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131 packaging developer jobs at 41 companies in Salinas, CA

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Sr Packaging Engineer
Santa Clara, California, United States
$134k-$184k/yr OnsiteFull Time
Applied Materials
Applied MaterialsNASDAQ: AMAT: Manufacturers of equipment for semiconductor and display production.
Experience in packaging engineering including supplier management, test plan development and lab testing, Design for Transportability (DFT), packaging standards, continuous improvement, and ability to lead projects.
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1mo
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Sr Packaging Engineer
Santa Clara, California, United States
$134k-$184k/yr OnsiteFull Time
Applied Materials
Applied MaterialsNASDAQ: AMAT: Produces equipment and services for chip and display manufacturing.
Packaging engineering experience with supplier management, test plan development, Design For Transportability (DFT), standards development, continuous improvement, and ability to train others; travel ~10%.
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1mo
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Advanced Packaging Engineer
San Diego or Vista or Santa Clara or Colorado Springs
$159k-$250k/yr OnsiteFull Time
Samtec
Samtec: Manufactures electronic connectors, cables, and optical interconnect solutions.
15+ YOE15+ years in optical/optoelectronic or advanced microelectronics development; BS in engineering required (MS/PhD preferred); expertise in materials, packaging architectures, process development, technology maturation, and technical leadership.
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1mo
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Advanced Packaging Engineer
San Diego or Vista or Santa Clara or Colorado Springs
$187k-$212k/yr OnsiteFull Time
Samtec
Samtec: Manufacturer of high-speed electronic connectors and cable assemblies.
15+ YOESenior individual contributor with 15+ years in optical/optoelectronic or microelectronics development; BS in engineering required (MS/PhD preferred); expertise in materials, packaging architectures, process development, characterization, and technical leadership.
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1mo
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Memory Packaging Engineer
San Jose or San Diego
$180k-$272k/yr OnsiteFull Time
MediaTek
MediaTekTaiwan Stock Exchange: 2454: Designs and develops system-on-chip solutions for electronic devices.
8+ YOELead memory packaging development for 2.5D/3D and HBM/IPM solutions; supply chain and partner management; failure analysis and product integration to mass production.
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1mo
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Advanced Packaging Engineer
San Diego or Santa Clara or Colorado Springs
$159k-$250k/yr OnsiteFull Time
Samtec
Samtec: Manufactures electronic connectors and high-speed cable assembly systems.
15+ YOEBS in engineering required; MS/PhD preferred. 15+ years in optical/optoelectronic or advanced microelectronics development with materials and packaging architecture expertise; technical leadership and R&D experience.
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1mo
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Staff Semi Packaging Engineer
San Jose, California, United States
$130k-$188k/yr OnsiteFull Time
Analog Devices
Analog DevicesNASDAQ: ADI: Designs and manufactures semiconductors for signal processing and power management.
3+ YOEMaster's in a relevant engineering field + ≥3 years industrial IC/package experience; expertise in analog IC package/module design, reliability and BOM selection, CAD modeling, and process development (FMEA, SPC, DOE); OSAT collaboration experience.
CAD
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3mo
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Memory Packaging Engineer
Santa Clara or United States
OnsiteFull Time
Apple
AppleNASDAQ: AAPL: Designs and sells consumer electronics, software, and online services.
10+ YOEBS and 10+ years of relevant industry experience; MS/PhD preferred with 10+ years in memory packaging design and assembly.
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2w
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Senior IC Packaging Development Engineer
Santa Clara, California, United States
$168k-$345k/yr OnsiteFull Time
NVIDIA
NVIDIANASDAQ: NVDA: Designs graphics processing units and artificial intelligence hardware.
12+ YOE12+ years IC packaging development/NPI experience; degree in materials/mechanical/electrical/physics or equivalent; deep packaging expertise; familiarity with FA tooling and EDA/FEM tools.
Cadence Allegro Package Designer, ANSYS, ABAQUS, SEM, EDX, CSAM, X-Ray, LIT, Electronic Design Automation (EDA)
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2mo
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Packaging Design Engineer I
San Jose or Hayward or Texas
OnsiteFull Time
TransPak: Packaging solutions provider
2+ YOEBachelor’s in mechanical/manufacturing/industrial/packaging engineering; 2-3 years mechanical/structural design experience; CAD (SolidWorks/AutoCAD); GD&T knowledge; packaging design and testing experience; strong communication.
SolidWorks, AutoCAD, NX, BOM, 3D modeling, 2D drawings, GD&T
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2d
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Principal Packaging Engineer, Optical Interfaces
Santa Clara, California, United States
$145k-$255k/yr OnsiteFull Time
nEye Systems
nEye Systems: Develops MEMS-based silicon photonics optical circuit switches for data centers.
