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82 packaging engineer jobs at 37 companies in Scottsdale, AZ

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Senior Medical Packaging Engineer
Tempe, Arizona, United States
$78k-$130k/yr HybridFull Time
Stryker
StrykerNYSE: SYK: Manufactures medical devices and equipment for healthcare providers.
2+ YOEDesign and test sterile packaging for medical devices; packaging validation; cross-functional collaboration; 2+ years in regulated packaging environment.
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3d
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Packaging Module Development Engineer
Phoenix, Arizona, United States
$134k-$189k/yr OnsiteFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
0.5+ YOEPhD in engineering, physics, chemistry, or related STEM field; 6+ months' experience with SPC, DOE, and process development or characterization in packaging or manufacturing.
Statistical Process Control (SPC), Design of Experiments (DOE)
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3w
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Advanced Packaging Design Engineer
Santa Clara or Chandler
$192k-$287k/yr OnsiteFull Time
Marvell
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
5+ YOEBS/MS/PhD in engineering,5-10 years advanced packaging design experience, expertise with Cadence APD, high-speed interfaces, substrate and assembly processes, and cross-functional collaboration.
Cadence APD, AutoCAD
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Technical Packaging Manager
Waddell or South Carolina
$97k-$121k/yr OnsiteFull Time
Mark Anthony Group
Mark Anthony Group: Produces and distributes alcoholic beverages and ready-to-drink products.
5+ YOEBS degree, 5+ years packaging operations management in high-speed environments, IBD packaging certification, beverage packaging expertise, SPC, root cause analysis, Power BI, capital project and cross-functional leadership skills.
Power BI, SPC
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Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging
Tempe or Austin or Cupertino
$136k-$213k/yr OnsiteFull Time
Amazon
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
5+ YOEBachelor's degree in electrical engineering or related field and 5+ years of IC package layout and physical design experience. Requires package layout tools, advanced packaging, DFM, and physical verification expertise.
Cadence APD/SiP, Synopsys IC Packaging, Mentor Xpedition, Python, Perl, ARM, TCL, Skill, Ravel, DRC
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Principal Engineer, Electrical Engineering – Advanced Packaging
Phoenix, Arizona, United States
OnsiteFull Time
ASM International
ASM InternationalEuronext Amsterdam: ASM: Provides wafer processing equipment for semiconductor device manufacturing.
10+ YOEBachelor’s or master’s degree in electrical engineering or related field, 10+ years in semiconductor capital equipment, expertise in RF, motion control, power distribution, or safety systems, and technical leadership.
RF, PLC, SEMI, EMC, EMI, CE, UL, FMEA, DFMEA
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Principal Engineer, Electrical Engineering – Advanced Packaging
Phoenix, Arizona, United States
OnsiteFull Time
ASM
ASMEuronext Amsterdam: ASM: Designs and manufactures advanced semiconductor wafer processing equipment.
10+ YOEBachelor's degree in Electrical Engineering, 10+ years in semiconductor capital equipment, expertise in RF/motion/power/safety systems, knowledge of SEMI/CE/UL/EMC, experience with requirements management and FMEA, proven technical leadership.
PLC, DFMEA, FMEA
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ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)
San Jose or Research Triangle Park or Acton or Dallas or Tempe or Cary or Carlsbad or Colorado Springs
$184k-$264k/yr RemoteFull Time
Cisco
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
3+ YOEBachelor's/MS/PhD in Electrical Engineering with 3+ to 8+ years SI/PI experience; expertise in high-speed design, SI/PI simulation, layout review, SPICE; mentoring and leadership experience.
Cadence Sigrity, Ansys HFSS, Keysight ADS, Cadence APD, Ansys EM, SPICE, Vector Network Analysis, IBIS
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Senior Design Lead (122083)
Chandler or Hillsboro
OnsiteContract
HCLTech
HCLTechNational Stock Exchange of India: HCLTECH: Global provider of information technology services and software consulting.
10+ YOEBachelor's or Master's in Electrical/Electronics Engineering; ~10+ years IC packaging/package design for senior level (4–6+ years mid); hands-on experience with Siemens (Mentor) Xpedition or Cadence Allegro/APD, physical/substrate design, SI/PI-aware design, DFM and design rule compliance.
Siemens (Mentor) Xpedition (XPD), Cadence Allegro, Advanced Package Designer (APD / SiP)
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Advanced Packaging Principal Integration Technologist
Tempe, Arizona, United States
$179k-$288k/yr OnsiteFull Time
Merck KGaA
Merck KGaAFrankfurt Stock Exchange: MRK: Develops pharmaceutical, life science, and electronics technologies.
10+ YOEMSc or higher in engineering; 10+ years of hands-on 300mm process/equipment R&D and advanced packaging experience; 7+ years of external business development involving SOW, POC, and DOE work.
Wafer Level Packaging, Hybrid Bonding, Fusion bonding, 300mm, Dep, CMP, DOE
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Sr Staff Package Design Engineer
Tempe, Arizona, United States
OnsiteFull Time
Renesas Electronics
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
10+ YOE10+ years experience in package development for power SiP/module, wafer-level and flip-chip LGA packaging; strong analytical, communication, and process integration skills.
