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117 packaging developer jobs at 64 companies in San Rafael, CA

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Packaging Engineer
San Ramon, California, United States
$84k-$105k/yr HybridFull Time
Rodan + Fields
Rodan + Fields: Develops and sells dermatology-inspired skincare and haircare products.
3+ YOEBachelor's in package or related engineering, 3+ years package development experience, strong technical drawing review, project management, analytical, leadership, and communication skills.
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1mo
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Packaging Engineer II
Foster City, California, United States
$102k-$132k/yr OnsiteFull Time
Gilead Sciences
Gilead SciencesNASDAQ: GILD: Develops and sells medicines for life-threatening infectious diseases.
2+ YOEBachelor's in engineering with 4+ years (or Master's with 2+ years), experience with packaging development, BOM/spec creation, technology transfer, packaging validation, cGMP and regulatory compliance; strong communication and organizational skills.
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2w
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Packaging Engineer
Crockett, California, United States
$71k-$118k/yr OnsiteFull Time
ASR Group
ASR Group: Global refiner and marketer of cane sugar products.
3+ YOE3+ years manufacturing experience, BS/BA in engineering, strong mechanical knowledge, understanding of control systems, ability to troubleshoot packaging equipment, Allen Bradley PLC/Wonderware experience a plus.
Allen Bradley PLC, Wonderware
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Packaging Engineer I
Alameda, California, United States
$75k-$107k/yr HybridFull Time
Exelixis
ExelixisNASDAQ: EXEL: Discovers and commercializes innovative medicines for cancer treatment.
1+ YOEBachelor's or equivalent plus packaging operations experience; experience supporting CMOs, serialization, review/approval of packaging records, MS Office proficiency, strong analytical and communication skills.
Microsoft Office
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Advanced Packaging Engineer
Mountain View, California, United States
$200k-$350k/yr OnsiteFull Time
DensityAI
DensityAI: Designing custom AI hardware accelerators for large language models.
10+ YOE10+ years in advanced multi-die packaging (SiP, CoWoS, EMIB, interposers); expertise in design layout, SI/PI, thermo-mechanical tradeoffs; hands-on with packaging flows for 2.5D/3D; ability to collaborate with architects; DFT/RTL/PD optional.
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Lead Packaging Engineer
Palo Alto or Los Angeles or Boston or Chicago or Sydney
$200k-$260k/yr OnsiteFull Time
Diraq
Diraq: Builds scalable quantum processors using silicon CMOS technology.
Bachelor's in engineering or materials science, significant semiconductor packaging experience, expertise in PCB/substrate and mechanical design, failure analysis, thermal management, and delivering scalable hardware from concept to manufacturing.
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Principal Packaging Engineer
Palo Alto or United States or Canada
$180k-$240k/yr HybridFull Time
Delos Data
Delos Data: Building specialized interconnects and infrastructure optimized for AI inference.
B.S./M.S. in EE or related, expertise in multi-die package design and UCIe, substrate and SI/PI knowledge, experience with TSMC/OSAT and managing subcontractors; HFSS/Sigrity familiarity a plus.
HFSS, Sigrity, UCIe
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2mo
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Sr. Packaging Engineer
Fremont, California, United States
OnsiteFull Time
Nextracker
NextrackerNASDAQ: NXT: Designs and manufactures solar tracking systems for utility-scale power plants.
8+ YOEBachelor's in Packaging/Mechanical/Industrial Engineering or related; 8–12+ years in industrial packaging; experience with returnable packaging, data analysis, CAD; Power BI proficiency; cross-functional collaboration; travel willingness.
Power BI, Excel, SolidWorks, CATIA
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2mo
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Senior, Packaging Design Engineer
Sunnyvale, California, United States
$163k-$199k/yr OnsiteFull Time
Intuitive
IntuitiveNASDAQ: ISRG: Robotic-assisted systems for minimally invasive surgery.
8+ YOE8+ years in medical device packaging design; BS in Packaging/Mechanical/Industrial Engineering; experience with thermoforming, pouch sealing, ISO11607, CFR 820; CAD (SolidWorks); travel; strong communication.
SolidWorks, FEA, Packaging testing tools, MS Office
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2w
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Senior IC Packaging Engineer
Hillsboro or Redmond or Mountain View or Raleigh or Austin
$120k-$235k/yr HybridFull Time
Microsoft
MicrosoftNASDAQ: MSFT: Develops software, services, devices, and cloud computing solutions.
1+ YOEAdvanced IC packaging expertise with experience in 2.5D/3D packaging, substrate/interposer design, supplier management, reliability assessment, and EDA/PCB layout tools; advanced degree or equivalent experience required.
