Altera: Manufacturer of field-programmable gate arrays and programmable logic devices.
3+ YOEBachelor's degree in a technical discipline and 3+ years of semiconductor physical design experience, including RTL-to-GDSII implementation, physical design flows, timing analysis, and verification/signoff.
DensityAI: Designing custom AI hardware accelerators for large language models.
8+ YOE8+ years in physical design for high-performance chips at advanced nodes, expert across full physical design flow, hands-on with industry PD and signoff tools, and ability to collaborate with architects, RTL designers, EDA vendors, and foundries.
Cadence Innovus, Synopsys Fusion Compiler, PrimeTime, Tempus
Tenstorrent: Designs and manufactures AI processors and RISC-V CPU solutions.
BS/MS/PhD in EE/ECE/CE/CS with experience in synthesis, PnR, timing closure; proficient with FusionCompiler, PrimeTime, RedHawk; scripting Tcl, Perl, Python; knowledge of low-power design; drive physical design from architecture to signoff.
Cerebras SystemsNasdaq: CBRS: Manufactures specialized computer chips designed for AI.
10+ YOE10+ years physical design experience; expertise in full-chip physical verification, DRC/LVS resolution with ICV or Calibre, IR/EM analysis, 3D/2.5D packaging and die stacking; scripting with Tcl and Python; familiarity with Synopsys tools.
Astera LabsNASDAQ: ALAB: Designs connectivity solutions for cloud and AI infrastructure.
8+ YOEBachelor's degree in engineering, 8+ years of physical design experience with advanced-node tapeouts, expertise in synthesis, place-and-route, CTS, timing closure, low-power design, and Tcl/Python automation.
Hillsboro or Redmond or Mountain View or Raleigh or Austin
$120k-$235k/yrHybridFull Time
MicrosoftNASDAQ: MSFT: Develops software, services, devices, and cloud computing solutions.
1+ YOERequires a relevant engineering or computer science degree and 1–5+ years of technical engineering experience; preferred experience includes semiconductor physical design, tape-outs, low-power methods, and signoff workflows.
CapgeminiEuronext Paris: CAP: Provides global IT consulting and digital transformation services.
10+ YOERequires 10+ years in physical design, advanced digital or mixed-signal IC implementation, physical verification, timing analysis, tape-out, and EDA tools including Virtuoso, Calibre, or RedHawk.
Celero Communications: Developing high-performance coherent DSP technology for AI connectivity.
5+ YOE5+ years of ASIC physical design experience, advanced-node tapeout expertise, EDA tool proficiency, and expertise in synthesis, power analysis, EM/IR cleanup, timing closure, and physical verification.
Hewlett Packard EnterpriseNYSE: HPE: Provides global edge-to-cloud technology solutions and IT infrastructure services.
7+ YOEBS/MS in EE/CompEng, 7+ years ASIC physical design experience, strong expertise with Cadence Innovus and Synopsys Fusion Compiler, scripting in Tcl/Python/Linux shell, and physical signoff knowledge.
Hewlett Packard EnterpriseNYSE: HPE: Providing global edge-to-cloud infrastructure and IT solutions for businesses.
7+ YOEBS/MS in EE/CE or related, 7+ years ASIC physical design/methodology experience, expertise with Cadence Innovus and/or Synopsys Fusion Compiler, strong scripting (Tcl, Python, Linux shell), and physical signoff knowledge.
4+ YOEBachelor's degree or equivalent practical experience, 4 years of digital physical design implementation, and experience with synthesis, place and route, timing closure, and signoff tools.
Tcl, Python, Static Timing Analysis (STA), Place and Route (PnR), EMIR
Lumilens: Designs photonic interconnects for AI supercomputing infrastructure.
8+ YOE8+ years physical design experience for advanced TSMC nodes (5nm/3nm), Bachelor’s degree in EE or related, strong floorplanning/placement/CTS/routing/signoff skills, and scripting in Tcl/Python/Perl.
BroadcomNASDAQ: AVGO: Designs and sells semiconductors and infrastructure software to enterprises.
12+ YOEBachelor's degree in Electrical Engineering or Computer Science with 12+ years' related experience, or master's with 10+ years. Requires IC, package, and PCB layout tools plus TCL and Python scripting.
Hewlett Packard EnterpriseNYSE: HPE: Provides edge-to-cloud IT infrastructure and platform services.
7+ YOEBS/MS in EE/CE or related, 7+ years in ASIC physical design flows, expertise with Cadence Innovus or Synopsys Fusion Compiler, scripting in Tcl/Python/Linux shell, experience with timing, power, signoff, and flow automation.
Cadence Innovus, Synopsys Fusion Compiler, PrimeTime, StarRC, Voltus, RedHawk, Calibre, Tcl, Python, Linux shell, Git, Perforce, Make
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
2+ YOEBS or MS in Electrical or Computer Engineering; 5+ years (BS) or 2+ years (MS) in physical design; proficiency with Synopsys or Cadence P&R tools; ability to develop methodologies; DFT knowledge a plus.