AppleNASDAQ: AAPL: Designs and sells consumer electronics, software, and online services.
10+ YOEBS with 10+ years of relevant experience; strong FEM experience (ANSYS/ABAQUS); MATLAB and/or Python; Gen-AI/ML; knowledge of packaging materials and electronic packaging.
ANSYS, ABAQUS, HyperMesh, MATLAB, Python, Generative AI tools
California or Colorado or Connecticut or Florida or Georgia or Illinois or Kansas or Massachusetts or Maryland or Maine or New Jersey or North Carolina or New York or Oregon or Tennessee or Texas or Virginia or Washington or Austin or Tampa
$85k-$110k/yrHybridFull Time
NinjaOne: Unified IT platform for automated endpoint management and security.
2+ YOE2+ years technical experience, Windows OS familiarity, scripting or OOP experience, Git knowledge, comfortable with AI coding assistants; packaging, installer analysis, and automation skills.
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Proven semiconductor technology development experience, leadership driving engineering teams, expertise in materials/thin film/process/packaging, experience with manufacturing partners and yield improvement; BS/MS/PhD in relevant field.
8+ YOEBachelor’s in Mechanical Engineering,8+ years related experience,expertise in battery and high-voltage packaging,thermal/structural analysis,lightweight materials,manufacturing interface,and strong communication skills.
Nutrabolt: Produces performance sports nutrition products and energy drinks.
2+ YOEBachelor’s degree in SCM/Packaging/Engineering; 2+ years packaging/supply chain experience; knowledge of packaging materials; proficient in MS Office; travel up to 25%; fast-paced CPG experience preferred.
Sr. Package Layout Engineer, Annapurna Labs - AI Silicon Packaging
Tempe or Austin or Cupertino
$159k-$248k/yrOnsiteFull Time
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
10+ YOEBachelor's in EE or related, 10+ years IC package layout and physical design experience, expertise with advanced packaging (2.5D/3D, WLP, RDL, TSV), package DRC/DFM, and collaboration with SI/PI and manufacturing teams.
Applied MaterialsNASDAQ: AMAT: Manufacturers of equipment for semiconductor and display production.
15+ YOESenior technical leader with 15+ years in semiconductor packaging/panel processing; experience leading technology strategy, customer engagements, and cross‑functional teams; PhD/MS preferred.
Samsung ElectronicsKorea Exchange: 005930: Develops and manufactures consumer electronics, semiconductors, and mobile devices.
2+ YOEB.S. in chemical or other engineering preferred; 2+ years engineering experience in water treatment; knowledge of water chemistry and unit processes; experience in industrial operations; ability to monitor, troubleshoot, and prepare work packages.
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
4+ YOE4+ years package CAD/layout or substrate design experience (6+ preferred); strong background in FCBGA, SiP, WLCSP, power modules; proficiency with Cadence Allegro Package Designer or Siemens Xpedition; BS/MS in EE, microelectronics, materials, or related field.
Equipment Engineer, Texas Institute for Electronics
Austin or Austin
OnsiteFull Time
University of Texas at Austin: Provides public higher education and conducts academic research.
3+ YOEBachelor's in engineering, 3+ years semiconductor fab or advanced packaging equipment engineering, equipment installation project management, SPC experience, ability to work independently, strong communication; must be authorized to work in the US without sponsorship.
Aalo Atomics: Developing mass-manufactured small modular nuclear reactors for clean energy.
8+ YOEBS in civil/structural engineering required (MS/PhD preferred), 8+ years structural experience (4+ years in nuclear or safety-critical preferred), PE (or pursuing) in a US jurisdiction, proficiency with major FEA packages, knowledge of relevant codes and DOE/NRC documentation.
Apptronik: Designs and manufactures humanoid robots for industrial automation.
8+ YOEBS or MS in Mechanical Engineering with 8+ years in mechanical design of complex robotic systems; strong leadership, cross-functional collaboration, and surfacing/packaging expertise.
BAE SystemsLondon Stock Exchange: BA: Designs and manufactures advanced defense and aerospace systems.
8+ YOEBachelor's in Mechanical Engineering with 8–10+ years experience (10+ with BS or 8+ with MS), DoD product development experience, opto-mechanical/EO/IR packaging, mechanical design and analysis, engineering software proficiency, leadership and strong communication, eligible for DoD security clearance.
Fluidstack: Provides high-performance cloud GPU infrastructure for AI development.
Experience in BIM coordination for large MEP-heavy projects; production-fast in Revit and Navisworks; disciplined model/version management; clash detection and resolution; delivers coordinated drawings and prefab packages.
Graphcore: Produces specialized processors for artificial intelligence workloads.
Experience building CI/CD and automation for build,test,package and release workflows; strong Python/Bash and Linux skills; CI/CD platform experience; Git expertise; clear communication.