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20 process integration engineer jobs at 12 companies in Peoria, AZ

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Senior Process Integration Development Engineer
Phoenix or Santa Clara or Hillsboro
$134k-$255k/yr HybridFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
5+ YOEMaster's in a STEM field,5+ years semiconductor process integration experience,expertise in device physics/interconnects,big data analysis,NPI and HVM exposure,leadership and cross-functional collaboration.
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1mo
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Advanced Process Chemical SCADA Engineer (TSMC Project)
Phoenix, Arizona, United States
FieldFull Time
Marketech International
Marketech InternationalTaiwan Stock Exchange: 6196: Provides turnkey facility integration and engineering for semiconductor plants.
Hands-on SCADA/DCS experience (Emerson DeltaV preferred), PLC integration and Ladder Logic/Function Block knowledge, Modbus/OPC communication, P&ID interpretation, commissioning, historian/INSQL, HMI design, and troubleshooting in industrial/chemical/semiconductor environments.
Emerson DeltaV, PLC, Ladder Logic, Function Block, Modbus, OPC, INSQL, EIOC
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Analyst, Resource Planning & Grid Integration
San Francisco or Princeton or San Diego or Scottsdale or Denver or Houston or Phoenix
$90k-$100k/yr HybridFull Time
Clearway Energy
Clearway EnergyNYSE: CWEN: Develops and operates utility-scale renewable energy power plants.
2+ YOEBachelor's in Electrical Engineering, minimum 2 years power systems modeling/transmission planning/grid integration experience, proficiency with PSS®E, TARA, PSLF, Power World, and knowledge of FERC and ISO/RTO interconnection processes.
PSS®E, TARA, PSLF, Power World
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Senior Manager, Process Engineering - New Inflection Products
Tempe, Arizona, United States
$156k-$215k/yr OnsiteFull Time
Applied Materials
Applied MaterialsNASDAQ: AMAT: Manufacturers of equipment for semiconductor and display production.
Expertise in ALD/CVD/plasma/thermal thin‑film processes, leadership of process engineering teams, cross‑functional integration, customer engagement; PhD or MS in related field; 10+ years experience preferred.
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Advanced Packaging Principal Integration Technologist
Tempe or United States
$179k-$288k/yr OnsiteFull Time
Merck
MerckXETRA: MRK: A science and technology providing healthcare, life science, and electronics solutions.
10+ YOEMSc or higher in engineering, 10+ years 300mm process/equipment R&D experience in advanced packaging, 7+ years external business development experience, consortium engagement preferred, strong equipment/process/integration knowledge and ecosystem network. US work authorization required.
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Software Engineer - Avionics RF Design and Integration
Seattle or Deer Valley
$80k-$174k/yr HybridFull Time
Capgemini
CapgeminiEuronext Paris: CAP: Provides global IT consulting and digital transformation services.
Experience in safety-critical avionics software, DO-178C practices, embedded C/C++ development, RFIO and signal processing, DOORS, Python, JIRA/Bitbucket, and flight test/integration support.
C++, C, Python, DOORS, DO-178C, JIRA, Bitbucket
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Electrical Engineer 2 – EGSE
Chandler, Arizona, United States
$79k-$119k/yr OnsiteFull Time
Northrop Grumman
Northrop GrummanNYSE: NOC: Designs and manufactures advanced aerospace and defense systems.
2+ YOEUS citizen able to obtain Secret clearance, 2 years with a BS (or MS alternative), EGSE/ATE design-test-integration experience, electrical engineering proficiency, and secure-environment processes knowledge.
LabVIEW, TestStand, NI hardware, Windows, RHEL, Linux, oscilloscopes, DMMs, electronic loads
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Systems Engineering Tools and Process Assurance Manager
Phoenix, Arizona, United States
HybridFull Time
Honeywell International
Honeywell InternationalNASDAQ: HON: Designs and manufactures technologies for aerospace, buildings, and industry.
8+ YOEBachelor's in Engineering, US Person required, minimum 8 years systems engineering experience in aerospace with development assurance, ARP4754 experience, MBSE and digital thread expertise, leadership and tool integration experience including IBM ELM/DOORS Next Generation and Cameo Enterprise Architect.
IBM ELM / DOORS Next Generation, Cameo Enterprise Architect, ALM
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Senior Engineer II, Key Account Technology
Phoenix or Hwaseong
OnsiteFull Time
ASM
ASMEuronext Amsterdam: ASM: Designs and manufactures advanced semiconductor wafer processing equipment.
6+ YOEPhD in engineering or related field, 6+ years post-PhD semiconductor industry experience, expertise in epitaxy/thin film processes, semiconductor process integration, strong problem-solving and communication, fluent Korean and English, willingness to travel.
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Mechanical Commissioning Engineer
Chandler, Arizona, United States
OnsiteFull Time
LotusWorks
LotusWorks: Provides technical engineering and commissioning for global manufacturing facilities.
3+ YOE3+ years in mechanical commissioning, startup, or systems testing in semiconductor fabs, data centers, or industrial facilities; strong knowledge of process mechanical systems, HVAC, and system integration; ability to read P&IDs and control diagrams; good troubleshooting and documentation skills.
P&IDs, isometrics, control diagrams, BIM models
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Director of Engineering – Advanced Avionics
Phoenix, Arizona, United States
OnsiteFull Time
The AIRO Group
The AIRO GroupNASDAQ: AIRO: Designs and manufactures integrated avionics and aerospace systems.
8+ YOE5+ MgmtBachelor's in engineering required (Master's preferred), 8+ years avionics engineering experience, 5+ years people management, knowledge of avionics architectures, embedded systems, certification processes, systems integration, and verification.
DO-178C, DO-254, ARP4754A
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BIM Coordinator (Phoenix, AZ, US, 85012)
Phoenix or United States
OnsiteFull Time
Bechtel
Bechtel: Designs and constructs large-scale industrial and infrastructure projects.
10+ YOEImplement BIM processes, manage CDE/ACC and federated models, perform clash detection and model coordination, integrate 4D/5D and QTO workflows, train teams, and ensure ISO19650 compliance. Requires bachelor's degree and ~10+ years relevant experience.
ACC, Common Data Environment (CDE), BIM, CAD, GIS, 4D/5D, Quantity Take-off (QTO), BIM Execution Plan (BEP), ISO19650
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