45 packaging developer jobs at 24 companies in Santa Rosa, CA
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Packaging Engineer
Crockett, California, United States
$71k-$118k/yrOnsiteFull Time
ASR Group: Global refiner and marketer of cane sugar products.
3+ YOE3+ years manufacturing experience, BS/BA in engineering, strong mechanical knowledge, understanding of control systems, ability to troubleshoot packaging equipment, Allen Bradley PLC/Wonderware experience a plus.
IC Packaging Engineer, Materials and Packaging Characterization
United States or San Francisco
OnsiteFull Time
AppleNASDAQ: AAPL: Designs and sells consumer electronics, software, and online services.
10+ YOEBS and 10+ years in materials characterization/experimental mechanics; strong experience in experimental mechanics, material characterization, test equipment setup, SEM/EDX/FIB, MATLAB/Python, and packaging materials reliability.
SEM, EDX, FIB, CSAM, MATLAB, Python, Gen-AI, Machine Learning
Blue Origin: Develops reusable rockets and systems for human spaceflight.
12+ YOELead IC packaging team; manage end-to-end package development for RF/mmWave AiP and complex SoCs; perform EM, SI, and thermal simulations; collaborate with IC designers and OSATs.
Staff Software Engineer, Pricing and Packaging Engineering
San Francisco or Denver or New York City or San Jose
$197k-$247k/yrHybridFull Time
Gusto: Cloud-based payroll and HR software for small businesses.
8+ YOE8+ years building large-scale backend platform systems (commerce/billing/subscriptions preferred); strong distributed systems, API design, SLO, and mentorship experience; proven delivery of multi-quarter projects.
LVMHEuronext Paris: MC: A diversified luxury conglomerate managing fashion, spirits, and beauty brands.
1+ YOEB.S. in Packaging Engineering or related, 1+ year packaging/manufacturing experience, knowledge of secondary components, printing/color matching, package testing, technical drawings and project timeline management.
Process Engineer – Semiconductor Heterogeneous Integration
Santa Rosa, California, United States
$127k-$212k/yrOnsiteFull Time
Keysight TechnologiesNYSE: KEYS: Provides electronic design, test, and simulation software and hardware.
3+ YOEB.S./M.S./Ph.D. in engineering or materials science, 3+ years semiconductor manufacturing experience, strong analytical, collaboration and communication skills, experience with packaging, DfM, interconnects, and DOE preferred.
Pantheon: Cloud platform for managing WordPress and Drupal websites.
5+ YOE5+ years web development experience, strong Next.js and Node.js background, experience creating technical content and npm packages, public speaking and community engagement, open source collaboration, and strong communication skills.
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
9+ YOE9+ years design or packaging program experience; end-to-end packaging development, BOM and POD labeling knowledge; strong cross-functional program management and travel availability.
Bill of Material (BOM), Print On Demand (POD), scrum
8+ YOE8+ years IT support/systems administration with Microsoft 365; experience with Entra, Intune, application packaging; strong documentation and customer-service skills.
Entra, Cloudflare One, Cloudflare WARP, Veeam, VMware vCenter, Windows Server, Azure Files, SentinelOne, Microsoft Intune, PatchMyPC, NinjaOne, PowerShell, Jamf Connect, Apple Business Manager, macOS, Jira, Power Automate, Azure Functions, Entra Lifecycle Management, Microsoft 365, Active Directory
Astro Mechanica: Building turboelectric jet engines for supersonic aircraft.
5+ YOE5+ years in turbomachinery design with rotordynamic analysis and mechanical packaging ownership; hands-on modelling tools; CFD/1D meanline methods; test instrumentation; CAD; scripting.
AeroVironmentNASDAQ: AVAV: Designs and manufactures unmanned aircraft and tactical missile systems.
8+ YOE8+ years mechanical engineering experience with 5+ years on production rotating electrical machines or electronics packaging; SolidWorks, ANSYS, ANSYS Icepack proficiency; MIL-STD-961D familiarity; MS preferred.
Form Energy: Developing multi-day batteries for grid-scale energy storage.
4+ YOESenior mechanical design engineer with 4+ years experience in high-volume electromechanical systems; strong CAD, thermal/structural analysis, and packaging expertise.
Candid Intelligence: AI software for pre-construction engineering and infrastructure planning.
7+ YOE7+ years at an EPC/PMC/owner-operator with strong FEED and early mechanical design experience; experience with equipment datasheets, vendor packages, ASME-driven equipment practices, and cross-discipline coordination.
Charlotte or San Francisco or Los Angeles or New York City
$160k-$193k/yrOnsiteFull Time
Scout Motors: Designs and manufactures all-electric rugged SUVs and trucks.
12+ YOEMaster's in EE/CS or related with 12+ years experience. Deep experience in vehicle-level build/compilation and packaging, embedded ECU ecosystems, CI/CD, scripting (Python/Bash/Groovy), Git workflows, and artifact management.
State Controller's Office: California's fiscal controller managing state financial operations and assets.
Requires Professional Engineer license, eligibility for state appointment, SOQ and completed application package per class specification; must meet minimum qualifications.
Miami or Boston or Greensboro or Charlotte or Wilmington or Atlanta or Houston or Washington or San Francisco
$80k-$133k/yrHybridFull Time
ArcadisEuronext Amsterdam: ARCAD: Designing and engineering sustainable solutions for natural and built environments
BS in mechanical or fire protection engineering; US Fire Protection PE licensure; experience in IFC design packages for federal facilities; knowledge of NFPA, NEC, NESC, UL; fire alarm and suppression systems expertise; strong communication skills.
Revit, BIM, Autodesk Construction Cloud, AutoCAD, HydraCAD, Navisworks
Business Development Manager- Emerging Growth Marketing
Durham or San Francisco or Phoenix
OnsiteFull Time
WolfspeedNYSE: WOLF: Manufactures silicon carbide and GaN semiconductors for power systems.
10+ YOEBachelor's in engineering or materials,10+ years in semiconductor packaging business development, deep packaging and interconnect knowledge, executive relationship and negotiation skills, willingness to travel globally.