General Dynamics Mission SystemsNYSE: GD: Designs and manufactures defense and mission-critical technology solutions.
8+ YOEBachelor's in Electrical/Computer Engineering or related +10 years (or Master's +8 years); TS/SCI clearance preferred/obtainable; expertise in ASIC/FPGA design, verification, simulation, and technical leadership; Microsoft Office proficiency.
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
12+ YOE5+ MgmtBachelor's in EE/CE or related; 12+ years in semiconductor/ASIC/SoC/foundry/silicon solution sales; 5+ years people management; deep ASIC market knowledge, executive relationships, financial acumen, and ability to travel globally.
Northrop GrummanNYSE: NOC: Designs and manufactures advanced aerospace and defense systems.
1+ YOEBachelor's in STEM with 5+ yrs FPGA design experience (or MS with 3+ yrs, PhD with 1+ yr); HDL/HDL verification, FPGA design flow, aerospace experience, and ability to obtain DoD Top Secret clearance.
HDL, RTL, System Verilog, Universal Verification Methodology (UVM), Xilinx ISE, Vivado, Mentor Graphics ModelSim, QuestaSim, Synplify, Electronic Design Automation (EDA) Tools, Signal Generators, Logic Analyzers, Digital Oscilloscopes, Embedded FPGA Debugging tools
Northrop GrummanNYSE: NOC: Develops and manufactures advanced aerospace, defense, and space systems.
5+ YOEBachelor’s/Master’s/PhD in STEM with FPGA/HDL design experience; space/A&D applications; DoD Top Secret clearance achievable; 5+ yrs (Bachelors), 3+ yrs (Masters), 1+ yr (PhD).
ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)
San Jose or Research Triangle Park or Acton or Dallas or Tempe or Cary or Carlsbad or Colorado Springs
$184k-$264k/yrRemoteFull Time
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
3+ YOEBachelor's/MS/PhD in Electrical Engineering with 3+ to 8+ years SI/PI experience; expertise in high-speed design, SI/PI simulation, layout review, SPICE; mentoring and leadership experience.
MoogNYSE: MOG.A: Design and manufacture of precision motion control systems.
10+ YOEBachelor's in EE/CE, 10+ years designing FPGA/ASIC/SoC-based digital hardware, board bring-up and lab debug, high-speed interface and timing analysis, signal integrity collaboration, strong communication and leadership.
FPGA, ASIC, DDR, PCIe, Ethernet, SerDes, LVDS, SPI, I2C, Linux
Honeywell InternationalNASDAQ: HON: Designs and manufactures technologies for aerospace, buildings, and industry.
5+ YOEBachelor’s in engineering,5+ years ASIC/FPGA HDL design/verification or AEH certification liaison experience; U.S. person required; familiarity with FAA regulations and certification processes preferred.
Technical Program Management Lead (Member of Technical Staff)
Vancouver or Chandler or California
HybridFull Time
PowerLattice: Develops power delivery chiplets for high-performance AI processors.
10+ YOEBachelor's in engineering or CS, 10+ years program management in semiconductor/ASIC/hardware, strong silicon development knowledge, vendor management, schedule and risk management, experience with Jira/Confluence/Smartsheet/Microsoft Project.
San Diego or Austin or Boulder or Costa Mesa or Pasadena or Tempe or Wilsonville or Fremont
$167k-$334k/yrHybridFull Time
SiemensXETRA: SIE: Manufactures industrial automation, infrastructure, and energy technology systems.
5+ YOE5+ years in design/verification/FPGA/ASIC or similar; BS/MS in EE/CE/CS; active experience with SystemVerilog/Verilog/VHDL, FPGA tools, scripting, simulation and customer-facing technical support.
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
5+ YOE5+ years digital design experience, degree in electrical/computer discipline, fluent Verilog/SystemVerilog, ASIC methodology, lint/CDC/RDC experience, RTL and gate-level debug, English proficiency, willing to travel.
Verilog, SystemVerilog, Lint, CDC, RDC, UPF, UVM, AMBA, I2C, STA