Qualcomm Technologies, Inc.: Developing semiconductor, wireless, connectivity, automotive, AI, and computing technologies for device and enterprise customers.
Master's degree in electrical engineering, computer engineering, computer science, or a related field; independently performs SoC physical design, verification, timing closure, and tapeout signoff activities.
AMDNASDAQ: AMD: Leader in high-performance computing, graphics, and visualization technologies.
Experience with computer architecture, system simulation, performance evaluation, bottleneck analysis, mathematical modeling, microarchitecture, and C/C++ programming; degree in engineering or computer science preferred.
IntelNASDAQ: INTC: Design and manufacture of semiconductors and computing technology.
3+ YOEExperience in RTL/Verilog logic design, SoC integration, low-power and timing optimization, Clock Domain Crossing and NoC architectures, AMBA protocols; bachelor's or master's in EE/CE with relevant years of experience.
AmbiqNYSE: AMBQ: Public semiconductor developing ultra-low-power SoCs and software for battery-powered edge AI devices.
8+ YOEBachelors in EE/CE (or higher),8+ years ASIC/SoC RTL design,strong Verilog/SystemVerilog skills,ARM/AMBA experience,front-end ASIC flow knowledge,experience with tapeout/silicon bring-up,and US work authorization.
Verification engineers solve complex problems using machine learning, simulation software, model checking, and hardware prototyping systems; specific qualifications are not stated.
Micron TechnologyNASDAQ: MU: Global leader in memory and storage semiconductor solutions.
10+ YOEImplement SoC physical designs from netlist to GDSII; proficiency with industry EDA tools, STA/SDC, power-intent (UPF/CPF), physical verification, and timing/power signoff.
North America or San Francisco or Austin or Boston
HybridFull Time
Volantis Semiconductor: Private semiconductor startup building photonically integrated computers and photonic interconnects for AI inference and data-center systems.
Requires ownership of specifications and implementation for at least one SoC or die, deep architecture, microarchitecture, and physical design expertise, and experience coordinating cross-functional SoC development.
Micron TechnologyNASDAQ: MU: Global leader in memory and storage semiconductor solutions.
10+ YOEHands-on SoC physical design from netlist to GDSII on advanced nodes; proficiency with industry EDA tools, STA/SDC, power intent (UPF/CPF), physical verification, and strong timing/power optimization skills.
AppleNASDAQ: AAPL: Designing and manufacturing consumer electronics, software, and digital services.
Forward-thinking engineering expertise in audio and acoustics, with understanding of audio subsystem integration within systems-on-chip and broader hardware-software systems.
Staff Mixed-Signal SOC Engineer – Infrastructure Power
Austin, Texas, United States
HybridFull Time
Renesas ElectronicsTokyo Stock Exchange: 6723: Global provider of embedded semiconductor and system solutions.
7+ YOEMSEE or equivalent, 7+ years mixed-signal SoC experience with tapeout-to-production history; deep expertise in analog, digital, verification or system architecture; automated test and silicon validation experience; mentoring ability.
NVIDIANASDAQ: NVDA: Computing platform for AI and accelerated graphics.
6+ YOEBachelor's or master's degree in engineering or equivalent experience, 6+ years of ASIC verification, strong SystemVerilog and UVM expertise, interconnect protocol experience, and Python, Perl, or TCL proficiency.
NVIDIANASDAQ: NVDA: Computing platform for AI and accelerated graphics.
6+ YOEB.S./M.S. in engineering or equivalent experience,6+ years ASIC verification with fabric/interconnect focus,proficient in SystemVerilog and UVM,experience with interconnect protocols and scripting (Python,Perl,TCL).
NVIDIANASDAQ: NVDA: Computing platform for AI and accelerated graphics.
6+ YOE6+ years ASIC verification experience with fabric/interconnect/NoC, strong SystemVerilog and UVM skills, knowledge of interconnect protocols (AMBA AXI, CHI), scripting (Python, Perl, TCL), and degree in computer/electrical engineering or equivalent experience.
MediaTekTaiwan Stock Exchange: 2454: Global fabless semiconductor providing system-on-chip solutions.
10+ YOE10+ years SoC/compute architecture experience, 3+ years in datacenter/server SoCs; Bachelor’s degree in EE/CE/CS; expertise in CPU/memory/Interconnect, PCIe/CXL, and performance modeling.
Booz Allen HamiltonNYSE: BAH: Global firm providing management, technology, and engineering consulting services.
5+ YOERequires 5+ years in engineering or infrastructure development, Ansible scripting, system administration, DevOps automation, and virtualization or container platforms; Secret clearance and bachelor's degree or equivalent experience.
Microsoft Internet Explorer, Google Chrome, Mozilla Firefox, Microsoft Edge, Apple Safari, Opera Browser, Blackberry Browser, Ansible, Microsoft Windows, Linux, VMware, vSphere, vCenter, Kubernetes, Docker, Python, Shell, Bash, Scaled Agile Framework (SAFe)
EricssonNasdaq Stockholm: ERIC B: Global provider of communications technology, software, and services.
4+ YOEUS citizenship required; 4+ years SOC triage/response/detection engineering experience; expertise with EDR/ITDR/SIEM and cloud platforms (AWS/GCP/Azure); strong analytical, communication, and crisis-management skills; work onsite 10:30–18:30 CT with one weekend/month.
EricssonNasdaq Stockholm: ERIC B: Global provider of communications technology, software, and services.
4+ YOEUS citizen required. 4+ years SOC experience in triage, response and detection engineering. Proficient with EDR/ITDR/SIEM, cloud (AWS/GCP/Azure), CrowdStrike Falcon, detection engineering, strong integrity; office-based with one weekend/month.
SoC Power Engineer, Annapurna Labs - Cloud Scale Machine Learning
Cupertino or Austin
$136k-$213k/yrOnsiteFull Time
AmazonNASDAQ: AMZN: Multinational technology focused on e-commerce and cloud computing.
1+ YOEBachelor's degree and 4 years, master's and 2 years, or PhD and 1 year in EE/CS; power analysis tools, circuit-level chip power knowledge, scripting, physical design, EM/IR, power integrity, and thermal expertise required.
Allegro MicroSystemsNASDAQ: ALGM: Public semiconductor designer and fabless manufacturer of sensor and application-specific power ICs for automotive and industrial customers.
12+ YOE5+ MgmtB.S./M.S. in Electrical/Computer Engineering,12+ years semiconductor digital design experience,5+ years lead SoC architecture,experience with ARM/RISC-V,NoC,memory subsystems,FuSa (ISO 26262),SystemC/Simulink,Verilog/SystemVerilog.