DensityAI: Designing custom AI hardware accelerators for large language models.
8+ YOE8+ years in physical design for high-performance chips at advanced nodes, expert across full physical design flow, hands-on with industry PD and signoff tools, and ability to collaborate with architects, RTL designers, EDA vendors, and foundries.
Cadence Innovus, Synopsys Fusion Compiler, PrimeTime, Tempus
Cerebras SystemsNasdaq: CBRS: Manufactures specialized computer chips designed for AI.
10+ YOE10+ years physical design experience; expertise in full-chip physical verification, DRC/LVS resolution with ICV or Calibre, IR/EM analysis, 3D/2.5D packaging and die stacking; scripting with Tcl and Python; familiarity with Synopsys tools.
Tenstorrent: Designs and manufactures AI processors and RISC-V CPU solutions.
BS/MS/PhD in EE/ECE/CE/CS with experience in synthesis, PnR, timing closure; proficient with FusionCompiler, PrimeTime, RedHawk; scripting Tcl, Perl, Python; knowledge of low-power design; drive physical design from architecture to signoff.
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
2+ YOEExperience implementing physical design flows for custom IP/SoC, proficiency with EDA tools, RTL/GDS knowledge, scripting (TCL), and 2+ years of relevant experience with a relevant degree.
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
3+ YOEBSEE/MSEE or equivalent; 3+ years in VLSI physical design on 5nm-3nm; strong P&R, timing, IR drop; scripting in Python/Perl/Tcl; experience with Synopsys and Cadence tools.
MicrosoftNASDAQ: MSFT: Develops software, services, devices, and cloud computing solutions.
5+ YOEAdvanced degree in EE/CE/CS or equivalent with multi-year technical engineering experience; ability to pass Microsoft Cloud Background Check and satisfy export-control eligibility; experience in physical design implementation, timing, power, and verification.
QualcommNASDAQ: QCOM: Designs and manufactures semiconductors and wireless telecommunications products.
2+ YOEBachelor's in science/engineering +2 years ASIC design experience (or Master's +1 or PhD). Requires ASIC design/verification skills, experience with architecture/design and scripting tools, and strong communication.
MetaNASDAQ: META: Develops social networking platforms and virtual reality technologies.
8+ YOEBachelor's in CS/CE or equivalent, 8+ years physical design implementation for digital SoCs, experience with advanced nodes (3nm or below), EDA tools, timing/power/physical verification, and methodology development.
Hewlett Packard EnterpriseNYSE: HPE: Provides global edge-to-cloud technology solutions and IT infrastructure services.
7+ YOEBS/MS in EE/CompEng, 7+ years ASIC physical design experience, strong expertise with Cadence Innovus and Synopsys Fusion Compiler, scripting in Tcl/Python/Linux shell, and physical signoff knowledge.
Hewlett Packard EnterpriseNYSE: HPE: Providing global edge-to-cloud infrastructure and IT solutions for businesses.
7+ YOEBS/MS in EE/CE or related, 7+ years ASIC physical design/methodology experience, expertise with Cadence Innovus and/or Synopsys Fusion Compiler, strong scripting (Tcl, Python, Linux shell), and physical signoff knowledge.
Microchip TechnologyNasdaq: MCHP: Manufacturer of microcontrollers, analog, and mixed-signal integrated circuits.
10+ YOEBachelor’s or Masters in Electrical/Electronics Engineering; 10+ years in physical design; full-chip APR/physical implementation; TCL/Perl scripting; ICC/ICC2 or Innovus experience; 40nm/28nm tech; UPF and low power design; timing closure and sign-off tools.