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75 packaging engineer jobs at 38 companies in Gilbert, AZ

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Packaging Process Engineer – Microdisplay
Chandler, Arizona, United States
$142k-$214k/yr OnsiteFull Time
Snap
SnapNYSE: SNAP: Develops social media applications and augmented reality technology.
7+ YOEBS in Electrical, Materials, or Mechanical Engineering; 7+ years in process or packaging engineering; experience with automated packaging equipment and semiconductor/display production; travel up to ~10%
Automated packaging equipment, DOE, SPC, ISO 5 cleanroom
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Packaging Process Engineer – Microdisplay
Chandler, Arizona, United States
$135k-$203k/yr OnsiteFull Time
Snap
SnapNYSE: SNAP: Provides visual messaging software and augmented reality wearable devices.
7+ YOEBS in engineering; 7+ years in process/packaging in microfabrication; experience with automated packaging equipment; ISO 5 cleanroom experience; travel up to 10%; proficiency with DOE/SPC.
Automated packaging equipment, DOE, SPC, ISO 5 cleanroom, Six Sigma
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5d
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Advanced Packaging Design Engineer
Santa Clara or Chandler
$192k-$287k/yr OnsiteFull Time
Marvell
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
5+ YOEBS/MS/PhD in engineering,5-10 years advanced packaging design experience, expertise with Cadence APD, high-speed interfaces, substrate and assembly processes, and cross-functional collaboration.
Cadence APD, AutoCAD
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2mo
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Packaging Module Development Engineer
Phoenix, Arizona, United States
$115k-$220k/yr OnsiteFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
3+ YOEMaster's degree in Mechanical, Materials, Electrical Engineering, Physics/Applied Physics or related; 3+ years experience or PhD; programming (Python, MATLAB); AI/ML; semiconductor packaging experience; onsite presence.
Python, MATLAB, Artificial Intelligence, Machine Learning
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4d
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Technical Packaging Manager
Waddell or South Carolina
$97k-$121k/yr OnsiteFull Time
Mark Anthony Group
Mark Anthony Group: Produces and distributes alcoholic beverages and ready-to-drink products.
5+ YOEBS degree, 5+ years packaging operations management in high-speed environments, IBD packaging certification, beverage packaging expertise, SPC, root cause analysis, Power BI, capital project and cross-functional leadership skills.
Power BI, SPC
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2w
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Sr. Package Layout Engineer, Annapurna Labs - AI Silicon Packaging
Tempe or Austin or Cupertino
$159k-$248k/yr OnsiteFull Time
Amazon
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
10+ YOEBachelor's in EE or related, 10+ years IC package layout and physical design experience, expertise with advanced packaging (2.5D/3D, WLP, RDL, TSV), package DRC/DFM, and collaboration with SI/PI and manufacturing teams.
Cadence APD/SiP, Synopsys IC Packaging, Mentor Xpedition, Python, TCL, Skill, Ravel
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4w
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Principal Engineer, Electrical Engineering – Advanced Packaging
Phoenix, Arizona, United States
OnsiteFull Time
ASM
ASMEuronext Amsterdam: ASM: Designs and manufactures advanced semiconductor wafer processing equipment.
10+ YOEBachelor's degree in Electrical Engineering, 10+ years in semiconductor capital equipment, expertise in RF/motion/power/safety systems, knowledge of SEMI/CE/UL/EMC, experience with requirements management and FMEA, proven technical leadership.
PLC, DFMEA, FMEA
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1mo
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ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)
San Jose or Research Triangle Park or Acton or Dallas or Tempe or Cary or Carlsbad or Colorado Springs
$184k-$264k/yr RemoteFull Time
Cisco
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
3+ YOEBachelor's/MS/PhD in Electrical Engineering with 3+ to 8+ years SI/PI experience; expertise in high-speed design, SI/PI simulation, layout review, SPICE; mentoring and leadership experience.
Cadence Sigrity, Ansys HFSS, Keysight ADS, Cadence APD, Ansys EM, SPICE, Vector Network Analysis, IBIS
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2mo
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Principal Engineer
Scottsdale, Arizona, United States
OnsiteFull Time
onsemi: Designs and manufactures semiconductor solutions for power and sensing.
Masters in Electrical Engineering with semiconductor device physics; TCAD and device simulation; 3D EM/analog RF tools; BJT/SCR/diode measurements; flip-chip/wire-bond packaging knowledge; strong communication and leadership.
TCAD, 3D EM simulation tools, Analog/RF circuit analysis tools, Device measurement tools
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3w
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Engineer, Design (29020)
Tempe, Arizona, United States
HybridFull Time
Amkor Technology
Amkor TechnologyNasdaq: AMKR: Provides outsourced semiconductor packaging and test services globally.
Bachelor's in engineering required. Experience creating IC package designs and engineering drawings using CAD; strong communication, self-motivation, and ability to work with minimal supervision. Must be a U.S. Person for export-controlled information.
