IntuitiveNASDAQ: ISRG: Robotic-assisted systems for minimally invasive surgery.
8+ YOE8+ years in medical device packaging design; BS in Packaging/Mechanical/Industrial Engineering; experience with thermoforming, pouch sealing, ISO11607, CFR 820; CAD (SolidWorks); travel; strong communication.
SolidWorks, FEA, Packaging testing tools, MS Office
GoogleNASDAQ: GOOG, GOOGL: Global technology specializing in internet-related services and products.
5+ YOEBachelor's degree or equivalent practical experience, 5+ years in hardware or consumer-goods packaging design, ISTA and ASTM D4169 experience, and CAD proficiency. CPP, master's degree, and 8 years' experience preferred.
WingNASDAQ: GOOGL: Autonomous drone delivery service for small packages and logistics
5+ YOERequires 5+ years in packaging, mechanical design, or industrial design; advanced packaging and structural mechanics knowledge; CAD and palletization software expertise; testing, documentation, collaboration, and travel ability.
Amperesand: Manufactures solid-state transformers for AI data centers and grids.
3+ YOEBachelor's degree in mechanical engineering or related field, or equivalent experience; 3+ years designing component packaging from concept to production; expertise in CAD, CAE simulation, GD&T, tolerance analysis, and DFM/DFA.
CATIA, Solidworks, Ansys, Jira, Scrum, 3D EXPERIENCE, FEA
DensityAI: Designing custom AI hardware accelerators for large language models.
10+ YOE10+ years in advanced multi-die packaging (SiP, CoWoS, EMIB, interposers); expertise in design layout, SI/PI, thermo-mechanical tradeoffs; hands-on with packaging flows for 2.5D/3D; ability to collaborate with architects; DFT/RTL/PD optional.
Delos Data: AI interconnect building server hardware and software for hyperscalers, AI infrastructure builders, and enterprises scaling inference.
B.S./M.S. in EE or related, expertise in multi-die package design and UCIe, substrate and SI/PI knowledge, experience with TSMC/OSAT and managing subcontractors; HFSS/Sigrity familiarity a plus.
Molex: Electronic, electrical, and fiber-optic connectivity systems manufacturer serving automotive, industrial, medical, and data-center customers.
10+ YOEPhD in a related field, 10+ years R&D experience in optoelectronic package design transferred to manufacturing, submicron optical alignment, FEA/thermal design, GR-468 qualification, NPI, and strong supplier/customer communication.
Cspeed IO: A stealth startup developing next-generation optical semiconductor solutions for AI infrastructure.
6+ YOE6+ years IC package physical design experience, BS/MS in electrical engineering, expertise in package layout tools, multi-die packaging, substrate stack-ups, DFM/DF A closure, and English fluency.
Volantis Semiconductor: Private semiconductor startup building photonically integrated computers and photonic interconnects for AI inference and data-center systems.
Experience designing, validating, and bringing up high-power-density, high-layer-count, large-format PCBs, with knowledge of chip-package interactions and design for manufacturing.
CoherentNYSE: COHR: Manufactures lasers, engineered materials, and optical networking components.
2+ YOEBS/MS in telecom/optomechanical engineering, physics or related; minimum 2 years' related experience; SolidWorks and MS Office proficiency; experience with telecom fibers, materials selection, packaging design, testing, and manufacturing transfer.
Cerebras SystemsNasdaq Global Select Market: CBRS: Designs processors and systems for AI training and inference.
10+ YOE10+ years physical design experience; expertise in full-chip physical verification, DRC/LVS resolution with ICV or Calibre, IR/EM analysis, 3D/2.5D packaging and die stacking; scripting with Tcl and Python; familiarity with Synopsys tools.
Lightmatter: Develops photonic processors and interconnects for AI data centers
5+ YOEBachelor’s degree and 5+ years in system mechanical design with product releases. Requires 3D CAD, thermal and structural analysis, electronics packaging, materials, vibration, and communication skills.
SolidWorks, ANSYS, 3D printing, FEA, IcePak, Flotherm, CAD, BOM
Gilead SciencesNASDAQ: GILD: Develops and sells medicines for life-threatening infectious diseases.
10+ YOEBachelor's degree in packaging or engineering plus 10 years of relevant industry experience and cGMP experience. Requires packaging engineering leadership, combination products, design controls, risk management, and regulatory knowledge.
ISO 11607, ISO 14971, FDA, EU MDR, 21 CFR, ASTM, ISTA, Workday
Form Energy: Developing cost-effective, multi-day iron-air battery storage technology.
4+ YOESenior mechanical design engineer with 4+ years experience in high-volume electromechanical systems; strong CAD, thermal/structural analysis, and packaging expertise.
AmazonNASDAQ: AMZN: Multinational technology focused on e-commerce and cloud computing.
9+ YOE9+ years design or packaging program experience; end-to-end packaging development, BOM and POD labeling knowledge; strong cross-functional program management and travel availability.
Bill of Material (BOM), Print On Demand (POD), scrum
Tata Consultancy ServicesBSE: 532540: Global leader in IT services, consulting, and business solutions.
8+ YOERequires a bachelor's or master's degree in mechanical, automotive, or related engineering, automotive product development experience, Catia V6 and PLM proficiency, and expertise in vehicle packaging, integration, validation, and release.
GetInsured: Provides SaaS platforms for health insurance exchanges and government services.
4+ YOE4+ years in UX engineering or design-system front-end roles; proficiency with HTML, CSS (Sass/SCSS), JavaScript/TypeScript, React; experience building design systems, Storybook, tokens and publishing packages; accessibility and CI/CD familiarity.
American Turbines: American Turbines is a private manufacturer of compact modular gas turbines for distributed, rapidly deployable power generation.
Experience designing packaged machinery and mechanical systems for field-deployable gensets/engines; design for manufacture, packaging to released drawings, and focus on footprint, cost, and serviceability.