Cadence Allegro
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2mo
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Packaging Design Engineer I
San Jose or Hayward or Texas
OnsiteFull Time
TransPak: Packaging solutions provider
2+ YOEBachelor’s in mechanical/manufacturing/industrial/packaging engineering; 2-3 years mechanical/structural design experience; CAD (SolidWorks/AutoCAD); GD&T knowledge; packaging design and testing experience; strong communication.
SolidWorks, AutoCAD, NX, BOM, 3D modeling, 2D drawings, GD&T
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3mo
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IC Packaging Engineer, Materials and Packaging Characterization
United States or San Francisco
OnsiteFull Time
Apple
AppleNASDAQ: AAPL: Designs and sells consumer electronics, software, and online services.
10+ YOEBS and 10+ years in materials characterization/experimental mechanics; strong experience in experimental mechanics, material characterization, test equipment setup, SEM/EDX/FIB, MATLAB/Python, and packaging materials reliability.
SEM, EDX, FIB, CSAM, MATLAB, Python, Gen-AI, Machine Learning
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1w
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Senior IC Packaging Engineer
Sunnyvale, California, United States
OnsiteFull Time
Avicena
Avicena: Develops microLED optical interconnects for high-speed chip-to-chip communication.
5+ YOEMS/PhD in engineering or materials science,5+ years semiconductor packaging experience with TSV reveal and C4 bumping,DOE/SPC and metrology expertise,experience with OSATs and HVM ramping.
CD-SEM, profilometry, XRF, AOI, AFM, SEM
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Advanced Packaging Reliability Engineer
San Francisco, California, United States
$266k-$445k/yr HybridFull Time
OpenAI
OpenAI: Develops artificial intelligence models and generative AI software services.
8+ YOE8+ years semiconductor package reliability experience; expertise in thermo-mechanical modeling, failure analysis, electromigration, reliability test plans, root-cause analysis, and corrective actions. MS/PhD preferred.
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3mo
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IC Packaging Manager
San Diego or San Francisco or Renton or Seattle
$231k-$323k/yr OnsiteFull Time
Blue Origin: Develops reusable rockets and systems for human spaceflight.
12+ YOELead IC packaging team; manage end-to-end package development for RF/mmWave AiP and complex SoCs; perform EM, SI, and thermal simulations; collaborate with IC designers and OSATs.
HFSS, EMX, Momentum, Cadence Allegro APD
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2w
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Senior Fiber Optic Module Packaging Engineer
Sunnyvale, California, United States
$92k-$150k/yr OnsiteFull Time
Coherent
CoherentNYSE: COHR: Manufactures lasers, engineered materials, and optical networking components.
2+ YOEBS/MS in telecom/optomechanical engineering, physics or related; minimum 2 years' related experience; SolidWorks and MS Office proficiency; experience with telecom fibers, materials selection, packaging design, testing, and manufacturing transfer.
SolidWorks, Word, Excel, Outlook, PowerPoint
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4w
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R&D Packaging Scientist 1 (Recent Grad Starting in 2026)
Pleasanton, California, United States
HybridFull Time
Clorox
CloroxNew York Stock Exchange: CLX: Manufactures and markets consumer cleaning and wellness products.
Recent graduate (Dec 2025–Aug 2026) with a 3.0+ GPA in packaging, materials, or mechanical engineering; knowledge of ASTM testing; experience with ArtiosCAD and TOPS; able to work in a lab and prototype samples.
ArtiosCAD, TOPS
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1mo
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Staff Software Engineer, Pricing and Packaging Engineering
San Francisco or Denver or New York City or San Jose
$197k-$247k/yr HybridFull Time
Gusto
Gusto: Cloud-based payroll and HR software for small businesses.
8+ YOE8+ years building large-scale backend platform systems (commerce/billing/subscriptions preferred); strong distributed systems, API design, SLO, and mentorship experience; proven delivery of multi-quarter projects.
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3mo
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Engineer II, Manufacturing Engineering
Fremont, California, United States
$79k-$106k/yr OnsiteFull Time
Thermo Fisher Scientific
Thermo Fisher ScientificNYSE: TMO: Sells equipment and chemicals for scientific research and healthcare.
2+ YOEB.S. in engineering with 2-5 years of experience; GMP exposure; labeling/packaging equipment knowledge; PLC/HMI programming and design software useful; must be legally authorized to work in the U.S. without sponsorship.
Zebra printers, CIvision systems, Packaging equipment, Labeling equipment
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2w
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Associate Package Development Engineer
San Francisco, California, United States
$35-$43/hr HybridFull Time
LVMH
LVMHEuronext Paris: MC: A diversified luxury conglomerate managing fashion, spirits, and beauty brands.
1+ YOEB.S. in Packaging Engineering or related, 1+ year packaging/manufacturing experience, knowledge of secondary components, printing/color matching, package testing, technical drawings and project timeline management.
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