CAD, Cadence APD, Cadence Sigrity, Siemens Expedition, Ansys HFSS, CAM350
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2d
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Principal Package Design Engineer
Tempe, Arizona, United States
HybridFull Time
Renesas Electronics
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
10+ YOE10+ years semiconductor package development experience with hermetic/ceramic/metal/radiation-tolerant/Class P plastic packages; AutoCAD and Microsoft Office proficiency; familiarity with MIL standards; strong communication and collaboration skills.
AutoCAD, Microsoft Excel, Microsoft PowerPoint, Microsoft Word
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2w
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Senior Mechanical Engineer
Goodyear, Arizona, United States
$100k-$130k/yr OnsiteFull Time
fairlife
fairlifeNYSE: KO: Produces nutrient-dense and ultra-filtered dairy products and shakes.
Bachelor's in Mechanical Engineering, experience in high-speed manufacturing/dairy processing and packaging, familiarity with CI/Lean/GMP/5S, ability to lift 50 lbs, lead capital projects, perform BDA/RCA, and maintain machine documentation.
D365
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1mo
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Mechanical Design Engineer
Carlsbad or Tempe
$121k-$190k/yr OnsiteFull Time
Viasat
ViasatNASDAQ: VSAT: Provider of global satellite-based connectivity and secure communication solutions.
7+ YOE7+ years mechanical design engineering experience with electronics packaging and ruggedized products; SolidWorks and thermal analysis (Ansys, Thermal Desktop, SolidWorks Flow Sim) proficiency; BS in Mechanical Engineering or equivalent; U.S. Citizenship and active Secret clearance; up to 10% travel.
SolidWorks, Ansys, Thermal Desktop, SolidWorks Flow Sim, Microsoft Word, Microsoft Excel, Microsoft PowerPoint
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Package Development/NPI Engineer
San Jose or Chandler
$180k-$301k/yr OnsiteFull Time
MediaTek
MediaTekTaiwan Stock Exchange: 2454: Designs and develops system-on-chip solutions for electronic devices.
8+ YOE8+ years in package development and NPI for semiconductors; expertise in advanced packaging (EMIB, 2.5D/3D/3.5D, FCBGA, HBM); qualification, reliability, failure analysis, yield improvement, and cross-functional project management.
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3w
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Mechanical Permit Engineer (TSMC Project)
Phoenix, Arizona, United States
HybridFull Time
Marketech International
Marketech InternationalTaiwan Stock Exchange: 6196: Provides turnkey facility integration and engineering for semiconductor plants.
2+ YOE2+ years in mechanical engineering, permitting, construction coordination or related field; experience with mechanical drawings, permit packages, AHJ coordination, and familiarity with building/mechanical codes; strong organization and communication.
AutoCAD, Bluebeam, Revit
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3w
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Senior Electrical Engineer 2 - Nuclear
Phoenix, Arizona, United States
$100k-$153k/yr HybridFull Time
Sargent & Lundy
Sargent & Lundy: Engineering and consulting services for the power industry.
8+ YOEABET-accredited BS in Electrical Engineering; minimum 8 years electrical design experience (nuclear power plant experience preferred); experience with LV/MV systems, design change packages, calculations, vendor interfacing; ability to be badged for unescorted nuclear access; PE and MS preferred.
Python, MATLAB, Microsoft Excel
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1d
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Process Engineer II
Tempe, Arizona, United States
$84k-$126k/yr HybridFull Time
Medtronic
MedtronicNew York Stock Exchange: MDT: Develops and manufactures medical devices and digital health solutions.
2+ YOEBachelors (2+ yrs) or Masters (0+ yrs). Experience in microelectronics packaging, DOE/SPC, process validation, and equipment troubleshooting. Familiarity with statistical analysis and high-volume manufacturing.
Minitab, JMP, DRM, DFSS, Lean Sigma
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Process Engineer II
Tempe, Arizona, United States
$84k-$126k/yr OnsiteFull Time
Medtronic
MedtronicNYSE: MDT: Developing and manufacturing medical technologies and therapies globally.
2+ YOEBachelor's with 2+ years (or Master's with 0+ years). Experience in microelectronics packaging, DOE/SPC, statistical analysis, process validation, equipment qualification, and strong problem-solving skills.
DRM, DFSS, Minitab, JMP
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Senior Substrate Layout Engineer
Phoenix or Andover
OnsiteFull Time
Mercury Systems
Mercury SystemsNASDAQ: MRCY: Provides secure processing solutions for aerospace and defense missions.
4+ YOEBachelor's in electrical/electronics engineering, 4+ years HDI package/layout experience, proficiency with Cadence APD+ and Constraint Manager, CAM350/Blueprint, knowledge of HDI/flip‑chip/interposer designs and JEDEC/IPC standards; must have or obtain U.S. government security clearance.
Cadence APD+, Cadence Constraint Manager, CAM350, Blueprint, Ansys, Sigrity, Clarity
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3w
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Facilities Engineer II
Scottsdale, Arizona, United States
$61k-$123k/yr OnsiteFull Time
Abbott
AbbottNYSE: ABT: Manufactures medical devices, diagnostics, and nutritional health products.
1+ YOEAssociates degree, 1+ years facilities experience (3+ preferred), AutoCAD proficiency, ability to plan/design layouts, estimate costs, prepare bid packages, and lead small-to-mid facility projects.
AutoCAD
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