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Senior Mechanical Engineer
Goodyear, Arizona, United States
$100k-$130k/yr OnsiteFull Time
fairlife
fairlifeNYSE: KO: Produces nutrient-dense and ultra-filtered dairy products and shakes.
Bachelor's in Mechanical Engineering, experience in high-speed manufacturing/dairy processing and packaging, familiarity with CI/Lean/GMP/5S, ability to lift 50 lbs, lead capital projects, perform BDA/RCA, and maintain machine documentation.
D365
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Package Development/NPI Engineer
San Jose or Chandler
$180k-$301k/yr OnsiteFull Time
MediaTek
MediaTekTaiwan Stock Exchange: 2454: Designs and develops system-on-chip solutions for electronic devices.
8+ YOE8+ years in package development and NPI for semiconductors; expertise in advanced packaging (EMIB, 2.5D/3D/3.5D, FCBGA, HBM); qualification, reliability, failure analysis, yield improvement, and cross-functional project management.
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SOC Design Engineer
Chandler or Cambridge
$198k-$268k/yr HybridFull Time
Arm
ArmNASDAQ: ARM: Designs and licenses processor architectures and semiconductor intellectual property.
Experienced electronics engineer with PCB and silicon package co-design expertise, high-speed design, SI/PI analysis, PCB fabrication, EDA tools, and embedded compute systems knowledge.
PCIe, LPDDR, PTH, HDI, VIA, Cadence OrCAD, Cadence Allegro, ANSYS, Siemens EDA
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Mechanical Permit Engineer (TSMC Project)
Phoenix, Arizona, United States
HybridFull Time
Marketech International
Marketech InternationalTaiwan Stock Exchange: 6196: Provides turnkey facility integration and engineering for semiconductor plants.
2+ YOE2+ years in mechanical engineering, permitting, construction coordination or related field; experience with mechanical drawings, permit packages, AHJ coordination, and familiarity with building/mechanical codes; strong organization and communication.
AutoCAD, Bluebeam, Revit
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Senior Electrical Engineer 2 - Nuclear
Phoenix, Arizona, United States
$100k-$153k/yr HybridFull Time
Sargent & Lundy
Sargent & Lundy: Engineering and consulting services for the power industry.
8+ YOEABET-accredited BS in Electrical Engineering; minimum 8 years electrical design experience (nuclear power plant experience preferred); experience with LV/MV systems, design change packages, calculations, vendor interfacing; ability to be badged for unescorted nuclear access; PE and MS preferred.
Python, MATLAB, Microsoft Excel
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Senior Substrate Layout Engineer
Phoenix or Andover
OnsiteFull Time
Mercury Systems
Mercury SystemsNASDAQ: MRCY: Provides secure processing solutions for aerospace and defense missions.
4+ YOEBachelor's in electrical/electronics engineering, 4+ years HDI package/layout experience, proficiency with Cadence APD+ and Constraint Manager, CAM350/Blueprint, knowledge of HDI/flip‑chip/interposer designs and JEDEC/IPC standards; must have or obtain U.S. government security clearance.
Cadence APD+, Cadence Constraint Manager, CAM350, Blueprint, Ansys, Sigrity, Clarity
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Facilities Engineer II
Scottsdale, Arizona, United States
$61k-$123k/yr OnsiteFull Time
Abbott
AbbottNYSE: ABT: Manufactures medical devices, diagnostics, and nutritional health products.
1+ YOEAssociates degree, 1+ years facilities experience (3+ preferred), AutoCAD proficiency, ability to plan/design layouts, estimate costs, prepare bid packages, and lead small-to-mid facility projects.
AutoCAD
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Resident Operational Engineer - Phoenix
Chicago or Phoenix
$75k-$90k/yr OnsiteFull Time
E80 Group
E80 Group: Provides automated intralogistics solutions and robotic systems for factories
3+ YOE3+ years in material handling/robotics or packaging equipment; hands-on technical experience with PLC/LGV/EM systems; familiarity with SAP ERP, Sales Force, Microsoft Office 365/Power Platform; bachelor's degree preferred.
SM.I.LE80, PLC, LGV, EM, Sales Force, SAP ERP, Microsoft Office 365, Microsoft Power Platform
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Infrastructure Engineer - Elasticsearch (ELK) Team
Pittsburgh or Phoenix or Lakewood or Birmingham or Strongsville or Farmers Branch
$86k-$173k/yr OnsiteFull Time
PNC Financial Services
PNC Financial ServicesNYSE: PNC: Provides banking, lending, and investment services to customers.
3+ YOEExperience with Elasticsearch, Linux administration, Ansible, Git, shell or Python scripting, package management, monitoring/logging, and production support; typically 3+ years industry experience; bachelor's degree preferred.
Elasticsearch, Linux, Ansible, GIT, Python, Shell Scripting
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