expertise in materials, packaging architectures, process development, characterization, and technical leadership.
MediaTekTaiwan Stock Exchange: 2454: Designs and develops system-on-chip solutions for electronic devices.
8+ YOELead memory packaging development for 2.5D/3D and HBM/IPM solutions; supply chain and partner management; failure analysis and product integration to mass production.
Samtec: Manufactures electronic connectors and high-speed cable assembly systems.
15+ YOEBS in engineering required; MS/PhD preferred. 15+ years in optical/optoelectronic or advanced microelectronics development with materials and packaging architecture expertise; technical leadership and R&D experience.
Palo Alto or Los Angeles or Boston or Chicago or Sydney
$200k-$260k/yrOnsiteFull Time
Diraq: Builds scalable quantum processors using silicon CMOS technology.
Bachelor's in engineering or materials science, significant semiconductor packaging experience, expertise in PCB/substrate and mechanical design, failure analysis, thermal management, and delivering scalable hardware from concept to manufacturing.
Delos Data: Building specialized interconnects and infrastructure optimized for AI inference.
B.S./M.S. in EE or related, expertise in multi-die package design and UCIe, substrate and SI/PI knowledge, experience with TSMC/OSAT and managing subcontractors; HFSS/Sigrity familiarity a plus.
NextrackerNASDAQ: NXT: Designs and manufactures solar tracking systems for utility-scale power plants.
8+ YOEBachelor's in Packaging/Mechanical/Industrial Engineering or related; 8–12+ years in industrial packaging; experience with returnable packaging, data analysis, CAD; Power BI proficiency; cross-functional collaboration; travel willingness.
Analog DevicesNASDAQ: ADI: Designs and manufactures semiconductors for signal processing and power management.
3+ YOEMaster's in a relevant engineering field + ≥3 years industrial IC/package experience; expertise in analog IC package/module design, reliability and BOM selection, CAD modeling, and process development (FMEA, SPC, DOE); OSAT collaboration experience.
IntuitiveNASDAQ: ISRG: Robotic-assisted systems for minimally invasive surgery.
8+ YOE8+ years in medical device packaging design; BS in Packaging/Mechanical/Industrial Engineering; experience with thermoforming, pouch sealing, ISO11607, CFR 820; CAD (SolidWorks); travel; strong communication.
SolidWorks, FEA, Packaging testing tools, MS Office
NVIDIANASDAQ: NVDA: Designs graphics processing units and artificial intelligence hardware.
12+ YOE12+ years IC packaging development/NPI experience; degree in materials/mechanical/electrical/physics or equivalent; deep packaging expertise; familiarity with FA tooling and EDA/FEM tools.