10+ YOE10+ years packaging design experience for optical/photonic components, experience with PIC edge coupling, reliability engineering, CAD and FEA usage, and working with contract manufacturers.
CAD, FEA
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Flexible Packaging Engineer - Destiny Packaging |Salinas, CA
Salinas, California, United States
$75k-$80k/yr HybridFull Time
Bunzl
BunzlLondon Stock Exchange: BNZL: Global distributor of essential non-food consumables and services.
Knowledge of flexible packaging films and structures, Excel and presentation skills, ability to support sales and customers, bachelor's degree preferred, travel as needed; 2 years field experience preferred.
Microsoft PowerPoint, Keynote, Microsoft Excel
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2mo
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Senior IC Packaging Engineer
San Jose, California, United States
OnsiteFull Time
Axiado
Axiado: Creates AI-driven security processors for data center infrastructure.
10+ YOESenior IC Packaging Engineer with 10+ years in IC packaging, expertise in FC BGA, SiP, RDL, and chiplet architectures, and leadership in packaging programs.
Cadence Allegro Package Designer (APD), HFSS, SIwave, Ansys Designer, Flip-Chip BGA, SiP, RDL, UCIe, PCIe, LPDDR5, LPDDR5X
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19h
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Integrated Circuit Packaging Architect Engineer
San Jose, California, United States
$183k-$314k/yr HybridFull Time
AMD
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Proven semiconductor technology development and leadership experience in package architecture, process definition, DFM/DFY, and yield improvement; strong communication skills; BS/MS/PhD in related fields.
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2mo
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Photonic Packaging Engineer, Principal
San Jose, California, United States
OnsiteFull Time
Astera Labs
Astera LabsNASDAQ: ALAB: Designs connectivity solutions for cloud and AI infrastructure.
10+ YOEPh.D. or M.S. in EE, Physics, Materials Science, Mechanical Engineering, or related field; 10+ years in photonic packaging or related areas; strong expertise in high-speed packaging, thermal management, and optomechanical design.
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2mo
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Staff Packaging Engineer: Surgical Robotics – OTTAVA
Santa Clara, California, United States
$118k-$204k/yr OnsiteFull Time
Johnson & Johnson
Johnson & JohnsonNYSE: JNJ: Global healthcare providing pharmaceuticals and medical technologies.
6+ YOEBachelor's degree, 6+ years packaging engineering experience with large capital systems, proficiency with SolidWorks and PLM, knowledge of ASTM/ISTA/ISO testing and medical device regulatory requirements.
SolidWorks, PLM
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3mo
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Staff Packaging Engineer: Surgical Robotics – OTTAVA
Santa Clara, California, United States
$118k-$204k/yr OnsiteFull Time
Johnson & Johnson
Johnson & JohnsonNYSE: JNJ: Provides pharmaceutical products and medical technology healthcare solutions.
6+ YOESix years of packaging engineering experience; CAD/PLM proficiency; knowledge of FDA/QSR and ISO standards; experience with packaging validation and testing for medical devices.
SolidWorks, PLM, CAD
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3mo
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Staff Packaging Engineer: Surgical Robotics – OTTAVA
Santa Clara, California, United States
$118k-$204k/yr OnsiteFull Time
Johnson & Johnson
Johnson & JohnsonNYSE: JNJ: Develops and manufactures pharmaceutical drugs and medical devices.
6+ YOEMinimum 6 years in packaging engineering; hands-on packaging for capital systems; CAD/PLM experience; FDA QSR ISO 13485/14971 knowledge; on-site in Santa Clara, CA; up to 20% travel.
CAD (SolidWorks), PLM
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1w
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Advanced Packaging Design Engineer
Santa Clara or Chandler
$192k-$287k/yr OnsiteFull Time
Marvell
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
5+ YOEBS/MS/PhD in engineering,5-10 years advanced packaging design experience, expertise with Cadence APD, high-speed interfaces, substrate and assembly processes, and cross-functional collaboration.
Cadence APD, AutoCAD
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2w
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Senior IC Packaging Development Engineer
Santa Clara, California, United States
$168k-$345k/yr OnsiteFull Time
NVIDIA
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
12+ YOEBS/MS/PhD in Materials Science, Mechanical, Electrical, Physics or related; 12+ years IC packaging/NPI experience; knowledge of flip-chip, 2.5D/3D, wire bonding; FA and prototyping experience.
Cadence Allegro Package Designer, ANSYS, ABAQUS, SEM, EDX, CSAM, X-Ray, LIT
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